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WF128K32-120H1M5A

Description
Flash Module, 128KX32, 120ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Categorystorage    storage   
File Size431KB,16 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

WF128K32-120H1M5A Overview

Flash Module, 128KX32, 120ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

WF128K32-120H1M5A Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instruction1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Codeunknown
Maximum access time120 ns
Data pollingYES
JESD-30 codeS-CPGA-P66
JESD-609 codee0
length27.3 mm
memory density4194304 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of departments/size8
Number of terminals66
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
page size128 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height4.34 mm
Department size16K
Maximum standby current0.0065 A
Maximum slew rate0.2 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width27.3 mm
Base Number Matches1
WF128K32-XXX5
128K
X
32 5V FLASH MODULE, SMD 5962-94716
FEATURES
n
Access Times of 50*, 60, 70, 90, 120, 150ns
n
n
5 Volt Programming. 5V ± 10% Supply
n
Low Power CMOS, 1mA Standby Typical
n
Embedded Erase and Program Algorithms
n
TTL Compatible Inputs and CMOS Outputs
n
Built-in Decoupling Caps and Multiple Ground Pins for
Packaging:
•66 pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
•68 lead, Hermetic CQFP (G2U) , 22.4mm (0.880 inch)
square, 3.56mm (0.140 inch) high (Package 510)
•68 lead, Hermetic CQFP (G1U), 23.9mm (0.940 inch)
square, 3.56mm (0.140 inch) high (Package 519)
•68 lead, Hermetic CQFP (G1T), 23.9mm (0.940 inch)
square, 4.06mm (0.160 inch) high (Package 524)
1
Low Noise Operation
n
n
Page Program Operation and Internal Program Control
Time
Weight
WF128K32-XG1UX5 - 5 grams typical
WF128K32-XG1TX5 - 5 grams typical
WF128K32-XG2UX5
1
- 8 grams typical
WF128K32-XH1X5 - 13 grams typical
n
Sector Architecture
•8 equal size sectors of 16KBytes each
•Any combination of sectors can be concurrently
erased.
Also supports full chip erase
n
100,000 Erase/Program Cycles Typical, 0°C to +70°C
n
Organized as 128Kx32
n
Commercial, Industrial and Military Temperature Ranges
Note 1: Package Not Recommended For New Design
Note: For programming information refer to Flash Programming 1M5
Application Note.
* The access time of 50ns is available in Industrial and Commercial temperature
ranges only.
FIG. 1
PIN CONFIGURATION FOR WF128K32N-XH1X5
TOP VIEW
PIN DESCRIPTION
I/O
0-31
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
V
CC
CS
4
WE
4
I/O
27
A
4
A
5
A
6
WE
3
CS
3
GND
I/O
19
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
NC
I/O
0
I/O
1
I/O
2
WE
2
CS
2
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
NC
I/O
3
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
A
0-16
WE
1-4
CS
1-4
OE
V
CC
GND
NC
BLOCK DIAGRAM
June 2002 Rev. 5
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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