KOA SPEER ELECTRONICS, INC.
SS-195 R6
AHA 6/29/06
Power Chip Inductors
Type LPC9040N
1. Scope
This specification shall be applied to the LPC9040N manufactured by KOA Corporation.
CERTIFIED
CERTIFIED
2. Dimensions and Construction
B
Size
45°±6°
C
A
F
Ferrite
Core
Magnet Ceramic
Wire
Substrate
Electrode
A
+.002
ø.354±
-.004
.
+0.05
(ø9.0
-0.1
)
Dimensions
inches
(mm)
B
C
D
F
R
D
1
9040N
.193 Max. .402 Max. .079±.008 .071±.008
(4.9 Max.) (10.2 Max.) (2.0±0.2) (1.8±0.2)
3. Type Designation
The type designation shall be the following form:
New Type
LPC
Type
9040N
Size
A
Termination
Material
A: SnAg
(Other termination
styles available,
contact factory
for options)
TED
Packaging
TED: 10" Embossed Plastic
500 pcs/reel
101
Nominal
Inductance
101: 100µH
221: 220µH
152: 1500µH
K
Tolerance
K: ±10%
M: ±20%
9040N
PAGE 1 OF 4
Bolivar Drive
I
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
I
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
KOA SPEER ELECTRONICS, INC.
SS-195 R6
4. Standard Applications
Part
Designation
LPC9040NATED100M
LPC9040NATED150K
LPC9040NATED220K
LPC9040NATED330K
LPC9040NATED470K
LPC9040NATED680K
LPC9040NATED101K
LPC9040NATED151K
LPC9040NATED221K
LPC9040NATED331K
LPC9040NATED471K
LPC9040NATED681K
Inductance
(µH)
10
15
22
33
47
68
100
150
220
330
470
680
Inductance
Tolerance
M: ±20%
Quality
Factor
Minimum
(MHz)
40
30
20
K: ±10%
10
Self Resonant
Frequency
Minimum
(MHz)
25.0
21.0
15.0
13.5
11.5
10.0
8.0
7.0
5.0
3.3
2.8
1.2
DC
Resistance
Maximum
(Ω)
0.07
0.09
0.11
0.14
0.20
0.27
0.41
0.55
0.81
1.86
2.07
2.65
Allowable
DC Current
Maximum
(Amps)
1.55
1.40
1.25
1.10
0.99
0.91
0.70
0.60
0.50
0.29
0.22
0.14
Measured
Frequency
(Hz)
10 kHz
5. Rating
No.
1
Item
Nominal inductance range
Specification
10
µ
~ 680
µ
H (E-6 series)
Heat fluctuation of DC resistance shall be calculated to 20°C using 0.4% for each 1°C. Measuring Conditions: Normal testing is
conducted at normal temperatures (5°C ~ 35°C) and at nominal humidity (45% ~ 85% R. H.). If there is concern, the test may be
conducted at a temperature of 20 ± 2°C and at a relative humidity of 65 ± 5% R. H.
6. Environmental Characteristics
No.
1
2
3
4
5
6
7
8
9
10
Item
High temperature, leaving test
Low temperature, leaving test
Moisture leaving test
Heat shock test
Vibration test
Temperature Characteristics
Operating temperature range
Storage temperature range
Resistance to soldering heat
Resistance to solvent
Test Methods
85 ± 2°C 500 Hr
-40 ± 2°C 500 Hr
40 ± 2°C 90 ~ 95% R. H. 500 Hr
-25 ± 2°C/0.5 Hr
85 ± 2°C/0.5 Hr
85°C
0.5 Hr
100 cycles
-25°C
2 hours in each direction of X, Y, Z at a frequency
range of 10 ~ 55 Hz with 1.5 mm /min.
Standard
Within ± 5%
Within ± 5%
Within ± 5%
Within ± 5%
Within ± 5%
-40°C/+85°C Reference to L at +25°C
Within ± 10%
-30°C ~ +80°C
-40°C ~ +85°C
With the temperature of the solder at 260 ±5°C,
soak for 10 ± 1 seconds. There shall be no abnormalities.
MIL-STD-202F Method 215
There shall be no abnormalities under the above conditions.
Measurement: Inductance HIOKI 3520 DC Superposed characteristics LCR Meter YHP 4262A DC Resistance HIOKI 3520
Frequency: Inductance 1 KHz DC Superposed characteristics 10 KHz
PAGE 2 OF 4
Bolivar Drive
I
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
I
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
KOA SPEER ELECTRONICS, INC.
SS-195 R6
7. Packaging
7.1 Direction of Travel
Perform taping so that the grooved section (R1)
is in the opposite direction of travel.
7.2 Taping
The tapes for taping shall be embossed carrier tapes of 16 mm width
and 12 mm pitches. The standard quantity per reel shall be 500 pieces.
7.3 Dimensions of Carrier Tape
Top tape seperation strength: 20 ~ 70 g.
1.75
±
0.05
2.0
±
0.05
4.0
±
0.1
ø1.5
+0.1
-0
2.0
±
0.05
2.2
±
0.1
Terminal 1
start
ø4.0
±
0.1
7.5 Markings
The following information is provided
on the reel.
(1) Product name (2) Part number (3) Quality
(4) Lot number (5) Manufacture origin
7.5
±
0.05
2
±
0.5
ø13
±
0.5
ø80
(unit: mm)
16.0
±
0.3
ø9.4
-0.2
Terminal 2
0.3
±
0.1
+0
2.0
-0.2
+0
45°
1.0
-0.2
+0
12.0
±
0.1
ø21
±
0.8
ø380
2.0
17.0
(unit: mm)
7.6 Packaging Method
A specially designed cardboard box is used
for the external packaging and can hold a
maximum of 15 reels.
...
...
Empty
Heat
7.4 Packaging Method
End
...
...
... ..
... ..
Filled
7.7 Lot Number
Tape leader
Empty
40 mm min.
(Example) January 21, 2006
500 pieces 50 mm min. 150 mm min.
Feed Direction
41
Year and
Month of
Manufacture
21
D
K
Additional
Number
Manufacture
Day of
Plant
Manufacture
41...2006.1 42...2006.2 43...2006.3
PAGE 3 OF 4
Bolivar Drive
I
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
I
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
KOA SPEER ELECTRONICS, INC.
SS-195 R6
8. General Information
8.1 Storage
Chip inductors shall not be stored under high
temperature and high humidity conditions.
Especially, do not store taping where they are
exposed to heat or direct sunlight, otherwise,
material may be deformed, causing problems
during mounting.
8.2 Mounting
Placement force should not be excessive.
8.3 Soldering
When using a soldering iron, temperature
shall not exceed 350°C and within 3 seconds.
Soldering iron time shall be allowed only one
time. After soldering, chip inductors shall not
be stressed excessively.
8.4 Cleaning
There is no problem using organic solvents.
Since these chip inductors are a coil of
ultra-thin wire, they are susceptible to
vibration. If an ultrasonic cleaning unit is
used, check for any possibility of problem
generation before practical use, since such
cleaning units differ considerably in vibration
level and mode. Although the conditions
vary depending on the printed board size,
Ultrasonic cleaning is generally used in
the conditions described in the following
examples:
Power:
Within 20W/L
Cleaning times: Within 5 minutes
8.5 Pattern Design
When low or more chip inductors are closely
mounted, they must be separated by means
of solder resists to prevent excessive solder.
9. Soldering
9.1 Conditions for
Reflow Soldering
The time and temperature
for reflow solder applications
are as shown below.
Temperature (°C)
230
10. Land Pattern
Design
(unit: mm)
11. Packaging Box
(unit: mm)
Content marking
380
200
160
Time
Within 90
seconds
Within 30
seconds
Within 45
seconds
Within 6
seconds
2.6
±
0.2
4.0
±
0.2
3.0
±
0.2
380
7
PAGE 4 OF 4
Bolivar Drive
I
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
I
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
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