FBI2B5S2.......FBI2M5S2
2. Amp. Glass Passivated Bridge Rectifier
Dimensions in mm.
20
Plastic
Case
3.5
Voltage
100 to 1000 V.
Current
2.0 A.
®
+
1.5
1
+ 0.05
1.5
_
L
5
5
5
suffix
–4
1
0.5
• Glass Passivated Junction Chips.
•
UL recognized under component index file
number E130180.
•
Lead and polarity identifications.
•
Case: Molded Plastic.
•
Ideal for printed circuit board (P.C.B.).
•
The plastic material carries U/L recognition 94 V-O.
13.5
7
• Mounting Instructions
•
High temperature soldering guaranteed: 260 ºC – 10 sc.
•
Recommended mounting torque: 8 Kg.cm.
Maximum Ratings, according to IEC publication No. 134
FBI2B
5S2
FBI2D
5S2
200
140
80
FBI2F
5S2
300
210
125
FBI2J
5S2
600
420
250
FBI2L
5S2
900
630
380
FBI2M
5S2
1000
700
500
V
RRM
V
RMS
V
R
I
F(AV)
I
FRM
I
FSM
I
2
t
V
DIS
T
j
T
stg
Peak Recurrent Reverse Voltage (V)
Maximum RMS Voltage (V)
Recommended Input Voltage (V)
Max. Average forward current with heatsink
without heatsink
Recurrent peak forward current
10 ms. peak forward surge current
I
2
t value for fusing (t = 10 ms)
Dielectric strength
(terminals to case, AC 1 min.)
Operating temperature range
Storage temperature range
100
70
40
4.5 A at 65 ºC
2.0 A at 25 ºC
15 A
100 A
50 A
2
sec
1500 V
– 40 to + 150 °C
– 40 to +150 ºC
Electrical Characteristics at Tamb = 25°C
V
F
I
R
R
th (j-c)
R
th (j-a)
Max. forward voltage drop per element at I
F
=3 A
Max. reverse current per element at V
RRM
MAXIMUM THERMAL RESISTANCE
Junction-Case. With Heatsink.
Junction-Ambient. Without Heatsink.
1.1 V
5 A
12 ºC/W
40 ºC/W
Jan - 00
FBI2 - 5S2
Characteristic Curves
TYPICAL FORWARD CHARACTERISTIC
FORWARD CURRENT DERATING CURVE
4.5
Tamb = 25° C
10
4
heatsink
Tc
Tc
_
+
3
1.0
on glass-epoxi substrate
sine wave
R-load
on heatsink
_
+
2
0.1
1
P.C.B.
soldering land 5 mm ø
sine wave
R-load
free in air
0
0.6
1.0
1.4
V
F
, instantaneous forward voltage (V)
0
0
25
50
75 100 125 150 175
Tamb, ambient temperature (°C)
MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
100
75
50
25
0
1
10
Number of cycles at 50 Hz.
100
Jan - 00