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DPZ512X32IV3-15C

Description
Flash Module, 512KX32, 150ns, CPGA66, 1.090 X 1.090 INCH, 0.470 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Categorystorage    storage   
File Size893KB,13 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DPZ512X32IV3-15C Overview

Flash Module, 512KX32, 150ns, CPGA66, 1.090 X 1.090 INCH, 0.470 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

DPZ512X32IV3-15C Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codePGA
package instructionPGA, PGA66,11X11
Contacts66
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time150 ns
Spare memory width16
Data pollingNO
JESD-30 codeS-CPGA-P66
JESD-609 codee0
memory density16777216 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals66
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX32
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply5 V
Programming voltage12 V
Certification statusNot Qualified
Maximum seat height10.16 mm
Maximum standby current0.0016 A
Maximum slew rate0.13 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
switch bitNO
typeNOR TYPE
Base Number Matches1
16 MEGABIT FLASH EEPROM
DPZ512X32IV3
DESCRIPTION:
The DPZ512X32IV3 ‘’VERSA-STACK’’ module is a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers
(SLCC) mounted on a co-fired ceramic substrate. It offers
16 Megabits of FLASH EEPROM in a single package
envelope of 1.090" x 1.090" x .470".
The DPZ512X32IV3 is built with eight SLCC packages
each containing two 128K x 8 FLASH memory devices.
Each SLCC is hermetically sealed making the module
suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Versa-Stack’’ family of modules
offers a higher board density of memory than available
with conventional through-hole, surface mount, module
or hybrid techniques.
FEATURES:
Organization:
512K x 32, 1 Meg x 16
Fast Access Times (max.):
120, 150, 170, 200, 250ns
Fully Static Operation
- No clock or refresh required
TTL Compatible Inputs
and Outputs
Common Data Inputs
and Outputs
10,000 Erase/Program
Cycles (min.)
66 - Pin PGA ‘’VERSA-STACK’’
Package
FUNCTIONAL BLOCK DIAGRAM
PIN-OUT DIAGRAM
PIN NAMES
A0 - A16
I/O0 - I/O31
CE0 - CE7
WE0, WE1
OE
V
PP
V
DD
V
SS
N.C.
Address Inputs
Data Input/Output
Chip Enables
Write Enables
Output Enable
Programming
Voltage (+12.0V)
Power (+5V)
Ground
No Connect
30A072-12
REV. C
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
1

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