DM74S188VX datasheet, PDF - EEWORLD Datasheet

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DM74S188VX: DescriptionIC 32 X 8 OTPROM, 35 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM; Categorystorage storage; File Size120KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM74S188VX Overview

IC 32 X 8 OTPROM, 35 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM

DM74S188VX Parametric

Parameter Name	Attribute value
Parts packaging code	QLCC
package instruction	QCCJ,
Contacts	20
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	35 ns
JESD-30 code	S-PQCC-J20
length	8.89 mm
memory density	256 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	20
word count	32 words
character code	32
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32X8
Output characteristics	OPEN-COLLECTOR
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	8.89 mm
Base Number Matches	1

DM74S188VX Related Products

	DM74S188VX	DM74S188AVX	DM54S188AJ	DM54S188J
Description	IC 32 X 8 OTPROM, 35 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM	32X8 OTPROM, 25ns, PQCC20, PLASTIC, LCC-20	32X8 OTPROM, 35ns, CDIP16, CERAMIC, DIP-16	32X8 OTPROM, 45ns, CDIP16, CERAMIC, DIP-16
Parts packaging code	QLCC	QLCC	DIP	DIP
package instruction	QCCJ,	QCCJ,	DIP, DIP16,.3	DIP, DIP16,.3
Contacts	20	20	16	16
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	35 ns	25 ns	35 ns	45 ns
JESD-30 code	S-PQCC-J20	S-PQCC-J20	R-GDIP-T16	R-GDIP-T16
length	8.89 mm	8.89 mm	19.43 mm	19.43 mm
memory density	256 bit	256 bit	256 bit	256 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	20	20	16	16
word count	32 words	32 words	32 words	32 words
character code	32	32	32	32
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	125 °C	125 °C
organize	32X8	32X8	32X8	32X8
Output characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	QCCJ	QCCJ	DIP	DIP
Package shape	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	4.57 mm	5.08 mm	5.08 mm
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY
Terminal form	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	QUAD	QUAD	DUAL	DUAL
width	8.89 mm	8.89 mm	7.62 mm	7.62 mm
Maker	-	Texas Instruments	Texas Instruments	Texas Instruments

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Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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