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SMA5C39-TP-HF

Description
Zener Diode, 39V V(Z), 5.1%, 3W,
CategoryDiscrete semiconductor    diode   
File Size301KB,3 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

SMA5C39-TP-HF Overview

Zener Diode, 39V V(Z), 5.1%, 3W,

SMA5C39-TP-HF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Reach Compliance Codenot_compliant
ECCN codeEAR99
ConfigurationSINGLE
Diode typeZENER DIODE
Maximum dynamic impedance50 Ω
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Maximum operating temperature150 °C
Peak Reflow Temperature (Celsius)260
Maximum power dissipation3 W
Nominal reference voltage39 V
surface mountYES
Terminal surfaceTin (Sn)
Maximum time at peak reflow temperature10
Maximum voltage tolerance5.1%
Base Number Matches1
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
SMA5C3V3
THRU
SMA5C39
3.0 Watt
Surface Mount
Silicon
Zener Diodes

Features
Surface Mount Application
3.3
thru 39 Volt Voltage Range
High reliability
Glass Passivated Junction
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Mechanical Data
Halogen
free available upon request by adding suffix "-HF"
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
Maximum temperature for soldering: 260 C for 10 seconds.
0
DO-214AC

(SMA) (LEAD FRAME)
H



J
Maximum Ratings @ 25
o
C Unless Otherwise Specified
A
C
Maximum
Forward
Voltage
V
F
1.2V
(Note:
2)
E
F
G
D
B
Power
Dissipation
Operation and
Storage
Temperature
Thermal
Resistance
NOTES:
P
D
T
J
,
T
STG
3.0W
-65
C to
+150
o
C
o
(Note:3)
DIM
A
B
C
D
E
F
G
H
J
INCHES
MIN
.079
.050
.002
---
.030
.065
.189
.157
.090
MAX
.096
.064
.008
.02
.060
.091
.220
.181
.115
DIMENSIONS
MM
MIN
2.00
1.27
.05
---
.76
1.65
4.80
4.00
2.25
Junction
to
Lead
R
thJL
25
/W
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090”
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
2.
Forward Current @ 200mA.
3.
Ambient Temperature at Ta=60
o
C
0.085”
0.070"
Revision:
C
www.mccsemi.com
1 of 3
2013/04/26
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