Ultra High Performance BGA Cooling
Solutions w/ maxiGRIP™ Attachment
ATS PART # ATS-51400D-C2-R0
Features & Benefits
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maxiFLOW™ design features a low profile, spread fin
array that maximizes surface area for more effective
convection (air) cooling
maxiGRIP™ attachment applies steady, even pressure to
the component and does not require holes in the PCB
Meets Telcordia GR-63-Core Office Vibration; ETSI 300
019 Transportation Vibration; and MIL-STD-810 Shock and
Unpackaged Drop Testing standards
Comes preassembled with high performance thermal
interface material
Designed for low profile components from 1.5 to 2.99mm
C
D
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B
A
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thermal Performance
AIR VELOCITy
*Image above is for illustration purposes only.
THERMAL RESISTANCE
FT/MIN
200
300
400
500
600
700
800
M/S
1.0
1.5
2.0
2.5
3.0
3.5
4.0
°C/W (UNDUCTED FLOW)
4.5
3.4
2.9
2.6
2.4
2.2
2
°C/W (DUCTED FLOW)
2.8
Product Details
DIMENSION A
40 mm
Notes:
1)
2)
3)
4)
5)
DIMENSION B
40 mm
DIMENSION C
9.5 mm
DIMENSION D
56.5 mm
INTERFACE MATERIAL
SAINT-GOBAIN C675
FINISH
BLACK- ANODIZED
Dimension
C = heat sink height from bottom of the base to the top of the fin field.
Thermal performance data are provided for reference only. Actual performance may vary
by application.
ATS reserves the right to update or change its products without notice to improve the
design or performance.
Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT400
Contact ATS to learn about custom options available.
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
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