ADC, Successive Approximation, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, CERAMIC, DIP-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, DIP28,.6 |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum analog input voltage | 24 V |
| Minimum analog input voltage | -24 V |
| Maximum conversion time | 15 µs |
| Converter type | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 code | R-CDIP-T28 |
| JESD-609 code | e0 |
| length | 35.56 mm |
| Maximum linear error (EL) | 0.012% |
| Number of digits | 12 |
| Number of functions | 1 |
| Number of terminals | 28 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output bit code | BINARY, OFFSET BINARY |
| Output format | PARALLEL, WORD |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5,+-12/+-15 V |
| Certification status | Not Qualified |
| Sampling rate | 0.083 MHz |
| Maximum seat height | 4.22 mm |
| Maximum slew rate | 20 mA |
| surface mount | NO |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| Base Number Matches | 1 |
| MN674AK | MN674AS/B | MN674AL | MN674AT | MN674AT/B | MN674AS | |
|---|---|---|---|---|---|---|
| Description | ADC, Successive Approximation, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, CERAMIC, DIP-28 | ADC, Successive Approximation, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, CERAMIC, DIP-28 | ADC, Successive Approximation, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, CERAMIC, DIP-28 | ADC, Successive Approximation, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, CERAMIC, DIP-28 | ADC, Successive Approximation, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, CERAMIC, DIP-28 | ADC, Successive Approximation, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, CERAMIC, DIP-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Contacts | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | 3A001.A.2.C | EAR99 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Maximum analog input voltage | 24 V | 24 V | 24 V | 24 V | 24 V | 24 V |
| Minimum analog input voltage | -24 V | -24 V | -24 V | -24 V | -24 V | -24 V |
| Maximum conversion time | 15 µs | 15 µs | 15 µs | 15 µs | 15 µs | 15 µs |
| Converter type | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 code | R-CDIP-T28 | R-CDIP-T28 | R-CDIP-T28 | R-CDIP-T28 | R-CDIP-T28 | R-CDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 35.56 mm | 35.56 mm | 35.56 mm | 35.56 mm | 35.56 mm | 35.56 mm |
| Maximum linear error (EL) | 0.012% | 0.024% | 0.012% | 0.012% | 0.012% | 0.024% |
| Number of digits | 12 | 12 | 12 | 12 | 12 | 12 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -55 °C | - | -55 °C | -55 °C | -55 °C |
| Output bit code | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| Output format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5,+-12/+-15 V | 5,+-12/+-15 V | 5,+-12/+-15 V | 5,+-12/+-15 V | 5,+-12/+-15 V | 5,+-12/+-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Sampling rate | 0.083 MHz | 0.083 MHz | 0.083 MHz | 0.083 MHz | 0.083 MHz | 0.083 MHz |
| Maximum seat height | 4.22 mm | 4.22 mm | 4.22 mm | 4.22 mm | 4.22 mm | 4.22 mm |
| Maximum slew rate | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA |
| surface mount | NO | NO | NO | NO | NO | NO |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| Maker | - | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave |
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