AT45DB011D-MH-SL954 datasheet, PDF

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AT45DB011D-MH-SL954: DescriptionIC FLASH 1MBIT 66MHZ 8UDFN; Categorystorage storage; File Size1MB，52 Pages; ManufacturerAtmel (Microchip); Environmental Compliance

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AT45DB011D-MH-SL954 Overview

IC FLASH 1MBIT 66MHZ 8UDFN

AT45DB011D-MH-SL954 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Atmel (Microchip)
Parts packaging code	SON
package instruction	VSON, SOLCC8,.25
Contacts	8
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum clock frequency (fCLK)	66 MHz
Data retention time - minimum	20
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-N8
JESD-609 code	e4
length	6 mm
memory density	1048576 bi
Memory IC Type	FLASH
memory width	1
Number of functions	1
Number of terminals	8
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX1
Package body material	PLASTIC/EPOXY
encapsulated code	VSON
Encapsulate equivalent code	SOLCC8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE
Parallel/Serial	SERIAL
power supply	3/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
Maximum seat height	0.6 mm
Serial bus type	SPI
Maximum standby current	0.000015 A
Maximum slew rate	0.025 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
type	NOR TYPE
width	5 mm
write protect	HARDWARE/SOFTWARE
Base Number Matches	1

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Features

•

Single 2.7V to 3.6V Supply

•

RapidS

Serial Interface: 66 MHz Maximum Clock Frequency

•

– SPI Compatible Modes 0 and 3

User Configurable Page Size

– 256 Bytes per Page

– 264 Bytes per Page

– Page Size Can Be Factory Pre-configured for 256 Bytes

Page Program Operation

– Intelligent Programming Operation

– 512 Pages (256/264 Bytes/Page) Main Memory

Flexible Erase Options

– Page Erase (256 Bytes)

– Block Erase (2 Kbytes)

– Sector Erase (32 Kbytes)

– Chip Erase (1 Mbits)

One SRAM Data Buffer (256/264 Bytes)

Continuous Read Capability through Entire Array

– Ideal for Code Shadowing Applications

Low-power Dissipation

– 7 mA Active Read Current Typical

– 25 µA Standby Current Typical

– 5 µA Deep Power-down Typical

Hardware and Software Data Protection Features

– Individual Sector

Sector Lockdown for Secure Code and Data Storage

– Individual Sector

Security: 128-byte Security Register

– 64-byte User Programmable Space

– Unique 64-byte Device Identifier

JEDEC Standard Manufacturer and Device ID Read

100,000 Program/Erase Cycles Per Page Minimum

Data Retention – 20 Years

Industrial Temperature Range

Green (Pb/Halide-free/RoHS Compliant) Packaging Options

•

1-megabit

2.7-volt

Minimum

DataFlash

AT45DB011D

•

1. Description

The AT45DB011D is a 2.7V, serial-interface Flash memory ideally suited for a wide

variety of digital voice-, image-, program code- and data-storage applications. The

AT45DB011D supports RapidS serial interface for applications requiring very high

speed operations. RapidS serial interface is SPI compatible for frequencies up to 66

MHz. Its 1,081,344 bits of memory are organized as 512 pages of 256 bytes or 264

bytes each. In addition to the main memory, the AT45DB011D also contains one

SRAM buffer of 256/264 bytes. EEPROM emulation (bit or byte alterability) is easily

handled with a self-contained three step read-modify-write operation. Unlike conven-

tional Flash memories that are accessed randomly with multiple address lines and a

parallel interface, the DataFlash

uses a RapidS serial interface to sequentially

access its data. The simple sequential access dramatically reduces active pin count,

facilitates hardware layout, increases system reliability, minimizes switching noise,

and reduces package size.

3639E–DFLASH–5/08

The device is optimized for use in many commercial and industrial applications where high-den-

sity, low-pin count, low-voltage and low-power are essential.

To allow for simple in-system reprogrammability, the AT45DB011D does not require high input

voltages for programming. The device operates from a single power supply, 2.7V to 3.6V, for

both the program and read operations. The AT45DB011D is enabled through the chip select pin

(CS) and accessed via a three-wire interface consisting of the Serial Input (SI), Serial Output

(SO), and the Serial Clock (SCK).

All programming and erase cycles are self-timed.

2. Pin Configurations and Pinouts

Table 2-1.

Symbol

Pin Configurations

Asserted

State

Type

Name and Function

Chip Select:

Asserting the CS pin selects the device. When the CS pin is deasserted, the device will be deselected

and normally be placed in the standby mode (not Deep Power-Down mode), and the output pin (SO) will be in a

high-impedance state. When the device is deselected, data will not be accepted on the input pin (SI).

A high-to-low transition on the CS pin is required to start an operation, and a low-to-high transition is required to

end an operation. When ending an internally self-timed operation such as a program or erase cycle, the device

will not enter the standby mode until the completion of the operation.

Serial Clock:

This pin is used to provide a clock to the device and is used to control the flow of data to and from

the device. Command, address, and input data present on the SI pin is always latched on the rising edge of SCK,

while output data on the SO pin is always clocked out on the falling edge of SCK.

Serial Input:

The SI pin is used to shift data into the device. The SI pin is used for all data input including

command and address sequences. Data on the SI pin is always latched on the rising edge of SCK.

Serial Output:

The SO pin is used to shift data out from the device. Data on the SO pin is always clocked out on

the falling edge of SCK.

Write Protect:

When the WP pin is asserted, all sectors specified for protection by the Sector Protection Register will

be protected against program and erase operations regardless of whether the Enable Sector Protection command

has been issued or not. The WP pin functions independently of the software controlled protection method. After the

WP pin goes low, the content of the Sector Protection Register cannot be modified.

Low

Input

SCK

–

Input

–

Input

Output

If a program or erase command is issued to the device while the WP pin is asserted, the device will simply ignore

the command and perform no operation. The device will return to the idle state once the CS pin has been

deasserted. The Enable Sector Protection command and Sector Lockdown command, however, will be

recognized by the device when the WP pin is asserted.

The WP pin is internally pulled-high and may be left floating if hardware controlled protection will not be used.

However, it is recommended that the WP pin also be externally connected to V

whenever possible.

Reset:

A low state on the reset pin (RESET) will terminate the operation in progress and reset the internal state

machine to an idle state. The device will remain in the reset condition as long as a low level is present on the RESET

pin. Normal operation can resume once the RESET pin is brought back to a high level.

The device incorporates an internal power-on reset circuit, so there are no restrictions on the RESET pin during

power-on sequences. If this pin and feature are not utilized it is recommended that the RESET pin be driven high

externally.

Device Power Supply:

The V

pin is used to supply the source voltage to the device.

Operations at invalid V

voltages may produce spurious results and should not be attempted.

Ground:

The ground reference for the power supply. GND should be connected to the system ground.

Low

Input

RESET

Low

Input

GND

–

Power

Ground

AT45DB011D

3639E–DFLASH–5/08

4. Memory Array

To provide optimal flexibility, the memory array of the AT45DB011D is divided into three levels of

granularity comprising of sectors, blocks, and pages. The “Memory Architecture Diagram” illus-

trates the breakdown of each level and details the number of pages per sector and block. All

program operations to the DataFlash occur on a page-by-page basis. The erase operations can

be performed at the chip, sector, block or page level.

Figure 4-1.

Memory Architecture Diagram

BLOCK ARCHITECTURE

SECTOR 0a

SECTOR 0a = 8 Pages

2,048/2,112 bytes

BLOCK 0

BLOCK 1

SECTOR ARCHITECTURE

PAGE ARCHITECTURE

8 Pages

BLOCK 0

PAGE 0

PAGE 1

SECTOR 0b

BLOCK 2

PAGE 6

PAGE 7

PAGE 8

SECTOR 0b = 120 Pages

31,744/32,726 bytes

BLOCK 14

BLOCK 15

BLOCK 17

SECTOR 1 = 128 Pages

32,768/33,792 bytes

SECTOR 1

BLOCK 1

BLOCK 16

PAGE 9

PAGE 14

PAGE 15

BLOCK 30

BLOCK 31

SECTOR 2 = 128 Pages

32,768/33,792 bytes

BLOCK 32

BLOCK 33

PAGE 16

PAGE 17

PAGE 18

SECTOR 3 = 128 Pages

32,768/33,792 bytes

BLOCK 62

BLOCK 63

PAGE 510

PAGE 511

Block = 2,048/2,112 bytes

Page = 256/264 bytes

5. Device Operation

The device operation is controlled by instructions from the host processor. The list of instructions

and their associated opcodes are contained in

Tables 15-1 through 15-7.

A valid instruction

starts with the falling edge of CS followed by the appropriate 8-bit opcode and the desired buffer

or main memory address location. While the CS pin is low, toggling the SCK pin controls the

loading of the opcode and the desired buffer or main memory address location through the SI

(serial input) pin. All instructions, addresses, and data are transferred with the most significant

bit (MSB) first.

Buffer addressing for the DataFlash standard page size (264 bytes) is referenced in the

datasheet using the terminology BFA8 - BFA0 to denote the 9 address bits required to designate

a byte address within a buffer. Main memory addressing is referenced using the terminology

PA8 - PA0 and BA8 - BA0, where PA8 - PA0 denotes the 9 address bits required to designate a

page address and BA8 - BA0 denotes the 9 address bits required to designate a byte address

within the page.

For the “Power of 2” binary page size (256 bytes), the Buffer addressing is referenced in the

datasheet using the conventional terminology BFA7 - BFA0 to denote the 8 address bits

required to designate a byte address within a buffer. Main memory addressing is referenced

using the terminology A16 - A0, where A16 - A8 denotes the 9 address bits required to desig-

nate a page address and A7 - A0 denotes the 8 address bits required to designate a byte

address within a page.

AT45DB011D

3639E–DFLASH–5/08

AT45DB011D

6. Read Commands

By specifying the appropriate opcode, data can be read from the main memory or from the

SRAM data buffer. The DataFlash supports RapidS protocols for Mode 0 and Mode 3. Please

refer to the “Detailed Bit-level Read Timing” diagrams in this datasheet for details on the clock

cycle sequences for each mode.

6.1

Continuous Array Read (Legacy Command – E8H): Up to 66 MHz

By supplying an initial starting address for the main memory array, the Continuous Array Read

command can be utilized to sequentially read a continuous stream of data from the device by

simply providing a clock signal; no additional addressing information or control signals need to

be provided. The DataFlash incorporates an internal address counter that will automatically

increment on every clock cycle, allowing one continuous read operation without the need of

additional address sequences. To perform a continuous read from the DataFlash standard page

size (264 bytes), an opcode of E8H must be clocked into the device followed by three address

bytes (which comprise the 24-bit page and byte address sequence) and 4 don’t care bytes. The

first 9 bits (PA8 - PA0) of the 18-bit address sequence specify which page of the main memory

array to read, and the last 9 bits (BA8 - BA0) of the 18-bit address sequence specify the starting

byte address within the page. To perform a continuous read from the binary page size (256

bytes), the opcode (E8H) must be clocked into the device followed by three address bytes and 4

don’t care bytes. The first 9 bits (A16 - A8) of the 17-bits sequence specify which page of the

main memory array to read, and the last 8 bits (A7 - A0) of the 18-bits address sequence specify

the starting byte address within the page. The don’t care bytes that follow the address bytes are

needed to initialize the read operation. Following the don’t care bytes, additional clock pulses on

the SCK pin will result in data being output on the SO (serial output) pin.

The CS pin must remain low during the loading of the opcode, the address bytes, the don’t care

bytes, and the reading of data. When the end of a page in main memory is reached during a

Continuous Array Read, the device will continue reading at the beginning of the next page with

no delays incurred during the page boundary crossover (the crossover from the end of one page

to the beginning of the next page). When the last bit in the main memory array has been read,

the device will continue reading back at the beginning of the first page of memory. As with cross-

ing over page boundaries, no delays will be incurred when wrapping around from the end of the

array to the beginning of the array.

A low-to-high transition on the CS pin will terminate the read operation and tri-state the output

pin (SO). The maximum SCK frequency allowable for the Continuous Array Read is defined by

the f

CAR1

specification. The Continuous Array Read bypasses the data buffer and leaves the

contents of the buffer unchanged.

6.2

Continuous Array Read (High Frequency Mode – 0BH): Up to 66 MHz

This command can be used with the serial interface to read the main memory array sequentially

in high speed mode for any clock frequency up to the maximum specified by f

CAR1

. To perform a

continuous read array with the page size set to 264 bytes, the CS must first be asserted then an

opcode 0BH must be clocked into the device followed by three address bytes and a dummy

byte. The first 9 bits (PA8 - PA0) of the 18-bit address sequence specify which page of the main

memory array to read, and the last 9 bits (BA8 - BA0) of the 18-bit address sequence specify the

starting byte address within the page. To perform a continuous read with the page size set to

256 bytes, the opcode, 0BH, must be clocked into the device followed by three address bytes

(A16 - A0) and a dummy byte. Following the dummy byte, additional clock pulses on the SCK

pin will result in data being output on the SO (serial output) pin.

3639E–DFLASH–5/08

AT45DB011D-MH-SL954 Related Products

	AT45DB011D-MH-SL954	AT45DB011D-MH-T	AT45DB011D-MH-Y	AT45DB011D_08
Description	IC FLASH 1MBIT 66MHZ 8UDFN	IC FLASH 1MBIT 66MHZ 8UDFN	IC FLASH 1MBIT 66MHZ 8UDFN	IC FLASH 1MBIT 66MHZ 8UDFN
Is it Rohs certified?	conform to	conform to	conform to	-
Maker	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	-
Parts packaging code	SON	SON	SON	-
package instruction	VSON, SOLCC8,.25	VSON, SOLCC8,.25	VSON, SOLCC8,.25	-
Contacts	8	8	8	-
Reach Compliance Code	unknow	unknow	unknow	-
ECCN code	EAR99	EAR99	EAR99	-
Maximum clock frequency (fCLK)	66 MHz	66 MHz	66 MHz	-
Data retention time - minimum	20	20	20	-
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	-
JESD-30 code	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	-
JESD-609 code	e4	e4	e4	-
length	6 mm	6 mm	6 mm	-
memory density	1048576 bi	1048576 bi	1048576 bi	-
Memory IC Type	FLASH	FLASH	FLASH	-
memory width	1	1	1	-
Number of functions	1	1	1	-
Number of terminals	8	8	8	-
word count	1048576 words	1048576 words	1048576 words	-
character code	1000000	1000000	1000000	-
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-
Maximum operating temperature	85 °C	85 °C	85 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-
organize	1MX1	1MX1	1MX1	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	VSON	VSON	VSON	-
Encapsulate equivalent code	SOLCC8,.25	SOLCC8,.25	SOLCC8,.25	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	-
Parallel/Serial	SERIAL	SERIAL	SERIAL	-
power supply	3/3.3 V	3/3.3 V	3/3.3 V	-
Programming voltage	2.7 V	2.7 V	2.7 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	0.6 mm	0.6 mm	0.6 mm	-
Serial bus type	SPI	SPI	SPI	-
Maximum standby current	0.000015 A	0.000015 A	0.000015 A	-
Maximum slew rate	0.025 mA	0.025 mA	0.025 mA	-
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	-
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	-
Nominal supply voltage (Vsup)	3 V	3 V	3 V	-
surface mount	YES	YES	YES	-
technology	CMOS	CMOS	CMOS	-
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	-
Terminal form	NO LEAD	NO LEAD	NO LEAD	-
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	-
Terminal location	DUAL	DUAL	DUAL	-
type	NOR TYPE	NOR TYPE	NOR TYPE	-
width	5 mm	5 mm	5 mm	-
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	-

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