µClamp
TM
1-Line ESD protection
PROTECTION PRODUCTS - MicroClamp
Description
The
µClamp
TM
series of TVS arrays are designed to protect
sensitive electronics from damage or latch-up due to ESD.
It is designed to replace multilayer varistors (MLVs) in por-
table applications such as cell phones, notebook comput-
ers, and PDA’s. It features large cross-sectional area junc-
tions for conducting high transient currents. It offers su-
perior electrical characteristics such as lower clamping volt-
age and no device degradation when compared to MLVs.
They offer desirable characteristics for board level protec-
tion including fast response time, low operating and clamp-
ing voltage, and no device degradation.
The
µclamp
TM
0501H is in a ultra-small SOD-523 pack-
age ideal for use in portable electronics such as cell
phones, PDA’s, notebook computers, and digital
cameras. It will protect one unidirectional line operat-
ing at 5 volts. It gives the designer the flexibility to
protect one line in applications where arrays are not
practical. Additionally, it may be “sprinkled” around the
board in applications where board space is at a pre-
mium.
This device may be used to meet the ESD immunity
requirements of IEC 61000-4-2, Level 4 (±15kV air,
±8kV contact discharge).
uClamp0501H
Features
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
Ultra-small SOD-523 package (1.7 x 0.9 x 0.7mm)
Protects one I/O or power line
Low clamping voltage
Working voltage: 5V
Low leakage current
Solid-state silicon-avalanche technology
Mechanical Characteristics
EIAJ SOD-523 package
Molding compound flammability rating: UL 94V-0
Marking : Marking code, cathode band
Packaging : Tape and Reel per EIA 481
Lead Finish: Matte tin
Applications
Cellular Handsets & Accessories
Cordless Phones
Personal Digital Assistants (PDAs)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Dimensions
1.70
1.30
0.9
Schematic & PIN Configuration
0.35
0.70
Maximum Dimensions (mm)
Revision 04/12/2005
1
SOD-523 (Top View)
www.semtech.com
uClamp0501H
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Peak Pulse Power (tp = 8/20µs)
Maximum Peak Pulse Current (tp = 8/20µs)
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
Lead Soldering Temperature
Operating Temperature
Storage Temperature
Symbol
P
p k
I
p p
V
PP
T
L
T
J
T
STG
Value
240
16
+/- 20
+/- 15
260 (10 sec.)
-55 to +125
-55 to +150
Units
Watts
Amps
kV
°C
°C
°C
Electrical Characteristics (T=25
o
C)
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Forward Voltage
Clamp ing Voltage
Clamp ing Voltage
Junction Cap acitance
Symbol
V
RWM
V
BR
I
R
V
F
V
C
V
C
C
j
I
t
= 1mA
V
RWM
= 5V, T=25°C
I
F
= 10mA
I
PP
= 5A, t
p
= 8/20µs
I
PP
= 16A, t
p
= 8/20µs
V
R
= 0V, f = 1MHz
0.80
9.8
12.5
160
6
5
Conditions
Minimum
Typical
Maximum
5
Units
V
V
µA
V
V
V
pF
2003 Semtech Corp.
2
www.semtech.com
uClamp0501H
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
Peak Pulse Power - P
pk
(kW)
110
100
90
% of Rated Power or I
PP
80
70
60
50
40
30
20
10
0
Power Derating Curve
1
0.1
0.01
0.1
1
10
Pulse Duration - t
p
(µs)
100
1000
0
25
50
75
100
o
125
150
Ambient Temperature - T
A
( C)
Clamping Voltage vs. Peak Pulse Current
12
10
Clamping Voltage - V
C
(V)
8
6
4
2
0
0
2
4
6
8
10
12
14
16
Waveform
Parameters:
tr = 8µs
td = 20µs
Forward Voltage - V
F
(V)
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0
Forward Voltage vs. Forward Current
Waveform
Parameters:
tr = 8µs
td = 20µs
4
8
Forward Current - I
F
(A)
12
16
Peak Pulse Current - I
PP
(A)
Junction Capacitance vs. Reverse Voltage
160
f = 1 MHz
ESD Clamping
(8kV Contact per IEC 61000-4-2)
140
Capacitance - C
j
(pF)
120
100
80
60
0
1
2
3
Reverse Voltage - V
R
(V)
4
5
2003 Semtech Corp.
3
www.semtech.com
uClamp0501H
PROTECTION PRODUCTS
Applications Information
Device Connection Options
These TVS diodes are designed to protect one data, I/
O, or power supply line. The device is unidirectional
and may be used on lines where the signal polarity is
above ground. The cathode band should be placed
towards the line that is to be protected.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
Circuit Diagram
2003 Semtech Corp.
4
www.semtech.com
uClamp0501H
PROTECTION PRODUCTS
Outline Drawing - SOD-523
E
E1
B
DIM
A
b
c
D
E
E1
L
L1
aaa
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.019
.009
.003
.027
.059
.043
.003
.003
.023
-
-
.031
.063
.047
.008
.005
.008
.027
.013
.008
.035
.067
.051
.011
.008
0.50
0.25
0.10
0.70
1.50
1.10
0.10
0.10
0.60 0.70
-
0.35
-
0.20
0.80 0.90
1.60 1.70
1.20 1.30
0.20 0.30
0.15 0.20
0.20
D
2X b
aaa
C A B
A
A
SEATING
PLANE
C
L
c
NOTES:
L1
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
Land Pattern - SOD-523
Y
X
G
C
Z
DIM
C
G
X
Y
Z
DIMENSIONS
INCHES
MILLIMETERS
(.057)
.024
.018
.033
.090
(1.45)
0.60
0.45
0.85
2.30
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET
2003 Semtech Corp.
5
www.semtech.com
京公网安备 11010802033920号
EEWORLD
