Lite Drive is a trademark of Cypress Semiconductor Corporation.
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
• CA 95134 •
408-943-2600
December 17, 1996 - Revised April 20, 1998
CY74FCT163244
CY74FCT163H244
CY74FCT163LD244
CY74FCT163LDH244
Pin Description
Name
OE
A
Y
Data Inputs
[1]
Three-State Outputs
Description
Three-State Output Enable Inputs (Active LOW)
Maximum Ratings
[3,4]
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature................................. –55°C to +125°C
Ambient Temperature with
Power Applied............................................ –55°C to +125°C
Supply Voltage Range ......................................0.5V to +4.6V
Outputs
A
L
H
X
Y
L
H
Z
DC Input Voltage ............................................–0.5V to +7.0V
DC Output Voltage..........................................–0.5V to +7.0V
DC Output Current
(Maximum Sink Current/Pin) ........................ –60 to +120 mA
Power Dissipation .......................................................... 1.0W
Function Table
[2]
Inputs
OE
L
L
H
Operating Range
Range
Industrial
Ambient
Temperature
–40°C to +85°C
V
CC
2.7V to 3.6V
Electrical Characteristics for Non Bus Hold Devices
Over the Operating Range V
CC
=2.7V to 3.6V
Parameter
V
IH
V
IL
V
H
V
IK
I
IH
I
IL
I
OZH
I
OZL
I
OS
I
OFF
I
CC
∆I
CC
Description
Input HIGH Voltage
Input LOW Voltage
Input Hysteresis
[6]
Input Clamp Diode Voltage
Input HIGH Current
Input LOW Current
High Impedance Output Current
(Three-State Output pins)
High Impedance Output Current
(Three-State Output pins)
Short Circuit Current
[7]
Power-Off Disable
Quiescent Power Supply Current
Quiescent Power Supply Current
(TTL inputs HIGH)
V
CC
=Min., I
IN
=–18 mA
V
CC
=Max., V
I
=5.5
V
CC
=Max., V
I
=GND
V
CC
=Max., V
OUT
=5.5V
V
CC
=Max., V
OUT
=GND
V
CC
=Max., V
OUT
=GND
V
CC
=0V, V
OUT
≤4.5V
V
IN
≤0.2V,
V
IN
>V
CC
–0.2V
V
IN
=V
CC
–0.6V
[8]
V
CC
=Max.
V
CC
=Max.
0.1
2.0
–60
–135
100
–0.7
– 1.2
±1
±1
±1
±1
–240
±100
10
30
Test Conditions
All Inputs
Min.
2.0
Typ.
[5]
Max.
5.5
0.8
Unit
V
V
mV
V
µA
µA
µA
µA
mA
µA
µA
µA
Notes:
1. On the CY74FCT163H244 and the CY74FCT163LDH244 these pins have “bus hold.”
2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance.
3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature
range.
4. With the exception of inputs with bus hold, unused inputs must always be connected to an appropriate logic voltage level, preferably either V
CC
or ground.
5. Typical values are at V
CC
=3.3V, T
A
= +25°C ambient.
6. This parameter is guaranteed but not tested.
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, I
OS
tests should be performed last.
8. Per TTL driven input; all other inputs at V
CC
or GND.
2
CY74FCT163244
CY74FCT163H244
CY74FCT163LD244
CY74FCT163LDH244
Electrical Characteristics For Bus Hold Devices
Over the Operating Range V
CC
=2.7V to 3.6V
Parameter
V
IH
V
IL
V
H
V
IK
I
IH
I
IL
I
BBH
I
BBL
I
BHHO
I
BHLO
I
OZH
I
OZL
I
OS
I
OFF
I
CC
∆
ICC
Description
Input HIGH Voltage
Input LOW Voltage
Input Hysteresis
[6]
Input Clamp Diode Voltage
Input HIGH Current
Input LOW Current
Bus Hold Sustain Current on Bus Hold Input
[9]
V
CC
=Min.
V
I
=2.0V
V
I
=0.8V
Bus Hold Overdrive Current on Bus Hold Input
[9]
V
CC
=Max., V
I
=1.5V
High Impedance Output Current
(Three-State Output pins)
High Impedance Output Current
(Three-State Output pins)
Short Circuit Current
[7]
Power-Off Disable
Quiescent Power Supply Current
Quiescent Power supply Current
(TTL inputs HIGH)
V
CC
=Max., V
OUT
=V
CC
V
CC
=Max., V
OUT
=GND
V
CC
=Max., V
OUT
=GND
V
CC
=0V, V
OUT
≤4.5V
V
IN
≤0.2V,
V
IN
>V
CC
–0.2V
V
CC
=Max.
–60
–135
–50
+50
±500
±1
±1
–240
±100
+40
+350
V
CC
=Min., I
IN
=–18 mA
V
CC
=Max., V
I
=V
CC
100
–0.7
–1.2
±100
±100
Test Conditions
All Inputs
Min.
2.0
Typ.
[5]
Max.
V
CC
0.8
Unit
V
V
mV
V
µA
µA
µA
µA
µA
µA
µA
mA
µA
µA
µA
V
IN
=V
CC
–0.6V
[8]
V
CC
=Max.
Electrical Characteristics For Balanced Drive Devices
Over the Operating Range V
CC
=2.7V to 3.6V
Parameter
I
ODL
I
ODH
V
OH
Description
Output LOW Dynamic Current
[7]
Output HIGH Dynamic Current
[7]
Output HIGH Voltage
Test Conditions
V
CC
=3.3V, V
IN
=V
IH
or V
IL
, V
OUT
=1.5V
V
CC
=3.3V, V
IN
=V
IH
or V
IL
, V
OUT
=1.5V
V
CC
=Min., I
OH
= –0.1 mA
V
CC
=3.0V, I
OH
= –8 mA
V
CC
=3.0V, I
OH
= –24 mA
V
OL
Output LOW Voltage
V
CC
=Min., I
OL
= 0.1mA
V
CC
=Min., I
OL
= 24 mA
Notes:
9. Pins with bus hold are described in Pin Description.
10. V
OH
= V
CC
– 0.6V at rated current.
Min.
45
–45
V
CC
–0.2
2.4
[10]
2.0
Typ.
[5]
Max.
180
–180
Unit
mA
mA
V
3.0
3.0
0.2
0.3
0.55
V
V
V
3
CY74FCT163244
CY74FCT163H244
CY74FCT163LD244
CY74FCT163LDH244
Electrical Characteristics For Balanced Lite Drive Devices
Over the Operating Range V
CC
=3.0V to 3.6V
Parameter
I
ODL
I
ODH
V
OH
V
OL
Description
Output LOW Current
[7]
Output HIGH Current
[7]
Output HIGH Voltage
Output LOW Voltage
Test Conditions
V
CC
=3.3V, V
IN
=V
IH
or V
IL
, V
OUT
=1.5V
V
CC
=3.3V, V
IN
=V
IH
or V
IL
, V
OUT
=1.5V
V
CC
=3.0 V, I
OH
= –6 mA
V
CC
=3.0 V, I
OL
= 6 mA
Min.
15.0
–15.0
2.4
3.0
0.55
Typ.
[5]
Max.
45
-45
Unit
mA
mA
V
V
Capacitance
[6]
(T
A
= +25°C, f = 1.0 MHz)
Parameter
C
IN
C
OUT
Description
Input Capacitance
Output Capacitance
V
IN
= 0V
V
OUT
= 0V
Test Conditions
Typ.
[5]
4.5
5.5
Max.
6.0
8.0
Unit
pF
pF
Power Supply Characteristics
Parameter
I
CCD
Description
Dynamic Power Supply
Current
[10]
Total Power Supply
Current
[11]
Test Conditions
V
CC
=Max., One Input Toggling, V
IN
=V
CC
or
50% Duty Cycle,
V
IN
=GND
Outputs Open, OE=GND
V
CC
=Max., f
1
=10 MHz, 50%
V
IN
=V
CC
or
Duty Cycle, Outputs Open, One V
IN
=GND
Bit Toggling, OE=GND
V
IN
=V
CC
–0.6V or
V
IN
=GND
V
CC
=Max., f
1
=2.5 MHz, 50%
V
IN
=V
CC
or
Duty Cycle, Outputs Open, Six- V
IN
=GND
teen Bits Toggling, OE=GND
V
IN
=V
CC
–0.6V or
V
IN
=GND
Notes:
11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
= I
QUIESCENT
+ I
INPUTS
+ I
DYNAMIC
12. I
C
I
C
= I
CC
+∆I
CC
D
H
N
T
+I
CCD
(f
0
/2 + f
1
N
1
)
I
CC
= Quiescent Current with CMOS input levels
∆I
CC
= Power Supply Current for a TTL HIGH input (V
IN
=3.4V)
D
H
= Duty Cycle for TTL inputs HIGH
N
T
= Number of TTL inputs at D
H
I
CCD
= Dynamic Current caused by an input transition pair (HLH or LHL)
f
0
= Clock frequency for registered devices, otherwise zero
= Input signal frequency
f
1
N
1
= Number of inputs changing at f
1
All currents are in milliamps and all frequencies are in megahertz.
13. Values for these conditions are examples of the I
CC
formula. These limits are guaranteed but not tested.
Typ.
[5]
50
Max.
75
Unit
µA/MHz
I
C
0.5
0.5
2.0
2.0
0.8
0.8
3.0
[12]
3.3
[12]
mA
mA
mA
mA
4
CY74FCT163244
CY74FCT163H244
CY74FCT163LD244
CY74FCT163LDH244
Switching Characteristics
Over the Operating Range
V
CC
=3.0V to 3.6V
[14,15]
CY74FCT163244A
CY74FCT163H244A
Parameter
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
SK(O)
Description
Propagation Delay Data to
Output
Output Enable Time
Output Disable Time
Output Skew
[17]
Min.
1.5
1.5
1.5
Max.
4.8
6.2
5.6
0.5
CY74FCT163244C
CY74FCT163H244C
Min.
1.5
1.5
1.5
Max.
4.1
5.8
5.2
0.5
Unit
ns
ns
ns
ns
Fig. No.
[16]
1, 3
1, 7, 8
1, 7, 8
—
Switching Characteristics
Over the Operating Range
V
CC
=3.0V to 3.6V
[14,15]]
CY74FCT163LD244
[18]
CY74FCT163LDH244
Parameter
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
SK(O)
Description
Propagation Delay Data to
Output
Output Enable Time
Output Disable Time
Output Skew
[17]
Min.
1.5
1.5
1.5
Max.
6.5
8.0
7.0
0.5
CY74FCT163LD244A
[18]
CY74FCT163LDH244A
Min.
1.5
1.5
1.5
Max.
4.8
6.2
5.6
0.5
Unit
ns
ns
ns
ns
Fig. No.
[16]
1, 3
1, 7, 8
1, 7, 8
—
Notes:
14. Minimum limits are guaranteed but not tested on Propagation Delays.
15. For V
CC
=2.7, propagation delay, output enable and output disable times should be degraded by 20%.
16. See “Parameter Measurement Information” in the General Information section.
17. Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.
18. The load capacitance is 30 pF for Lite Drive devices. For all others it is 50 pF.
[i=s] This post was last edited by paulhyde on 2014-9-15 03:03 [/i] CNC DC regulated power supply, which has a detailed introduction and is very suitable for competitions...
Classic written test questions"Please use C to count the number of 1s in any number of any length."Don’t think this question is simple. It is a classic question in Microsoft’s written test and it is s...
Pull-up and pull-down issues of FPGA download mode configuration pinsMSEL[3..0] is configured as as mode msel0, msel2, msel3, pull down to ground, msel1 pull up to power. If no resistor is added: If t...
Why is ARM Developer Suite v1.2 Setup 100% stuck? No verification pop-up boxes appear. It just gets stuck. I have no choice but to press cancel to exit. Actually, it doesn't exit even after I press ca...
[i=s]This post was last edited by kandy11 on 2016-10-11 13:43[/i] Work location: near Wuhe subway station in Bantian, Shenzhen Work requirements: Familiar with 51 assembly language and C language, and...
Reflow soldering is a critical process in electronics assembly production, and the cleanliness of the reflow oven has a direct impact on product quality. Dust and residue accumulation within the ov...[Details]
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
"Have you set your calendar reminder?"
On August 24, Nvidia Robotics' official account posted a photo of a black gift box on a social media platform, with an attached greeting card sig...[Details]
As time goes by, people are increasingly concerned about their own and their families' health. However, existing monitoring devices for individual vital signs have struggled to gain market share du...[Details]
1 Source of creativity
With the further development of electronic technology, electronic pets have gradually entered people's family life. At present, there are two main categories of relative...[Details]
Overview
As handheld voice communication devices become more and more popular, they are increasingly used in noisy environments, such as airports, busy roads, crowded bars, etc. In such noisy ...[Details]
With the development of science, the use of variable frequency technology is becoming more and more widespread, and it is used in both industrial equipment and household appliances. Inverter air co...[Details]
Coal mines typically contain gas and coal dust. When gas and coal dust reach a certain concentration, they can cause explosions. Electrical equipment generates arcs during normal operation or durin...[Details]
Bosch has released a new SoC series to support L2+ advanced driver assistance functions. The chip integrates high resolution and long-range detection capabilities, and has built-in support for neur...[Details]
Intel®
Xeon®
6
-
core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
These new instances offer superior performance and fast...[Details]
As the power density of modern electronic systems continues to increase, effective thermal management has become critical to ensuring system performance, reliability, and longevity—especially in hi...[Details]
Reasons for the wear of the roller press reducer shaft:
1. Since the expansion sleeve is subjected to a large torque, the mating surfaces of the shaft and the sleeve move relative to each other...[Details]
ESD protection diodes are specialized for small-signal ESD protection or surge protection TVS arrays, often used for multi-circuit protection. Their small package size, low on-state voltage, high i...[Details]
Electronics engineers all know that transient voltage suppression (TVS) diodes are used to protect ports, preventing damage to downstream circuits caused by transient voltage surges. In short, TVS ...[Details]
Naxin Micro releases the NS800RT737x high-performance real-time control MCU (DSP), enabling core control in the industrial and energy sectors.
In power electronics and electric drive...[Details]