Data Sheet
November 2006
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Features
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ORCA
®
Series 3C and 3T
Field-Programmable Gate Arrays
ble logic cell (PLC), with over 50% speed improvement
typical.
Abundant hierarchical routing resources based on rout-
ing two data nibbles and two control lines per set provide
for faster place and route implementations and less rout-
ing delay.
TTL or CMOS input levels programmable per pin for the
OR3Cxx (5.0 V) devices.
Individually programmable drive capability:
12 mA sink/6 mA source or 6 mA sink/3 mA source.
Built-in boundary scan (
IEEE
†
1149.1 JTAG) and
TS_ALL testability function to 3-state all I/O pins.
Enhanced system clock routing for low skew, high-speed
clocks originating on-chip or at any I/O.
Up to four ExpressCLK inputs allow extremely fast clock-
ing of signals on- and off-chip plus access to internal
general clock routing.
StopCLK feature to glitchlessly stop/start ExpressCLKs
independently by user command.
Programmable I/O (PIO) has:
— Fast-capture input latch and input flip-flop (FF) latch
for reduced input setup time and zero hold time.
— Capability to (de)multiplex I/O signals.
— Fast access to SLIC for decodes and
PAL
-like
functions.
— Output FF and two-signal function generator to
reduce CLK to output propagation delay.
— Fast open-drain dive capability
— Capability to register 3-state enable signal.
Baseline FPGA family used in Series 3+ FPSCs (field
programmable system chips) which combine FPGA logic
and standard cell logic on one device.
High-performance, cost-effective, 0.35 µm (OR3C) and
0.3 µm (OR3T) 4-level metal technology, (4- or 5-input
look-up table delay of 1.1 ns with -7 speed grade in
0.3 µm).
Same basic architecture as lower-voltage, advanced
process technology Series 3 architectures. (See
ORCA
Series 3L FPGA documentation.)
Up to 186,000 usable gates.
Up to 342 user I/Os. (OR3Txxx I/Os are 5 V tolerant to
allow interconnection to both 3.3 V and 5 V devices,
selectable on a per-pin basis.)
Pin selectable I/O clamping diodes provide 5 V or 3.3 V
PCI compliance and 5 V tolerance on OR3Txxx devices.
Twin-quad programmable function unit (PFU) architec-
ture with eight 16-bit look-up tables (LUTs) per PFU,
organized in two nibbles for use in nibble- or byte-wide
functions. Allows for mixed arithmetic and logic functions
in a single PFU.
Nine user registers per PFU, one following each LUT,
plus one extra. All have programmable clock enable and
local set/reset, plus a global set/reset that can be dis-
abled per PFU.
Flexible input structure (FINS) of the PFUs provides a
routability enhancement for LUTs with shared inputs and
the logic flexibility of LUTs with independent inputs.
Fast-carry logic and routing to adjacent PFUs for nibble-,
byte-wide, or longer arithmetic functions, with the option
to register the PFU carry-out.
Softwired LUTs (SWL) allow fast cascading of up to
three levels of LUT logic in a single PFU for up to 40%
speed improvement.
Supplemental logic and interconnect cell (SLIC) pro-
vides 3-statable buffers, up to 10-bit decoder, and
PAL
*-
like AND-OR with optional INVERT in each programma-
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*
PAL
is a trademark of Advanced Micro Devices, Inc.
†
IEEE
is a registered trademark of The Institute of Electrical and
Electronics Engineers, Inc.
Table 1.
ORCA
Series 3 (3C and 3T) FPGAs
Device
System
Gates
‡
36K
48K
80K
116K
186K
LUTs
1152
1568
2592
3872
6272
Registers
1872
2436
3780
5412
8400
Max User RAM
18K
25K
42K
62K
100K
Max User
I/Os
192
221
288
342
342
Array Size
12 x 12
14 x 14
18 x 18
22 x 22
28 x 28
Process
Technology
OR3T20
OR3T30
OR3T55
OR3C/3T80
OR3T125
0.3 µm/4 LM
0.3 µm/4 LM
0.3 µm/4 LM
0.3 µm/4 LM
0.3 µm/4 LM
‡ The system gate counts range from a logic-only gate count to a gate count assuming 30% of the PFUs/SLICs being used as RAMs.
The logic-only gate count includes each PFU/SLIC (counted as 108 gates per PFU/SLIC), including 12 gates per LUT/FF pair (eight per
PFU), and 12 gates per SLIC/FF pair (one per PFU). Each of the four PIOs per PIC is counted as 16 gates (two FFs, fast-capture latch,
output logic, CLK drivers, and I/O buffers). PFUs used as RAM are counted at four gates per bit, with each PFU capable of implementing
a 32 x 4 RAM (or 512 gates) per PFU.
ORCA
Series 3C and 3T FPGAs
Data Sheet
November 2006
Table of Contents
Contents
Page
Contents
Page
Features ......................................................................1
System-Level Features................................................4
Description...................................................................5
FPGA Overview ..........................................................5
PLC Logic ...................................................................5
Description (continued)................................................6
PIC Logic ....................................................................6
System Features ........................................................6
Routing .......................................................................6
Configuration ..............................................................6
Description (continued)................................................7
ispLEVER Development System ................................7
Architecture .................................................................7
Programmable Logic Cells ..........................................9
Programmable Function Unit ......................................9
Look-Up Table Operating Modes .............................11
Supplemental Logic and Interconnect Cell (SLIC).....19
PLC Latches/Flip-Flops ............................................23
PLC Routing Resources ...........................................25
PLC Architectural Description ...................................32
rogrammable Input/Output Cells................................34
5 V Tolerant I/O ........................................................35
PCI Compliant I/O .....................................................35
Inputs ........................................................................36
Outputs .....................................................................39
PIC Routing Resources ............................................42
PIC Architectural Description ....................................43
High-Level Routing Resources..................................45
Interquad Routing .....................................................45
Programmable Corner Cell Routing .........................46
PIC Interquad (MID) Routing ....................................47
Clock Distribution Network ........................................48
PFU Clock Sources ..................................................48
Clock Distribution in the PLC Array ..........................49
Clock Sources to the PLC Array ...............................50
Clocks in the PICs ....................................................50
ExpressCLK Inputs ...................................................51
Selecting Clock Input Pins ........................................51
Special Function Blocks ............................................52
Single Function Blocks .............................................52
Boundary Scan .........................................................55
Microprocessor Interface (MPI) .................................62
PowerPC System .....................................................63
i960 System ..............................................................64
MPI Interface to FPGA .............................................65
MPI Setup and Control .............................................66
Programmable Clock Manager (PCM) ......................70
PCM Registers .........................................................71
Delay-Locked Loop (DLL) Mode ...............................73
Phase-Locked Loop (PLL) Mode ..............................74
PCM/FPGA Internal Interface ...................................77
PCM Operation .........................................................77
2
PCM Detailed Programming .................................... 78
PCM Applications .................................................... 81
PCM Cautions ......................................................... 82
FPGA States of Operation........................................ 83
Initialization .............................................................. 83
Configuration ........................................................... 84
Start-Up ................................................................... 85
Reconfiguration ....................................................... 86
Partial Reconfiguration ............................................ 86
Other Configuration Options .................................... 86
Using ispLEVER to Generate
Configuration RAM Data ....................................... 87
Configuration Data Frame ....................................... 87
Bit Stream Error Checking ....................................... 89
FPGA Configuration Modes...................................... 90
Master Parallel Mode ............................................... 90
Master Serial Mode ................................................. 91
Asynchronous Peripheral Mode .............................. 92
Microprocessor Interface (MPI) Mode ..................... 92
Slave Serial Mode ................................................... 95
Slave Parallel Mode ................................................. 95
Daisy-Chaining ........................................................ 96
Daisy-Chaining with Boundary Scan ....................... 97
Absolute Maximum Ratings...................................... 98
Recommended Operating Conditions ..................... 98
Electrical Characteristics .......................................... 99
Timing Characteristic Description .......................... 101
Description ............................................................. 101
PFU Timing ........................................................... 102
PLC Timing ............................................................ 109
SLIC Timing ........................................................... 109
PIO Timing ............................................................. 110
Special Function Blocks Timing ............................. 113
Clock Timing .......................................................... 121
Configuration Timing ............................................. 131
Readback Timing ................................................... 140
Input/Output Buffer Measurement Conditions ........ 141
Output Buffer Characteristics ................................. 142
OR3Cxx ................................................................. 142
OR3Txxx ................................................................ 143
Estimating Power Dissipation ................................. 144
OR3Cxx ................................................................. 144
OR3Txxx................................................................. 145
Pin Information ....................................................... 147
Pin Descriptions...................................................... 147
Package Compatibility ........................................... 151
Compatibility with OR2C/TxxA Series .................... 152
Package Thermal Characteristics........................... 188
FPGA Maximum Junction Temperature ................ 190
Package Coplanarity .............................................. 191
Package Parasitics ................................................. 191
Package Outline Diagrams..................................... 192
Lattice Semiconductor
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Embedded System
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