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Datasheet> All Categories > storage> storage> M372V0803DT0-C60
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M372V0803DT0-C60

Description
Fast Page DRAM Module, 8MX72, 60ns, CMOS, DIMM-168
Categorystorage    storage   
File Size416KB，18 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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M372V0803DT0-C60 Overview

Fast Page DRAM Module, 8MX72, 60ns, CMOS, DIMM-168

M372V0803DT0-C60 Parametric

Parameter NameAttribute value
Parts packaging codeDIMM
package instructionDIMM, DIMM168
Contacts168
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE
Maximum access time60 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O typeCOMMON
JESD-30 codeR-XDMA-N168
memory density603979776 bit
Memory IC TypeFAST PAGE DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals168
word count8388608 words
character code8000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX72
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM168
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height31.75 mm
Maximum standby current0.03 A
Maximum slew rate0.9 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1

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Download Datasheet
DRAM MODULE
M372V080(8)3DJ(T)0-C
M372V080(8)3DJ(T)0-C Fast Page Mode
8Mx72 DRAM DIMM with ECC Using 8Mx8, 4K & 8K Refresh, 3.3V
GENERAL DESCRIPTION
The Samsung M372V080(8)3DJ(T)0-C is a 8Mx72bits
Dynamic RAM high density memory module. The Samsung
M372V080(8)3DJ(T)0-C consists of nine CMOS 8Mx8bits
DRAMs in SOJ/TSOP-II 400mil packages and two 16 bits
driver IC in TSSOP package mounted on a 168-pin glass-
epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is
mounted on the printed circuit board for each DRAM. The
M372V080(8)3DJ(T)0-C is a Dual In-line Memory Module and
is intended for mounting into 168 pin edge connector sockets.
FEATURES
• Part Identification
Part number
M372V0803DJ0-C
M372V0803DT0-C
M372V0883DJ0-C
M372V0883DT0-C
•
•
•
•
•
•
•
•
PKG
SOJ
TSOP
SOJ
TSOP
Ref.
4K
8K
CBR Ref.
ROR Ref.
4K/64ms
4K/64ms
8K/64ms
PERFORMANCE RANGE
Speed
-C50
-C60
t
RAC
50ns
60ns
t
CAC
18ns
20ns
t
RC
90ns
110ns
t
PC
35ns
40ns
Fast Page Mode Operation
CAS-before-RAS Refresh capability
RAS-only and Hidden refresh capability
LVTTL compatible inputs and outputs
Single 3.3V±0.3V power supply
JEDEC standard pinout & Buffered PDpin
Buffered input except RAS and DQ
PCB : Height(1250mil), single sided component
PIN CONFIGURATIONS
Pin Front Pin Front Pin Front
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
V
SS
DQ0
DQ1
DQ2
DQ3
V
CC
DQ4
DQ5
DQ6
DQ7
DQ8
V
SS
DQ9
DQ10
DQ11
DQ12
DQ13
V
CC
DQ14
DQ15
DQ16
DQ17
V
SS
RSVD
RSVD
V
CC
W0
CAS0
29 *CAS2 57
30 RAS0 58
31
OE0 59
32
V
SS
60
33
A0
61
34
A2
62
35
A4
63
36
A6
64
37
A8
65
38
A10
66
39
A12
67
40
V
CC
68
41 RFU 69
42 RFU 70
43
V
SS
71
44
OE2 72
45 RAS2 73
46 CAS4 74
47 *CAS6 75
48
76
W2
49
77
V
CC
50 RSVD 78
51 RSVD 79
52 DQ18 80
53 DQ19 81
54
V
SS
82
55 DQ20 83
56 DQ21 84
DQ22
DQ23
V
CC
DQ24
RFU
RFU
RFU
RFU
DQ25
DQ26
DQ27
V
SS
DQ28
DQ29
DQ30
DQ31
V
CC
DQ32
DQ33
DQ34
DQ35
V
SS
PD1
PD3
PD5
PD7
ID0
V
CC
Pin
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
Back
V
SS
DQ36
DQ37
DQ38
DQ39
V
CC
DQ40
DQ41
DQ42
DQ43
DQ44
V
SS
DQ45
DQ46
DQ47
DQ48
DQ49
V
CC
DQ50
DQ51
DQ52
DQ53
V
SS
RSVD
RSVD
V
CC
RFU
*CAS1
Pin
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
Back
*CAS3
*RAS1
RFU
V
SS
A1
A3
A5
A7
A9
A11
*A13
V
CC
RFU
B0
V
SS
RFU
*RAS3
*CAS5
*CAS7
PDE
V
CC
RSVD
RSVD
DQ54
DQ55
V
SS
DQ56
DQ57
Pin
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
Back
DQ58
DQ59
V
CC
DQ60
RFU
RFU
RFU
RFU
DQ61
DQ62
DQ63
V
SS
DQ64
DQ65
DQ66
DQ67
V
CC
DQ68
DQ69
DQ70
DQ71
V
SS
PD2
PD4
PD6
PD8
ID1
V
CC
PIN NAMES
Pin Names
A0, B0, A1 - A11
A0, B0, A1 - A12
DQ0 - DQ71
W0, W2
OE0, OE2
RAS0, RAS2
CAS0, CAS4
V
CC
V
SS
NC
PDE
PD1 - 8
ID0 - 1
RSVD
RFU
Function
Address Input(4K ref.)
Address Input(8K ref.)
Data In/Out
Read/Write Enable
Output Enable
Row Address Strobe
Column Address Strobe
Power(+3.3V)
Ground
No Connection
Presence Detect Enable
Presence Detect
ID bit
Reserved Use
Reserved for Future Use
Pins marked
′
*
′
are not used in this module.
PD & ID Table
Pin
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PD8
ID0
ID1
50NS
1
0
1
1
0
0
0
0
0
0
60NS
1
0
1
1
0
1
1
0
0
0
NOTE : A12 is used for only M372V0883DJ0/DT0-C (8K Ref.)
PD Note :PD & ID Terminals must each be pulled up through a register to V
CC
at the next higher
level assembly. PDs will be either open (NC) or driven to V
SS
via on-board buffer circuits.
PD : 0 for Vol of Drive IC & 1 for N.C
ID Note : IDs will be either open (NC) or connected directly to V
SS
without a buffer.
ID : 0 for Vss & 1 for N.C
REV. 0.1 Oct. 2000

M372V0803DT0-C60 Related Products

M372V0803DT0-C60 M372V0803DJ0-C60 M372V0883DJ0-C60 M372V0803DT0-C50 M372V0803DJ0-C50 M372V0883DJ0-C50 M372V0883DT0-C50 M372V0883DT0-C60
Description Fast Page DRAM Module, 8MX72, 60ns, CMOS, DIMM-168 Fast Page DRAM Module, 8MX72, 60ns, CMOS, DIMM-168 Fast Page DRAM Module, 8MX72, 60ns, CMOS, DIMM-168 Fast Page DRAM Module, 8MX72, 50ns, CMOS, DIMM-168 Fast Page DRAM Module, 8MX72, 50ns, CMOS, DIMM-168 Fast Page DRAM Module, 8MX72, 50ns, CMOS, DIMM-168 Fast Page DRAM Module, 8MX72, 50ns, CMOS, DIMM-168 Fast Page DRAM Module, 8MX72, 60ns, CMOS, DIMM-168
Parts packaging code DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM
package instruction DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168
Contacts 168 168 168 168 168 168 168 168
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
Maximum access time 60 ns 60 ns 60 ns 50 ns 50 ns 50 ns 50 ns 60 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168
memory density 603979776 bit 603979776 bit 603979776 bit 603979776 bit 603979776 bit 603979776 bit 603979776 bit 603979776 bi
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
memory width 72 72 72 72 72 72 72 72
Number of functions 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1
Number of terminals 168 168 168 168 168 168 168 168
word count 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words
character code 8000000 8000000 8000000 8000000 8000000 8000000 8000000 8000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 8MX72 8MX72 8MX72 8MX72 8MX72 8MX72 8MX72 8MX72
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM
Encapsulate equivalent code DIMM168 DIMM168 DIMM168 DIMM168 DIMM168 DIMM168 DIMM168 DIMM168
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 4096 4096 8192 4096 4096 8192 8192 8192
Maximum standby current 0.03 A 0.03 A 0.03 A 0.03 A 0.03 A 0.03 A 0.03 A 0.03 A
Maximum slew rate 0.9 mA 0.9 mA 0.9 mA 0.99 mA 0.99 mA 0.99 mA 0.99 mA 0.9 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maker - SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG

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