HY23C04200S-120 datasheet, PDF

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HY23C04200S-120: DescriptionMASK ROM, 256KX16, 120ns, CMOS, PDSO40, 0.500 INCH, PLASTIC, SOP-40; Categorystorage storage; File Size87KB，6 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY23C04200S-120 Overview

MASK ROM, 256KX16, 120ns, CMOS, PDSO40, 0.500 INCH, PLASTIC, SOP-40

HY23C04200S-120 Parametric

Parameter Name	Attribute value
Parts packaging code	SOIC
package instruction	SOP,
Contacts	40
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	120 ns
Spare memory width	8
JESD-30 code	R-PDSO-G40
length	26.3 mm
memory density	4194304 bit
Memory IC Type	MASK ROM
memory width	16
Number of functions	1
Number of terminals	40
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX16
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	3.2 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	11.3 mm
Base Number Matches	1

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HY23C04200

Description

256K X16/512K X8 BIT

CMOS MASK ROM

The HY23C04200 high performance read only memory is organized either as 524,288 x 8 bit

(byte mode) or as 262,144 x 16 bit(word mode) followed by BHE mode select. The low power

feature allows the battery operation. The large size of 4M bit memory density is ideal for

character generator, data or program memory in micro-processor application. And a high speed

access of 70/100/120ns(max) is most suitable to the system using a high speed micro-computer

by 16bits. The HY23C04200 is packaged 40pin DIP or 40 pin SOP.

Key features

• Switchable Organization

Byte Mode : 524,288 X 8 bit

Word Mode : 262,144 X 16 bit

• Single 5V power supply operation

• Access Time : 70/100/120ns (Max)

• Standby Current : 50 (Max)

• Operating Current : 60 (Max)

• TTL compatible inputs and outputs

• 3-State outputs for wired-OR expansion

• Word or Byte switchable by BHE pin

• Programmable CE or OE pin

• Fully static operation

• Package

HY23C04200S

: 40pin Plastic DIP(600 mil)

HY23C04200D

: 40pin Plastic SOP(500mil)

Pin Description

A0~A17

Q0~Q14

Q15/A-1

BHE

CEB*

OEB*

VCC

VSS

Function

Address inputs

Data Outputs

Output Q15(Word Mode)/

LSB Address(Byte Mode)

Byte High Enable input

(Word/Byte selection)

Chip Enable input

Output Enable input

Power supply

Ground

Pin Configuration

A17

CEB

VSS

OEB

Q10

Q11

40DIP

A10

A11

A12

A13

A14

A15

A16

BHE

VSS

Q15/A-1

Q14

Q13

Q12

VCC

A17

CEB

VSS

OEB

Q10

Q11

A10

A11

A12

A13

A14

A15

A16

BHE

VSS

Q15/A-1

Q14

Q13

Q12

VCC

40SOP

HY23C04200D

HY23C04200S

Rev0 Page 1 of 6

ARTCHIPs

HY23C04200S-120 Related Products

	HY23C04200S-120	HY23C04200D-70	HY23C04200D-120	HY23C04200S-70
Description	MASK ROM, 256KX16, 120ns, CMOS, PDSO40, 0.500 INCH, PLASTIC, SOP-40	MASK ROM, 256KX16, 70ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40	MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40	MASK ROM, 256KX16, 70ns, CMOS, PDSO40, 0.500 INCH, PLASTIC, SOP-40
Parts packaging code	SOIC	DIP	DIP	SOIC
package instruction	SOP,	DIP,	DIP,	SOP,
Contacts	40	40	40	40
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	120 ns	70 ns	120 ns	70 ns
Spare memory width	8	8	8	8
JESD-30 code	R-PDSO-G40	R-PDIP-T40	R-PDIP-T40	R-PDSO-G40
length	26.3 mm	52.451 mm	52.451 mm	26.3 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	16	16	16	16
Number of functions	1	1	1	1
Number of terminals	40	40	40	40
word count	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	256KX16	256KX16	256KX16	256KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	DIP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.2 mm	4.926 mm	4.926 mm	3.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
width	11.3 mm	15.24 mm	15.24 mm	11.3 mm
Maker	-	SK Hynix	SK Hynix	SK Hynix

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Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

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