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LLZ39E

Description
Zener Diode, 38.33V V(Z), 2.52%, 0.5W, Silicon, Unidirectional, HERMETIC SEALED, GLASS, MINIMELF-2
CategoryDiscrete semiconductor    diode   
File Size645KB,6 Pages
ManufacturerMicro Commercial Components (MCC)
Download Datasheet Parametric View All

LLZ39E Overview

Zener Diode, 38.33V V(Z), 2.52%, 0.5W, Silicon, Unidirectional, HERMETIC SEALED, GLASS, MINIMELF-2

LLZ39E Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeMELF
package instructionO-LELF-R2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeO-LELF-R2
JESD-609 codee0
Number of components1
Number of terminals2
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)240
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage38.33 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperature30
Maximum voltage tolerance2.52%
Working test current5 mA
Base Number Matches1
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

  !"#
$ %    !"#
LLZ2V4
THRU
LLZ56
500mW Silicon
Zener Diodes
MINIMELF
Cathode Mark
Features
Hermetically Sealed Glass Package
Zener Voltage 2.4V to 56V
For Surface Mount Applications
Mechanical Data
Case: hermetically sealed glass
Polarity: Cathode indicated by polarity band
Junction ambient R
thJA
:
500 K/W
(Note:2)
Maximum Ratings
(Note:1)
Symbol
Max. Steady State Power
Dissipation at
Junction Temperature
Storage Temperature Range
P
D
T
J
T
STG
Value
500
175
-65 to 175
Units
B
C
mW
DIM
A
B
C
INCHES
MIN
.134
.008
.055
A
DIMENSIONS
MM
MIN
3.40
.20
1.40
Electrical Characteristics @ 25
Unless Otherwise Specified
Symbol
Max. Forward Voltage
I
F
=200mA
@
V
F
Value
1.5
Unit
V
MAX
.142
.016
.059
MAX
3.60
.40
1.50
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.105
NOTE: 1.Some part number series have lower JEDEC registered ratings.
2.On PC Board 50 mm x 50 mm x 1.6 mm
0.075”
0.030”
Revision: 1
www.mccsemi.com
2005/12/22
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