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MPC8360VVAHFG

Description
32-BIT, 500MHz, RISC PROCESSOR, PBGA740, 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-740
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size606KB,102 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MPC8360VVAHFG Overview

32-BIT, 500MHz, RISC PROCESSOR, PBGA740, 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-740

MPC8360VVAHFG Parametric

Parameter NameAttribute value
Parts packaging codeBGA
package instructionLBGA,
Contacts740
Reach Compliance Codeunknown
ECCN code3A001.A.3
Address bus width32
bit size32
boundary scanYES
maximum clock frequency66.67 MHz
External data bus width32
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B740
length37.5 mm
low power modeYES
Number of terminals740
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Certification statusNot Qualified
Maximum seat height1.69 mm
speed500 MHz
Maximum supply voltage1.35 V
Minimum supply voltage1.15 V
Nominal supply voltage1.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width37.5 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Base Number Matches1
Freescale Semiconductor
Technical Data
Document Number: MPC8360EEC
Rev. 5, 09/2011
MPC8360E/MPC8358E
PowerQUICC II Pro Processor
Revision 2.x TBGA Silicon
Hardware Specifications
This document provides an overview of the MPC8360E/58E
PowerQUICC II Pro processor revision 2.x TBGA features, including a
block diagram showing the major functional components. This device is
a cost-effective, highly integrated communications processor that
addresses the needs of the networking, wireless infrastructure, and
telecommunications markets. Target applications include next generation
DSLAMs, network interface cards for 3G base stations (Node Bs),
routers, media gateways, and high end IADs. The device extends current
PowerQUICC II Pro offerings, adding higher CPU performance,
additional functionality, faster interfaces, and robust interworking
between protocols while addressing the requirements related to
time-to-market, price, power, and package size. This device can be used
for the control plane and also has data plane functionality.
For functional characteristics of the processor, refer to the
MPC8360E
PowerQUICC II Pro Integrated Communications Processor Reference
Manual,
Rev. 3.
To locate any updates for this document, refer to the MPC8360E product
summary page on our website listed on the back cover of this document
or contact your Freescale sales office.
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1
Overview
This section describes a high-level overview including features and
general operation of the MPC8360E/58E PowerQUICC II Pro processor.
A major component of this device is the e300 core, which includes
32 Kbytes of instruction and data cache and is fully compatible with the
Power Architecture™ 603e instruction set. The new QUICC Engine
module provides termination, interworking, and switching between a
Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Electrical Characteristics . . . . . . . . . . . . . . . . . . 7
Power Characteristics . . . . . . . . . . . . . . . . . . . 12
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . 14
RESET Initialization . . . . . . . . . . . . . . . . . . . . 16
DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . 18
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
UCC Ethernet Controller: Three-Speed Ethernet,
MII Management . . . . . . . . . . . . . . . . . . . . . . . 25
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
I
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
HDLC, BISYNC, Transparent, and Synchronous
UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Package and Pin Listings . . . . . . . . . . . . . . . . . 63
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
System Design Information . . . . . . . . . . . . . . . 96
Ordering Information . . . . . . . . . . . . . . . . . . . . 99
Document Revision History . . . . . . . . . . . . . 100
© 2011 Freescale Semiconductor, Inc. All rights reserved.
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