47213-1010 datasheet, PDF - EEWORLD Datasheet

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47213-1010: DescriptionLGA Socket 771; File Size85KB，2 Pages; ManufacturerMolex; Websitehttps://www.molex.com/molex/home

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47213-1010 Overview

LGA Socket 771

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FEATURES AND SPECIFICATIONS

1.09mm (.043") by

1.17mm (.046") Pitch

LGA Socket 771

47213

Vertical

Surface Mount

Molex offers the 771-pin LGA CPU Socket for the Intel Dempsey

Platform Processor

Socket 771 is the first Computer Processing Unit (CPU) socket to be used on the

server/workstation industry featuring the Land Grid Array (LGA) contact design.

This socket is commonly known as Socket J, Socket 771 and LGA 771. This socket

mates with the 771 LGA CPU package (gold pads) to form the processing unit of the

application. Previous design uses the Pin Grid Array (PGA) socket or Micro-PGA

socket (such as socket 604) mated with PGA CPU package. The 771-pin LGA CPU

and Socket will replace the Socket 604 in Intel®Xeon® processor line.

Molex’s high density LGA sockets features our low profile design, the shepard hook

actuation lever and a flat or raised pick and place cover for the assembly process.

All Molex’s LGA sockets comes with lead or lead-free BGA solder balls.

Features

• High-temperature thermoplastic

housing

• Pick-&-place cover and Jedec hard

packaging tray

• LGA contact/BGA solder

• Lead free BGA solder balls

• Shepard hook actuation lever

• Flat or raised pick & place cover

• Visible triangle pin 1 identification on

housing, pick & place cover, stiffener

plate.

• West alignment key.

• 2 finger cutouts on north and south

side

Benefits

• Withstands lead-free processing

• Facilitates automation socket

placement

• Prevents CPU misalignment

• Compliant with environmental needs

• For easy actuation

• Raised cover facilitates easy removal

• Ensure correct CPU loading

• Prevent Socket 775 CPU from mating

to socket 771.

• For easy CPU removal

SPECIFICATIONS

Reference Information

Packaging: JEDEC Thick Handling Hard Tray

UL File No.: E29179

Mates With: Intel®Xeon® Processor family(771-pin Package)

Designed In: Millimeters

Electrical

Voltage: 30V

Current: 0.8A

Contact Resistance: 15.2 milliohms max. average,

28.0 milliohms max. chain

Dielectric Withstanding Voltage: 360V AC

Insulation Resistance: 500 Megohms min.

Mechanical

Insertion Force to Socket: Zero Insertion Force

Durability: 20 cycles

Physical

Housing: LCP, UL 94V-0

Contact: Copper Alloy

Plating:

Contact Area — 0.38 um (15u”) Gold

Solder Tail Area —

Underplating — Nickel

Operating Temperature: -40 to +90°C

47213-1010 Related Products

	47213-1010	47213-0005	47213-0000	47213-0010	47213-0015	47213-1015
Description	LGA Socket 771	LGA Socket 771	LGA Socket 771	LGA Socket 771	LGA Socket 771	LGA Socket 771

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