VSMP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Vishay Foil Resistors
Ultra High Precision Foil Wraparound Surface Mount Chip Resistor
with TCR of ± 0.05 ppm/°C and Power Coefficient of 5 ppm at
Rated Power and Load Life Stability of ± 0.005 % (50 ppm)
FEATURES
•
Temperature coefficient of resistance (TCR):
0.05 ppm/°C typical (0 °C to + 60 °C)
0.2 ppm/°C typical (- 55 °C to + 125 °C, + 25 °C ref.)
•
Tolerance: to ± 0.01 %
•
Power coefficient “ΔR due to self heating”:
5 ppm at rated power
•
Power rating: to 750 mW at + 70 °C
•
Load life stability: to ± 0.005 % at 70 °C, 2000 h at rated
power
•
Resistance range: 10
Ω
to 125 kΩ (for higher and lower
values, please contact us)
•
Vishay Foil resistors are not restricted to standard values,
we can supply specific “as required” values at no extra cost
or delivery (e.g. 1K2345 vs. 1K)
•
Fast thermal stabilization < 1 s
•
Electrostatic discharge (ESD) up to 25 000 V
•
Short time overload:
≤
0.005 %
•
Non inductive, non capacitive design
•
Rise time: 1 ns effectively no ringing
•
Current noise: - 42 dB
•
Voltage coefficient < 0.1 ppm/V
•
Non inductive: < 0.08 µH
•
Non hot spot design
•
Terminal finishes available: lead (Pb)-free, tin/lead alloy
•
Compliant to RoHS directive 2002/95/EC
•
Matched sets are available on request
•
Prototype quantities available in just 5 working days
or sooner. For more information, please contact
foil@vishaypg.com
•
For better performances please contact us
Top View
INTRODUCTION
VSMP Series is the industry’s first device to provide high
rated power, excellent load life stability along with extremely
low TCR all in one resistor.
One of the most important parameters influencing stability is
the temperature coefficient of resistance (TCR). Although the
TCR of foil resistors is considered extremely low, this
characteristic has been further refined over the years. The
VSMP Series utilizes ultra high precision Bulk Metal
®
Z-foil.
The Z-foil technology provides a significant reduction of the
resistive element’s sensitivity to ambient temperature
variations (TCR) and to self heating when power is applied
(power coefficient). Along with the inherently low PCR and
TCR, Z-foil technology also provides remarkably improved
load life stability, low noise and availability of tight tolerance.
The VSMP has a full wraparound termination which ensures
safe handling during the manufacturing process, as well as
providing stability during multiple thermal cyclings.
Our application engineering department is available to
advise and make recommendations. For non-standard
technical requirements and special applications, please
contact us using the e-mail address in the footer below.
APPLICATIONS
•
•
•
•
•
Automatic test equipment (ATE)
High precision instrumentation
Laboratory, industrial and medical
Audio
EB applications (electron beam scanning and recording
equipment, electron microscopes)
•
Down hole instrumentation
•
Communication
TABLE 1 - TOLERANCE AND TCR VS.
RESISTANCE VALUE
(1)
(- 55 °C to + 125 °C, + 25 °C Ref.)
RESISTANCE
VALUE
(Ω)
250 to 125K
100 to < 250
50 to < 100
25 to < 50
10 to < 25
TOLERANCE
(%)
± 0.01
± 0.02
± 0.05
± 0.1
± 0.25
TYPICAL TCR AND
MAX. SPREAD
(ppm/°C)
± 0.2 ± 1.8
± 0.2 ± 1.8
± 0.2 ± 2.8
± 0.2 ± 3.8
± 0.2 ± 3.8
FIGURE 1 - POWER DERATING CURVE
Percent of Rated Power
- 55 °C
100
75
50
25
0
- 75
+ 70 °C
Note
(1)
For tighter performances and non-standard values up to 150K,
please contact Vishay application engineering using the e-mail
addresses in the footer below.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 63060
Revision: 25-Mar-10
- 50
- 25
0
+ 25 + 50 + 75 + 100 + 125 + 150 + 175
Ambient Temperature (°C)
For any questions, contact:
foil@vishaypg.com
www.foilresistors.com
1
VSMP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Vishay Foil Resistors
FIGURE 2 - TRIMMING TO VALUES
(Conceptual Illustration)
FIGURE 3 - TYPICAL RESISTANCE/
TEMPERATURE CURVE
+ 400
+ 300
+ 200
+ 100
ΔR
0
R
(ppm)
- 100
- 200
- 300
- 400
- 500
- 55
- 25
+ 25
+ 60 + 75 + 100 + 125
0
Ambient Temperature (°C) and TCR Chord Slopes for
Different Temperature Ranges
- 0.16 ppm/°C
Interloop Capacitance
Reduction in Series
Current Path
Before Trimming
Current Path
After Trimming
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing
Resistance
0.05 ppm/°C
- 0.1 ppm/°C
0.1 ppm/°C
0.14 ppm/°C
0.2 ppm/°C
Mutual Inductance
Reduction due
to Change in
Current Direction
Note:
Foil shown in
black,
etched spaces in
white
Note
• The TCR values for < 100
Ω
are influenced by the termination
composition and result in deviation from this curve.
TABLE 2 - DIMENSIONS AND LAND PATTERN
in Inches (Millimeters)
Top View
L
X
T
D
CHIP
SIZE
0805
1206
1506
2010
2512
L
± 0.005 (0.13)
0.080 (2.03)
0.126 (3.20)
0.150 (3.81)
0.198 (5.03)
0.249 (6.32)
W
± 0.005 (0.13)
0.050 (1.27)
0.062 (1.57)
0.062 (1.57)
0.097 (2.46)
0.127 (3.23)
THICKNESS
MAXIMUM
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
D
± 0.005 (0.13)
0.015 (0.38)
0.020 (0.51)
0.020 (0.51)
0.025 (0.64)
0.032 (0.81)
Z
(1)
0.122 (3.10)
0.175 (4.45)
0.199 (5.05)
0.247 (6.27)
0.291 (7.39)
G
(1)
0.028 (0.71)
0.059 (1.50)
0.083 (2.11)
0.115 (2.92)
0.150 (3.81)
X
(1)
0.050 (1.27)
0.071 (1.80)
0.071 (1.80)
0.103 (2.62)
0.127 (3.23)
Recommended Land Pattern
Footprint
W
Z
G
Note
(1)
Land Pattern Dimensions are per IPC-7351A
TABLE 3 - SPECIFICATIONS
CHIP
SIZE
0805
1206
1506
2010
2512
RATED
POWER
(mW)
at + 70 °C
200
300
300
500
750
MAX.
WORKING
VOLTAGE
(≤
P
×
R
)
40 V
87 V
95 V
187 V
220 V
RESISTANCE
RANGE
(Ω)
10 to 8K
10 to 25K
10 to 30K
10 to 70K
10 to 125K
MAXIMUM
WEIGHT
(mg)
6
11
12
27
40
TABLE 4 - LOAD LIFE STABILITY
(+ 70 °C for 2000 h)
CHIP SIZE
0805
1206, 1506
2010
2512
MAXIMUM
ΔR
LIMITS
± 0.005 % at 100 mW
± 0.01 % at 200 mW
± 0.005 % at 150 mW
± 0.01 % at 300 mW
± 0.005 % at 200 mW
± 0.01 % at 500 mW
± 0.005 % at 500 mW
± 0.01 % at 750 mW
TABLE 5 - PERFORMANCES
TEST OR CONDITIONS
Thermal Shock, 100 x (- 65 °C to + 150 °C)
Low Temperature Operation, - 65 °C, 45 min at P
nom
Short Time Overload, 6.25 x Rated Power, 5 s
High Temperature Exposure, + 150 °C, 100 h
Resistance to Soldering Heat
Moisture Resistance
Load Life Stability + 70 °C for 2000 h at Rated Power
Note
(1)
As shown + 0.01
Ω
to allow for measurement errors at low values.
www.foilresistors.com
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MIL-PRF-55342
CHARACTERISTIC E
ΔR
LIMITS
± 0.1 %
± 0.1 %
± 0.1 %
± 0.1 %
± 0.2 %
± 0.2 %
± 0.5 %
TYPICAL
ΔR
LIMITS
± 0.005 % (50 ppm)
± 0.005 % (50 ppm)
± 0.005 % (50 ppm)
± 0.01 % (100 ppm)
± 0.005 % (50 ppm)
± 0.005 % (50 ppm)
± 0.005 % (50 ppm)
MAXIMUM
ΔR
LIMITS
(1)
± 0.01 % (100 ppm)
± 0.01 % (100 ppm)
± 0.01 % (100 ppm)
± 0.02 % (200 ppm)
± 0.01 % (100 ppm)
± 0.02 % (200 ppm)
± 0.01 % (100 ppm)
For any questions, contact:
foil@vishaypg.com
Document Number: 63060
Revision: 25-Mar-10
VSMP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Vishay Foil Resistors
FIGURE 4 - RECOMMENDED MOUNTING
(1)(2)(3)
25
%
to
85 %
of T
A low profile solder fillet is
recommended to avoid
unnecessary
stresses along top edge of
metallization. IR and
vapor
phase
reflow are
best.
Notes
(1)
Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction
(2)
Vacuum pick up is recommended for handling
(3)
Soldering iron may damage the resistor
TABLE 6 - GLOBAL PART NUMBER INFORMATION
(1)
NEW GLOBAL PART NUMBER: Y162612K7560T9R (preferred part number format)
DENOTES PRECISION
Y
VALUE
R
=
Ω
K
= kΩ
CHARACTERISTICS
0
= standard
9
= lead (Pb)-free
1 to 999
= custom
Y
1
6
2
6
1
2
K
7
5
6
0
T
9
R
PRODUCT CODE
1624
= VSMP0805
1625
= VSMP1206
1626
= VSMP1506
1627
= VSMP2010
1628
= VSMP2512
RESISTANCE TOLERANCE
T
= ± 0.01 %
Q
= ± 0.02 %
A
= ± 0.05 %
B
= ± 0.10 %
C
= ± 0.25 %
D
= ± 0.5 %
F
= ± 1.0 %
PACKAGING
R
= tape and reel
W
= waffle pack
FOR EXAMPLE: ABOVE GLOBAL ORDER Y1626 12K7560 T 9 R:
TYPE: VSMP1506
VALUES: 12.7560 kΩ
ABSOLUTE TOLERANCE: 0.01 %
TERMINATION: lead (Pb)-free
PACKAGING: tape and reel
HISTORICAL PART NUMBER: VSMP1506 12K756 TCR0.2 T S T (will continue to be used)
VSMP1506
MODEL
VSMP0805
VSMP1206
VSMP1506
VSMP2010
VSMP2512
12K756
RESISTANCE VALUE
12.756 kΩ
TCR0.2
TCR
CHARACTERISTICS
T
TOLERANCE
T
= ± 0.01 %
Q
= ± 0.02 %
A
= ± 0.05 %
B
= ± 0.10 %
C
= ± 0.25 %
D
= ± 0.5 %
F
= ± 1.0 %
S
TERMINATION
S
= lead (Pb)-free
B
= tin/lead
T
PACKAGING
T
= tape and reel
W
= waffle pack
(1)
Note
For non-standard requests, please contact application engineering.
Document Number: 63060
Revision: 25-Mar-10
For any questions, contact:
foil@vishaypg.com
www.foilresistors.com
3
Legal Disclaimer Notice
Vishay Precision Group
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Precision Group, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay Precision Group”), disclaim any and all liability for any errors, inaccuracies or incompleteness
contained herein or in any other disclosure relating to any product.
Vishay Precision Group disclaims any and all liability arising out of the use or application of any product described
herein or of any information provided herein to the maximum extent permitted by law. The product specifications do
not expand or otherwise modify Vishay Precision Group’s terms and conditions of purchase, including but not limited
to the warranty expressed therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay Precision Group.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay Precision Group products not expressly indicated
for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay Precision Group for
any damages arising or resulting from such use or sale. Please contact authorized Vishay Precision Group
personnel to obtain written terms and conditions regarding products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 63999
Revision: 22-Feb-10
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