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MS235RAA30NJSN

Description
General Purpose Inductor, 0.03uH, 5%, 1 Element, Ceramic-Core, SMD, 0502, CHIP, 0402
CategoryPassive components    inductor   
File Size143KB,2 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

MS235RAA30NJSN Overview

General Purpose Inductor, 0.03uH, 5%, 1 Element, Ceramic-Core, SMD, 0502, CHIP, 0402

MS235RAA30NJSN Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instruction0502
Reach Compliance Codecompliant
ECCN codeEAR99
uppercase and lowercase codes0502
structureChip
core materialCERAMIC
DC Resistance0.41 Ω
Nominal inductance(L)0.03 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee0
Number of functions1
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.66 mm
Package length1.19 mm
Package formSMT
Package width0.64 mm
method of packingTR, Paper, 7 Inch
Minimum quality factor (at nominal inductance)24
Maximum rated current0.4 A
self resonant frequency2350 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency250 MHz
Tolerance5%
Base Number Matches1
0402 CHIP INDUCTORS
High-Reliability Chip Inductors
MS235RAA
This 0402 size chip inductor series shares all of the
characteristics of Coilcraft’s other ceramic inductors: ex-
ceptionally high Q factors, especially at use frequencies;
outstanding self-resonant frequency; tight inductance
tolerance; and excellent batch-to-batch consistency.
This robust version of Coilcraft’s standard 0402CS series
features high temperature materials that allow operation
in ambient temperatures up to 155°C and a leach-resis-
tant base metalization with tin-lead (Sn-Pb) terminations
that ensures the best possible board adhesion.
Current Derating
120
110
100
90
80
70
60
50
30
20
10
0
-40
-20
0
20
40
60
80
100
120
140 160
40
Percent of rated
I
rms
Typical L vs Frequency
30
27 nH
25
Ambient temperature (°C)
19 nH
Inductance (nH)
20
25°C
15
12 nH
10
5.6 nH
1 nH
0
1
10
100
1000
10000
B
overall
C
D
Pick and
place
surface
I
H
F
A
G
F
J
I
5
E
terminal
Frequency (MHz)
Terminal wraparound:
approx 0.007/0,18 both ends
Suggested
Land Pattern
Typical Q vs Frequency
120
110
100
90
80
12 nH
5.6 nH
19 nH
27 nH
1 nH
A
max
0.047
1,19
B
max
0.025
0,64
C
max
0,66
D
ref
0,25
E
0,51
F
0,23
G
0,56
H
0,66
I
0,36
J
0,46
0.026 0.010 0.020 0.009 0.022 0.026 0.014 0.018
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to
B
and
0.006 in / 0,15 mm to
A
and
C.
Core material
Ceramic
Terminations
Tin-lead (63/37) over silver-palladium-platinum-glass frit
Ambient temperature
–55°C to +125°C with
Imax
current, +125°C
to +155°C with derated current
Storage temperature
Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Q Factor
70
60
50
40
30
20
10
0
1
10
100
1000
10000
Frequency (MHz)
®
Enhanced crush-resistant packaging
2000 per 7″ reel
Paper tape: 8 mm wide, 0.68 mm thick, 2 mm pocket spacing
Document MS198-1 Revised 06/12/13
© Coilcraft, Inc. 2013
1102 Silver Lake Road
Cary, IL 60013
Phone 800-981-0363
Fax 847-639-1508
Email cps@coilcraft.com
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.
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