'2001.5.7
SC82 120mA LDO REGULATOR
R1141Q SERIES
s
OUTLINE
The R1141Q Series are voltage regulator ICs with high output voltage accuracy, low supply current, low ON-resistance, and
high ripple rejection by CMOS process. Each of these voltage regulator ICs consists of a voltage reference unit, an error
amplifier, resistors for setting Output Voltage, a current limit circuit, and a chip enable circuit.
Output Current Limit circuit is embedded in the R1141Q Series to prevent the break down of the IC caused by excess current.
Chip enable circuit realizes standby mode and makes consumption current extremely small.
These ICs perform with low dropout voltage and a chip enable function. The line transient response and load transient
response of the R1141Q Series are excellent, thus these ICs are very suitable for the power supply for hand-held
communication equipment.
The output voltage of these ICs is internally fixed with high accuracy. Since the package for these ICs is SC-82AB (Super
Mini-mold) package, high density mounting of the ICs on boards is possible.
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FEATURES
Ultra-Low Supply Current......................................... TYP. 90µA
Standby Mode ........................................................... TYP. 0.1µA
Low Dropout Voltage ................................................ TYP. 0.15V(I
OUT
=100mA Output Voltage=3.0V Type)
High Ripple Rejection ............................................... TYP. 75dB(V
OUT
≤2.4V),70dB(V
OUT
≥2.5V)
(f=1kHz)
Low Temperature-Drift Coefficient of Output Voltage TYP. ±100ppm/°C
Excellent Line Regulation ......................................... TYP. 0.05%/V
High Output Voltage Accuracy.................................. ±1.5% or
±30mV(V
OUT
≤2.0V)
Excellent Dynamic Response
Small Package ..........................................................SC-82AB(Super Mini-mold)
Output Voltage...........................................................Stepwise setting with a step of 0.1V in the range of 1.5V to 4.0V is
possible
Built-in chip enable circuit (B/D: active high)
Built-in fold-back protection circuit ..........................TYP. 40mA (Current at short mode)
Ceramic capacitor can be used for Output pin..........Recommended value is 2.2µF or more.
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APPLICATIONS
Power source for cellular phones such as GSM, CDMA and various kinds of PCS.
Power source for electrical appliances such as cameras, VCRs, camcorders, and hand-held communication equipment.
Power source for battery-powered equipment.
Very stable Voltage Reference
Rev. 1.10
-1-
s
BLOCK DIAGRAM
R1141QXX1B
R1141QXX1D
V
OUT
4
V
DD
Vref
Current Limit
1
-
+
GND
4
V
DD
Vref
Current Limit
1
-
+
GND
V
OUT
CE
3
2
CE
3
2
s
SELECTION GUIDE
The output voltage, mask option, and the taping type for the ICs can be selected at the user's request. The selection can be made
with designating the part number as shown below;
R1141QXX1X-XX
←Part
Number
↑ ↑ ↑ ↑
a b c d
Code
a
b
c
d
Contents
Designation of Package Type :
Q:SC82-AB (Super Mini-mold)
Setting Output Voltage (V
OUT
) :
Stepwise setting with a step of 0.1V in the range of 1.5V to 4.0V is possible.
Designation of Mask Option :
B: Without auto discharge function at OFF state.
D: With auto discharge function at OFF state.
Designation of Taping Type :
Ex. TR, TL (refer to Taping Specifications; TR type is the standard direction.)
Rev. 1.10
-2-
s
TECHNICAL NOTES
When using these ICs, consider the following points:
Phase Compensation
In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, be
sure to use a 2.2µF or more capacitor C
OUT
with good frequency characteristics and ESR (Equivalent Series Resistance).
(Note: When the additional ceramic capacitors are connected to the Output Pin with Output capacitor for phase compensation,
the operation might be unstable. Because of this, test these ICs with as same external components as ones to be used on the
PCB.)
PCB Layout
Make VDD and GND line sufficient. When the impedance of these is high, it would be a cause of picking up the noise or
unstable operation. Connect a capacitor with as much as 1.0µF capacitor between V
DD
and GND pin as close as possible.
Set external components, especially output capacitor as close as possible to the ICs and make wiring shortest.
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TEST CIRCUITS
1
V
OUT
I
OUT
V
OUT
V
C2
V
DD
R1141Q
SERIES
4
2
GND
CE
3
C1
*
C1 = Ceramic 1.0µF
C2 = Ceramic 2.2µF
Fig.1 Standard test Circuit
1
V
OUT
C2
V
DD
R1141Q
SERIES
CE
4
A
3
C1
I
SS
2
GND
*
C1 = Ceramic1.0µF
C2 = Ceramic 2.2µF
Fig.2 Supply Current Test Circuit
Rev. 1.10
-5-
Microcontroller MCU
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