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J116CYM9-12L

Description
RF Relay, DPDT, Momentary, 0.036A (Coil), 12VDC (Coil), 369mW (Coil), 1A (Contact), 28VDC (Contact), DC Input, AC/DC Output, Through Hole-Straight Mount
CategoryMechanical and electronic products    relay   
File Size675KB,6 Pages
ManufacturerTeledyne Technologies Incorporated
Websitehttp://www.teledyne.com/
Download Datasheet Parametric View All

J116CYM9-12L Overview

RF Relay, DPDT, Momentary, 0.036A (Coil), 12VDC (Coil), 369mW (Coil), 1A (Contact), 28VDC (Contact), DC Input, AC/DC Output, Through Hole-Straight Mount

J116CYM9-12L Parametric

Parameter NameAttribute value
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresWITH INTERNAL POWER MOSFET, ZENER DIODE
body width8.51 mm
body height6.99 mm
Body length or diameter11.05 mm
Maximum coil current (DC)0.036 A
Coil operating voltage (DC)9.8 V
Coil power369 mW
Coil release voltage (DC)0.36 V
Maximum coil voltage (DC)12 V
Coil/Input Power TypeDC
Contact (AC) maximum rated R load.25A@115VAC
Maximum contact current (AC)0.25 A
Maximum contact current (DC)1 A
Contact (DC) maximum rated R load1A@28VDC
Maximum contact voltage (AC)115 V
Maximum contact voltage (DC)28 V
Contact/Output Power TypeAC/DC
Electrical life100000 Cycle(s)
Manufacturer's serial number116C
Installation featuresTHROUGH HOLE-STRAIGHT MOUNT
operating hours4 ms
Maximum operating temperature125 °C
Minimum operating temperature-65 °C
physical size11.05mm X 8.51mm X 6.99mm
GuidelineMIL
Relay actionMOMENTARY
Relay functionDPDT
Relay typeRF RELAY
release time5.5 ms
sealHERMETICALLY SEALED
surface mountNO
switching time4 ms
Termination typeSOLDER
Base Number Matches1
ESTABLISHED RELIABILITY
CENTIGRID
®
ESTABLISHED RELIABILITY
RELAY
DPDT
CMOS COMPATIBLE
SERIES
DESIGNATION
116C
RELAY TYPE
SERIES
116C
DPDT general-purpose relay with internal power MOSFET driver, Zener
diode gate protection, and diode coil suppression
INTERNAL CONSTRUCTION
UNI-FRAME
DESCRIPTION
The 116C Centigrid
®
relay is an ultraminiature, hermetically sealed, armature
relay capable of being directly driven by most IC logic families. Its low profile
height and .100" grid spaced terminals, which preclude the need for spreader
pads, make it ideal for applications where extreme packaging density and/or
close PC board spacing are required.
The basic concept and internal mechanical structure are similar to the 114
DPDT relay. The following unique construction features and manufacturing
techniques provide overall high reliability and excellent resistance to
environmental extremes:
UPPER
STATIONARY
CONTACT
ARMATURE
LOWER
STATIONARY
CONTACT
MOVING CONTACT
• All welded construction.
• Unique uni-frame design providing high magnetic efficiency and mechanical
rigidity.
• High force/mass ratios for resistance to shock and vibration.
• Advanced cleaning techniques provide maximum assurance of internal
cleanliness.
• Precious metal alloy contact material with gold plating assures excellent
high current and dry circuit switching capabilities.
By virtue of its inherently low intercontact capacitance and contact circuit
losses, the 116C relay has proven to be an excellent ultraminiature RF switch
for frequency ranges well into the UHF spectrum. A typical RF application for
this Centigrid
®
relay is in handheld radio transceivers, wherein the combined
features of good RF performance, small size, low coil power dissipation and
high reliability make it a preferred method of Transmit-Receive switching (see
Figure 1).
The Series 116C utilizes an internal silicon diode for coil suppression, a Zener
diode to protect the MOSFET gate input, and an N-channel enhancement
mode MOSFET chip, which enables direct relay interfacing with most
Microprocessor and IC logic families (CMOS, TTL and MOS).
ENVIRONMENTAL AND
PHYSICAL SPECIFICATIONS
Temperature
(Ambient)
Vibration
(General Note 1)
Shock
(General Note 1)
Acceleration
Enclosure
Weight
©2003 TELEDYNE RELAYS
–65°C to +125°C
30 g’s to 3000 Hz
75 g’s,
6 msec, half-sine
50 g’s
Hermetically sealed
0.11 oz. (3.12g) max.
SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
www.teledynerelays.com
116C Page 44
116C/1203/Q1

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