TMP95CW86DF datasheet, PDF - EEWORLD Datasheet

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TMP95CW86DF: DescriptionIC MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100, Microcontroller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size12MB，245 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TMP95CW86DF Overview

IC MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100, Microcontroller

TMP95CW86DF Parametric

Parameter Name	Attribute value
Parts packaging code	QFP
package instruction	LFQFP, QFP100,.63SQ,20
Contacts	100
Reach Compliance Code	unknown
bit size	16
CPU series	TLCS-900/H
JESD-30 code	S-PQFP-G100
length	14 mm
Number of terminals	100
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	4096
rom(word)	65536
ROM programmability	MROM
Maximum seat height	1.6 mm
speed	20 MHz
Maximum slew rate	60 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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TMP95CW86DF Related Products

	TMP95CW86DF	TMP95FW86DF	TMP95CW86F
Description	IC MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100, Microcontroller	IC MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100, Microcontroller	IC MICROCONTROLLER, PQFP100, 22 X 22 MM, 0.80 MM PITCH, PLASTIC, QFP-100, Microcontroller
Parts packaging code	QFP	QFP	QFP
package instruction	LFQFP, QFP100,.63SQ,20	LFQFP, QFP100,.63SQ,20	QFP, QFP100,1.0SQ,32
Contacts	100	100	100
Reach Compliance Code	unknown	unknown	unknown
bit size	16	16	16
CPU series	TLCS-900/H	TLCS-900/H	TLCS-900/H
JESD-30 code	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100
length	14 mm	14 mm	22 mm
Number of terminals	100	100	100
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP	QFP
Encapsulate equivalent code	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,1.0SQ,32
Package shape	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	4096	4096	4096
rom(word)	65536	65536	65536
ROM programmability	MROM	FLASH	MROM
speed	20 MHz	20 MHz	20 MHz
Maximum slew rate	60 mA	60 mA	60 mA
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.8 mm
Terminal location	QUAD	QUAD	QUAD
width	14 mm	14 mm	22 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Maximum seat height	1.6 mm	1.6 mm	-
Base Number Matches	1	1	-
Maker	-	Toshiba Semiconductor	Toshiba Semiconductor

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