EEWORLDEEWORLDEEWORLD

Part Number

Search

IDT72T51243L6BBI

Description
FIFO, 64KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Categorystorage    storage   
File Size515KB,55 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT72T51243L6BBI Overview

FIFO, 64KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

IDT72T51243L6BBI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instruction17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Contacts256
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time3.7 ns
period time6 ns
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
memory density1179648 bit
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals256
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX18
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height3.5 mm
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width17 mm
Base Number Matches1
ADVANCE INFORMATION
2.5V MULTI-QUEUE FLOW-CONTROL DEVICES
(4 QUEUES) 18 BIT WIDE CONFIGURATION
589,824 bits, 1,179,648 bits and 2,359,296 bits
IDT72T51233
IDT72T51243
IDT72T51253
FEATURES:
Choose from among the following memory density options:
IDT72T51233
Total Available Memory = 589,824 bits
IDT72T51243
Total Available Memory = 1,179,648 bits
IDT72T51253
Total Available Memory = 2,359,296 bits
Configurable from 1 to 4 Queues
Queues may be configured at master reset from the pool of
Total Available Memory in blocks of 512 x 18 or 1,024 x 9
Independent Read and Write access per queue
User programmable via serial port
User selectable I/O: 2.5V LVTTL, 1.5V HSTL, 1.8V eHSTL
Default multi-queue device configurations
-IDT72T51233: 8,192 x 18 x 4Q
-IDT72T51243: 16,384 x 18 x 4Q
-IDT72T51253: 32,768 x 18 x 4Q
100% Bus Utilization, Read and Write on every clock cycle
200 MHz High speed operation (5ns cycle time)
3.6ns access time
Echo Read Enable & Echo Read Clock Outputs
Individual, Active queue flags (OV,
FF, PAE, PAF)
4 bit parallel flag status on both read and write ports
Provides continuous
PAE
and
PAF
status of up to 4 Queues
Global Bus Matching - (All Queues have same Input Bus Width
and Output Bus Width)
User Selectable Bus Matching Options:
- x18in to x18out
- x9in to x18out
- x18in to x9out
- x9in to x9out
FWFT mode of operation on read port
Partial Reset, clears data in single Queue
Expansion of up to 8 multi-queue devices in parallel is available
Power Down Input provides additional power savings in HSTL
and eHSTL modes.
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
FUNCTIONAL BLOCK DIAGRAM
MULTI-QUEUE FLOW-CONTROL DEVICE
WADEN
FSTR
WRADD
WEN
WCLK
5
READ CONTROL
RADEN
ESTR
RDADD
5
WRITE CONTROL
Q0
REN
RCLK
EREN
ERCLK
OE
x9, x18
DATA IN
FF
PAF
PAFn
Din
Qout
x9, x18
DATA OUT
READ FLAGS
OV
PAE
PAEn
4
WRITE FLAGS
Q3
4
6115 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2003
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
NOVEMBER 2003
DSC-6115/2

IDT72T51243L6BBI Related Products

IDT72T51243L6BBI IDT72T51243L6BB IDT72T51253L5BB IDT72T51253L6BBI
Description FIFO, 64KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 128KX18, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 128KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA BGA BGA
package instruction 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Contacts 256 256 256 256
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 3.7 ns 3.7 ns 3.6 ns 3.7 ns
period time 6 ns 6 ns 5 ns 6 ns
JESD-30 code S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609 code e0 e0 e0 e0
length 17 mm 17 mm 17 mm 17 mm
memory density 1179648 bit 1179648 bit 2359296 bit 2359296 bit
memory width 18 18 18 18
Humidity sensitivity level 3 3 3 3
Number of functions 1 1 1 1
Number of terminals 256 256 256 256
word count 65536 words 65536 words 131072 words 131072 words
character code 64000 64000 128000 128000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 85 °C
organize 64KX18 64KX18 128KX18 128KX18
Exportable YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 225 225
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.5 mm 3.5 mm 3.5 mm 3.5 mm
Maximum supply voltage (Vsup) 2.625 V 2.625 V 2.625 V 2.625 V
Minimum supply voltage (Vsup) 2.375 V 2.375 V 2.375 V 2.375 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 20 20 20
width 17 mm 17 mm 17 mm 17 mm
Base Number Matches 1 1 1 -
【LPC54100】Debug network module W5200 successfully with complete code
It has been a long time since I got the LPC54012. Due to the uncertainties in the project, I have not been able to share my achievements with you. I have always felt guilty... My work is about smart h...
linyu0395 NXP MCU
Dismantle a domestic POS machine
[i=s]This post was last edited by strong161 on 2017-3-31 15:04[/i] [size=4] Last year, I bought a bunch of POS machines to disassemble components and practice welding. They were cheap. If I could driv...
strong161 Making friends through disassembly
An ordinary mobile employee is under great pressure. Why is he so tired?
This year is an extraordinary year. We have reorganized and constantly seized each other's market share. Revenue must have retention rate, group maintenance, network information collection, and termin...
蜗居 Talking about work
How to download the stepping stone program of s3c2440 through the serial port?
Hello everyone! I want to download the 4kb stepping stone boot code of 2440 to arm through serial port. I used to download it by jtag. That is too slow and inconvenient. But it seems that the code onl...
wajwaj Embedded System
Launchpad+CC110L AIR Module BoosterPack Unboxing
[size=4]I recently got a new product that I have been coveting for a long time. I would like to share some unboxing photos with you~ :) As you all know, Launchpad has been launched for so many years, ...
juring Microcontroller MCU
Why does the higher the frequency of the chip, the greater the heat it generates?
Is it because of electromagnetic conversion and dissipation as heat?...
neesam Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1155  2498  2607  70  463  24  51  53  2  10 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号