CXK5971P-30 datasheet, PDF - EEWORLD Datasheet

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CXK5971P-30: DescriptionStandard SRAM, 8KX9, 30ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size229KB，10 Pages; ManufacturerSONY; Websitehttp://www.sony.co.jp

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CXK5971P-30 Overview

Standard SRAM, 8KX9, 30ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

CXK5971P-30 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP, DIP28,.3
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	30 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	35.1 mm
memory density	73728 bit
Memory IC Type	STANDARD SRAM
memory width	9
Number of functions	1
Number of ports	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX9
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.4 mm
Maximum standby current	0.0001 A
Minimum standby current	2 V
Maximum slew rate	0.09 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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CXK5971P-30 Related Products

	CXK5971P-30	CXK5971M-30	CXK5971P-35	CXK5971M-25	CXK5971J-30	CXK5971J-35	CXK5971M-35	CXK5971P-25	CXK5971J-25
Description	Standard SRAM, 8KX9, 30ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	Standard SRAM, 8KX9, 30ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28	Standard SRAM, 8KX9, 35ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	Standard SRAM, 8KX9, 25ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28	Standard SRAM, 8KX9, 30ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 8KX9, 35ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 8KX9, 35ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28	Standard SRAM, 8KX9, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	Standard SRAM, 8KX9, 25ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	SOIC	DIP	SOIC	SOJ	SOJ	SOIC	DIP	SOJ
package instruction	DIP, DIP28,.3	SOP, SOP28,.5	DIP, DIP28,.3	SOP, SOP28,.5	SOJ, SOJ28,.34	SOJ, SOJ28,.34	SOP, SOP28,.5	DIP, DIP28,.3	SOJ, SOJ28,.34
Contacts	28	28	28	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	30 ns	30 ns	35 ns	25 ns	30 ns	35 ns	35 ns	25 ns	25 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T28	R-PDSO-G28	R-PDIP-T28	R-PDSO-G28	R-PDSO-J28	R-PDSO-J28	R-PDSO-G28	R-PDIP-T28	R-PDSO-J28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	35.1 mm	18 mm	35.1 mm	18 mm	18.42 mm	18.42 mm	18 mm	35.1 mm	18.42 mm
memory density	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	9	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	8KX9	8KX9	8KX9	8KX9	8KX9	8KX9	8KX9	8KX9	8KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	DIP	SOP	SOJ	SOJ	SOP	DIP	SOJ
Encapsulate equivalent code	DIP28,.3	SOP28,.5	DIP28,.3	SOP28,.5	SOJ28,.34	SOJ28,.34	SOP28,.5	DIP28,.3	SOJ28,.34
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.4 mm	2.7 mm	4.4 mm	2.7 mm	3.75 mm	3.75 mm	2.7 mm	4.4 mm	3.75 mm
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Minimum standby current	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	0.09 mA	0.09 mA	0.09 mA	0.09 mA	0.09 mA	0.09 mA	0.09 mA	0.09 mA	0.09 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	YES	YES	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	J BEND	J BEND	GULL WING	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	8.4 mm	7.62 mm	8.4 mm	7.62 mm	7.62 mm	8.4 mm	7.62 mm	7.62 mm
Maker	-	SONY	SONY	SONY	SONY	SONY	SONY	SONY	SONY

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