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TFLD646-100.0M

Description
SURFACE MOUNT 3.3V HCMOS TCXO
File Size175KB,2 Pages
ManufacturerConnor-Winfield
Websitehttp://www.conwin.com/
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TFLD646-100.0M Overview

SURFACE MOUNT 3.3V HCMOS TCXO

THE CONNOR-WINFIELD CORP.
2111 COMPREHENSIVE DRIVE.
AURORA, IL 60505.
FAX (630) 851-5040.
PHONE (630) 851-4722.
WWW.CONWIN.COM
PRODUCT
D AT A
SHEET
CRYSTAL CONTROLLED OSCILLATORS
SURFACE MOUNT 3.3V HCMOS TCXO
ABSOLU TE MAX IMUM RATING S
PARAMETER
Storage Temperature
Supply Voltage
UNITS
(Vcc)
MINIMUM
-40
-0.6
NOMINAL
-
-
MAXIMUM
85
6
UNITS
°C
Vdc
TABLE 1.0
NOTE
CW 0521
TFLD646
100M
TFLD646
DESCRIPTION
OPERATING SPECIFIC ATIONS
PARAMETER
Frequency Range
Frequency Calibration @ 25°C
Frequency Tolerance
Operating Temperature Range
Supply Voltage
Supply Current
Jitter (BW=10Hz to 20MHz)
Jitter (BW=12kHz to 20MHz)
(Fo)
MINIMUM
12.80
-1.5
-4.6
-40
3.135
-
-
-
NOMINAL
-
-
-
-
3.3
9
-
-
MAXIMUM
155.52
1.5
4.6
85
3.465
25
5
1
UNITS
MHz
ppm
ppm
°C
Vdc
mA
ps rms
ps rms
TABLE 2.0
NOTE
1
(Vcc)
(Icc)
PHASE NOISE CHARACTERISTICS
Typical Phase Noise Measurements @:
SSB Phase Noise at 10Hz offset
SSB Phase Noise at 100Hz offset
SSB Phase Noise at 1KHz offset
SSB Phase Noise at 10KHz offset
SSB Phase Noise at 100KHz offset
12.80
-60
-90
-120
-135
-145
77.76
-60
-90
-120
-135
-145
155.52
-50
-80
-115
-130
-140
MHz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
TABLE 4.0
The Connor-Winfield TFLD646 is
a Surface Mount Temperature
Compensated Crystal Oscillator
(TCXO). Operating at 3.3Vdc,
the TFLD646 will maintain
±4.6ppm frequency tolerance for
20 years over the Industrial
Temperature Range. The
TFLD646 is offered in a surface
mount package for automated
assembly.
FEATURES
HCMOS OUTPUT CHARACTERISTICS
PARAMETER
LOAD
Voltage
(High)
(Low)
(High)
(Low)
Duty Cycle at 50% of Vcc
Rise / Fall Time 10% to 90%
Current
MINIMUM
-
2.0
-
-8
-
45
NOMINAL
-
-
-
MAXIMUM
15
-
0.4
-
8
55
5
UNITS
pF
Vdc
Vdc
mA
mA
%
nS
TABLE 5.0
NOTE
3.3V OPERATION
OVERALL FREQUENCY TOLERANCE:
±4.6ppm OVER 20 YEARS.
TEMPERATURE RANGE: -40 to 85°C
LOW JITTER <1pS RMS
SURFACE MOUNT PACKAGE
(Voh)
(Vol)
(Ioh)
(Ioh)
-
-
50
3
PACKAG E CHARACTERISTICS
Package
TABLE 6.0
Non-hermetic package consisting of an FR4 substrate with grounded metal
cover.
TABLE 7.0
The component solder used internal to this device has a melting point of
221°C. The peak temperature inside the device should be less than or
equal to 220°C for a maximum of 10 seconds
Ultrasonic cleaning is not recommended.
TAPE AND REEL PACKAGING
PROCESS RECOMMENDATIONS
Solder Reflow
Wash
ORDERING INFORMATION
Note:
1) Inclusive of calibration, frequency vs. t emperature stability, supply voltage c hange, load
change, shock and vibration, 20 years ag ing.
TFLD646 - 100.0MHz
TCXO
SERIES
CENTER
FREQUENCY
Specifications subject to change without notice.
DATA SHEET #:
Tx138
PAGE
1
OF
2
REV:
00
DATE:
06/20/05
a
Copyright 2001 Connor-Winfield all rights reserved.

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