EE PLD, 15ns, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20
| Parameter Name | Attribute value |
| Maker | Integrated Circuit Systems(IDT ) |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| maximum clock frequency | 41.6 MHz |
| JESD-30 code | R-PDIP-T20 |
| length | 26.162 mm |
| Dedicated input times | 9 |
| Number of I/O lines | 8 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 9 DEDICATED INPUTS, 8 I/O |
| Output function | MACROCELL |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Programmable logic type | EE PLD |
| propagation delay | 15 ns |
| Certification status | Not Qualified |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| PEEL16CV8P-15 | PEEL16CV8J-15 | PEEL16CV8S-15 | PEEL16CV8T-15 | |
|---|---|---|---|---|
| Description | EE PLD, 15ns, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | EE PLD, 15ns, CMOS, PQCC20, PLASTIC, LCC-20 | EE PLD, 15ns, CMOS, PDSO20, SOIC-20 | EE PLD, 15ns, CMOS, PDSO20, TSSOP-20 |
| Maker | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) |
| Parts packaging code | DIP | QLCC | SOIC | TSSOP |
| package instruction | DIP, | QCCJ, | SOP, | TSSOP, |
| Contacts | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| maximum clock frequency | 41.6 MHz | 41.6 MHz | 41.6 MHz | 41.6 MHz |
| JESD-30 code | R-PDIP-T20 | S-PQCC-J20 | R-PDSO-G20 | R-PDSO-G20 |
| length | 26.162 mm | 8.9662 mm | 12.8 mm | 6.5 mm |
| Dedicated input times | 9 | 9 | 9 | 9 |
| Number of I/O lines | 8 | 8 | 8 | 8 |
| Number of terminals | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 9 DEDICATED INPUTS, 8 I/O | 9 DEDICATED INPUTS, 8 I/O | 9 DEDICATED INPUTS, 8 I/O | 9 DEDICATED INPUTS, 8 I/O |
| Output function | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QCCJ | SOP | TSSOP |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Programmable logic type | EE PLD | EE PLD | EE PLD | EE PLD |
| propagation delay | 15 ns | 15 ns | 15 ns | 15 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | J BEND | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 0.65 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL |
| width | 7.62 mm | 8.9662 mm | 7.5 mm | 4.4 mm |
| Maximum seat height | - | 4.369 mm | 2.65 mm | 1.2 mm |