Preliminary Data Sheet
TFH70H
Standard 70 MHz SAW Filter
Features
Industry Standard 14 pin & 18 pin DIP
packages
6 pin versions
40 different codes available
Bandwidths ranging from 0.25 to 40 MHz
Compatible with existing industry standard
specifications
Description
The TFH70H is the latest SAW family to the
Vectron International product range. Housed in
industry standard packages, VI s optimization
of design and high quality standards, com-
bined with competitive prices ensures lowest
total cost of ownership.
Developed for commercial applications, includ-
ing spectrum-shaping in digital radio systems
and general IF filtering for ground communica-
tions equipment. The TFH70H family offers a
cost effective device, compatible to industry
standard 70 MHz SAW filter specifications.
TFH70H Standard 70 MHz SAW Filter
Mechanical & Environmental Characteristics
Parameter
Physical Dimensions
Solderability
Resistance to Solvents
Interior Water Vapor
Leak test
Mechanical Shock Test
along
Mechanical Vibration Test
Description
Package exterior dimensions comply with MIL.STD.883C, Method 2016.
Tested using MIL.STD. 883C, Method 2003.4
Compliant with MIL.STD.883C, Method 2015.6
Residual gas analysis complies with MIL.STD.883C, Method 1018.2.
Gross and fine leak tests are performed to MIL.STD.883C, Method
1014.7 (Tests A,C) to 5 x 10-8 atm-cc/s.
Uses a 100 g, half sine pulse of 0.5 ms duration, 5 pulses per axis,
x, y and z axes, per MIL.STD.883C, Method 2002.3.
Uses a 20 g, peak acceleration, 20 Hz to 2000 Hz, 4 min. up and down in
frequency, 4 times per axis, along x, y, and z axis, per MIL.STD.883C,
Method 2007.1, Test A.
to
Air-to-air thermal shock over a temperature range of
dwelling 5 min. at each temperature extreme, and repeating for 300 cycles.
Destructive wirebond pull test per MIL.STD.883C, Method 2011.5.
ESD threshold level is measured using a charged device model and a human
body model.
Temperature Cycle and
Thermal Shock Test
Wirebond Strength
ESD Sensitivity
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Vectron International reserves the right to make changes to the product(s) and/or information contained herein without notice.
No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information.
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Printed in USA 1/99
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