Serial IO/Communication Controller, Hybrid, CQIP78
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Data Device Corporation |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XQIP-P78 |
| JESD-609 code | e0 |
| Number of terminals | 78 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | QIP |
| Encapsulate equivalent code | QUIP78B,1.5/1.7 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5,-15 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| surface mount | NO |
| technology | HYBRID |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| BUS-61559-883B | BUS-61571-883B | BUS-61561-601 | BUS-61560-883B | BUS-61561-B | BUS-61561-883B | BUS-61559-B | BUS-61560 | BUS-61571-601 | BUS-61571-B | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Serial IO/Communication Controller, Hybrid, CQIP78 | Serial IO/Communication Controller, Hybrid, CDFP82 | Serial IO/Communication Controller, CMOS, MQIP78 | Serial IO/Communication Controller, Hybrid, CQIP78 | Serial IO/Communication Controller, CMOS, MQIP78 | Serial IO/Communication Controller, CMOS, CQIP78 | Serial IO/Communication Controller, Hybrid, MQIP78 | Serial IO/Communication Controller, Hybrid, MQIP78 | Serial IO/Communication Controller, Hybrid, MDFP82 | Serial IO/Communication Controller, Hybrid, MDFP82 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknow | compliant | unknown | compliant | compliant | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XQIP-P78 | R-XDFP-F82 | R-MQIP-P78 | R-XQIP-P78 | R-MQIP-P78 | R-XQIP-P78 | R-MQIP-P78 | R-MQIP-P78 | R-MDFP-F82 | R-MDFP-F82 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 78 | 82 | 78 | 78 | 78 | 78 | 78 | 78 | 82 | 82 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | METAL | CERAMIC | METAL | CERAMIC | METAL | METAL | METAL | METAL |
| encapsulated code | QIP | DFP | QIP | QIP | QIP | QIP | QIP | QIP | DFP | DFP |
| Encapsulate equivalent code | QUIP78B,1.5/1.7 | FL82,1.6 | QUIP78B,1.5/1.7 | QUIP78B,1.5/1.7 | QUIP78B,1.5/1.7 | QUIP78B,1.5/1.7 | QUIP78B,1.5/1.7 | QUIP78B,1.5/1.7 | FL82,1.6 | FL82,1.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK |
| power supply | 5,-15 V | 5 V | 5 V | 5,-12 V | 5 V | 5 V | 5,-15 V | 5,-12 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | YES | NO | NO | NO | NO | NO | NO | YES | YES |
| technology | HYBRID | HYBRID | CMOS | HYBRID | CMOS | CMOS | HYBRID | HYBRID | HYBRID | HYBRID |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG | FLAT | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | FLAT | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | DUAL | DUAL |
| Maker | Data Device Corporation | - | Data Device Corporation | Data Device Corporation | Data Device Corporation | Data Device Corporation | Data Device Corporation | - | Data Device Corporation | Data Device Corporation |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) | - | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| Nominal supply voltage | - | 5 V | 5 V | - | 5 V | 5 V | - | - | 5 V | 5 V |
| package instruction | - | - | QIP, QUIP78B,1.5/1.7 | QIP, QUIP78B,1.5/1.7 | QIP, QUIP78B,1.5/1.7 | QIP, QUIP78B,1.5/1.7 | - | QIP, QUIP78B,1.5/1.7 | DFP, FL82,1.6 | - |