LAN88710AM/LAN88710BM
Small Footprint MII/RMII 10/100
Ethernet Transceiver for Automotive
Applications
PRODUCT FEATURES
Highlights
Designed and tested for automotive applications
Single-Chip Ethernet Physical Layer Transceiver
(PHY)
Comprehensive flexPWR
®
technology
— Flexible power management architecture
— LVCMOS Variable I/O voltage range: +1.6 V to +3.6 V
— Integrated 1.2 V regulator with disable feature
Datasheet
Key Benefits
High-performance 10/100 Ethernet transceiver
—
—
—
—
—
—
—
—
Compliant with IEEE802.3/802.3u (Fast Ethernet)
Compliant with ISO 802-3/IEEE 802.3 (10BASE-T)
Loop-back modes
Auto-negotiation
Automatic polarity detection and correction
Link status change wake-up detection
Vendor specific register functions
Supports both MII and the reduced pin count RMII
interfaces
HP Auto-MDIX support
Small footprint 32-pin QFN lead-free RoHS compliant
package (5 x 5 x 0.9 mm height)
Power and I/Os
—
—
—
—
Various low power modes
Integrated power-on reset circuit
Two status LED outputs
Latch-Up performance exceeds 150 mA
per EIA/JESD 78, Class II
— May be used with a single 3.3 V supply
Target Applications
Diagnostic interface
(for dealership service bay)
Fast software download
(e.g., OBD connector)
Gateway service interface
(dealership, aftermarket repair shop)
In-Vehicle engineering development interface
Vehicle manufacturing test interface
(production plant assembly line)
Legislated inspections
(emissions check, safety inspections)
Additional Features
— Ability to use a low cost 25 MHz crystal for reduced
BOM
Packaging
— 32-pin QFN (5 x 5 mm) lead-free RoHS compliant
package with MII and RMII
Environmental
— Automotive grade A temp. support (-40°C to +85°C)
— Automotive grade B temp. support (-40°C to +105°C)
SMSC LAN88710AM/LAN88710BM
Revision 1.1 (05-26-10)
DATASHEET
Small Footprint MII/RMII 10/100 Ethernet Transceiver for Automotive Applications
Datasheet
ORDER NUMBER(S):
LAN88710AM (Tray) FOR 32-PIN, QFN LEAD-FREE ROHS COMPLIANT PACKAGE (-40 TO +85°C TEMP)
LAN88710AMR (Tape & Reel) FOR 32-PIN, QFN LEAD-FREE ROHS COMPLIANT PACKAGE (-40 TO +85°C TEMP)
LAN88710BM (Tray) FOR 32-PIN, QFN LEAD-FREE ROHS COMPLIANT PACKAGE (-40 TO +105°C TEMP)
LAN88710BMR (Tape & Reel) FOR 32-PIN, QFN LEAD-FREE ROHS COMPLIANT PACKAGE (-40 TO +105°C TEMP)
The table above represents valid part numbers at the time of printing and may not represent parts that are currently available. For
the latest list of valid ordering numbers for this product, please contact the nearest sales office. For sales offices, please refer to
the last page.
TrueAuto™
TrueAuto is SMSC's automotive quality process. It has proven its ability to deliver leading-edge quality
and services for IC device products to fulfill the needs of the most demanding automotive customers.
TrueAuto is a proven total automotive-grade quality approach. TrueAuto IC device robustness begins
with SMSC’s design for reliability techniques within the silicon IC itself: automotive-grade robustness
and testability are designed into the IC. Once available in silicon, the IC is fully-characterized and
qualified over a multitude of operating parameters to prove quality under the harshest conditions. In
this, SMSC’s TrueAuto approach significantly exceeds the usual automotive reliability standards and
customer-specific requirements and goes far beyond the stress tests prescribed by the AEC-Q100
specifications. During the fabrication of TrueAuto products, extensive technologies and processes, such
as enhanced monitors are used in order to continuously drive improvements in accordance with
SMSC’s zero Defects per Million (DPM) goals.
80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000, FAX (631) 273-3123
Copyright © 2010 SMSC or its subsidiaries. All rights reserved.
Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for
construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC
reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications
before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent
rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated
version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors
known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not
designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property
damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of
this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a registered
trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.
SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY,
FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE
OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL
DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT;
TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD
TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Revision 1.1 (05-26-10)
2
SMSC LAN88710AM/LAN88710BM
DATASHEET
Small Footprint MII/RMII 10/100 Ethernet Transceiver for Automotive Applications
Datasheet
Table of Contents
Chapter 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.1
1.2
General Terms and Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Chapter 2 Pin Description and Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1
2.2
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Buffer Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Chapter 3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1
Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.1
100BASE-TX Transmit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.2
100BASE-TX Receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.3
10BASE-T Transmit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.4
10BASE-T Receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Auto-Negotiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.1
Parallel Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.2
Restarting Auto-Negotiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.3
Disabling Auto-Negotiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.4
Half vs. Full Duplex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HP Auto-MDIX Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MAC Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.1
MII . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.2
RMII . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.3
MII vs. RMII Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Serial Management Interface (SMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.1
Primary Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.2
Alternate Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Configuration Straps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.1
PHYAD[2:0]: PHY Address Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.2
MODE[2:0]: Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.3
RMIISEL: MII/RMII Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.4
REGOFF: Internal +1.2 V Regulator Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.5
nINTSEL: nINT/TXER/TXD4 Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Miscellaneous Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.1
LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.2
Variable Voltage I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.3
Power-Down Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.4
Isolate Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.5
Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.6
Carrier Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.7
Collision Detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.8
Link Integrity Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.9
Loopback Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Application Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9.1
Simplified System Level Application Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9.2
Power Supply Diagram (1.2 V Supplied by Internal Regulator). . . . . . . . . . . . . . . . . . . .
3.9.3
Power Supply Diagram (1.2 V Supplied by External Source) . . . . . . . . . . . . . . . . . . . . .
3
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
19
19
23
26
27
28
29
29
30
30
30
31
31
32
33
34
35
35
36
37
37
38
39
39
40
41
41
42
42
43
43
44
44
44
45
47
47
48
49
SMSC LAN88710AM/LAN88710BM
Revision 1.1 (05-26-10)
DATASHEET
Small Footprint MII/RMII 10/100 Ethernet Transceiver for Automotive Applications
Datasheet
3.9.4
3.9.5
Twisted-Pair Interface Diagram (Single Power Supply). . . . . . . . . . . . . . . . . . . . . . . . . . 50
Twisted-Pair Interface Diagram (Dual Power Supplies) . . . . . . . . . . . . . . . . . . . . . . . . . 51
Chapter 4 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
4.1
4.2
Register Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control and Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.1
Basic Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.2
Basic Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.3
PHY Identifier 1 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.4
PHY Identifier 2 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.5
Auto Negotiation Advertisement Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.6
Auto Negotiation Link Partner Ability Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.7
Auto Negotiation Expansion Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.8
Mode Control/Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.9
Special Modes Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.10 Symbol Error Counter Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.11 Special Control/Status Indications Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.12 Interrupt Source Flag Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.13 Interrupt Mask Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.14 PHY Special Control/Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
52
53
54
55
56
56
57
58
59
60
61
61
62
63
63
64
Chapter 5 Operational Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
5.1
5.2
5.3
5.4
5.5
5.6
Absolute Maximum Ratings*. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Conditions** . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6.1
Equivalent Test Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6.2
Power Sequence Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6.3
Power-On nRST & Configuration Strap Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6.4
MII Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6.5
RMII Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6.6
SMI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clock Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
65
66
66
67
68
70
70
71
72
73
75
76
77
5.7
Chapter 6 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Chapter 7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Revision 1.1 (05-26-10)
4
SMSC LAN88710AM/LAN88710BM
DATASHEET
Small Footprint MII/RMII 10/100 Ethernet Transceiver for Automotive Applications
Datasheet
List of Figures
Figure 1.1
Figure 1.2
Figure 2.1
Figure 3.1
Figure 3.2
Figure 3.3
Figure 3.4
Figure 3.5
Figure 3.6
Figure 3.7
Figure 3.8
Figure 3.9
Figure 3.10
Figure 3.11
Figure 3.12
Figure 3.13
Figure 3.14
Figure 5.1
Figure 5.2
Figure 5.3
Figure 5.4
Figure 5.5
Figure 5.6
Figure 5.7
System Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
32-QFN Pin Assignments (TOP VIEW) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Relationship Between Received Data and Specific MII Signals . . . . . . . . . . . . . . . . . . . . . . 24
Direct Cable Connection vs. Cross-over Cable Connection . . . . . . . . . . . . . . . . . . . . . . . . . 30
MDIO Timing and Frame Structure - READ Cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
MDIO Timing and Frame Structure - WRITE Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
LED1/REGOFF Polarity Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
LED2/nINTSEL Polarity Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Near-end Loopback Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Far Loopback Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Connector Loopback Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Simplified System Level Application Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Power Supply Diagram (1.2 V Supplied by Internal Regulator) . . . . . . . . . . . . . . . . . . . . . . . 48
Power Supply Diagram (1.2 V Supplied by External Source) . . . . . . . . . . . . . . . . . . . . . . . . 49
Twisted-Pair Interface Diagram (Single Power Supply) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Twisted-Pair Interface Diagram (Dual Power Supplies). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Output Equivalent Test Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Power Sequence Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Power-On nRST & Configuration Strap Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
MII Transmit Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
MII Receive Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
RMII Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
SMI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
SMSC LAN88710AM/LAN88710BM
5
Revision 1.1 (05-26-10)
DATASHEET
京公网安备 11010802033920号
EEWORLD
