SCSI Bus Controller, CMOS, PQCC44, PLASTIC, LCC-44
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | IXYS |
| Parts packaging code | LCC |
| package instruction | QCCJ, |
| Contacts | 44 |
| Reach Compliance Code | compliant |
| Address bus width | 3 |
| Maximum data transfer rate | 3 MBps |
| Drive interface standards | X3.131 |
| External data bus width | 8 |
| JESD-30 code | S-PQCC-J44 |
| JESD-609 code | e3 |
| length | 16.5862 mm |
| Number of terminals | 44 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Maximum slew rate | 15 mA |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | MATTE TIN |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 40 |
| width | 16.5862 mm |
| uPs/uCs/peripheral integrated circuit type | BUS CONTROLLER, SCSI |
| Base Number Matches | 1 |
| Z53C8003VSG | Z53C8003PSC | Z53C8003PSG | |
|---|---|---|---|
| Description | SCSI Bus Controller, CMOS, PQCC44, PLASTIC, LCC-44 | SCSI Bus Controller, CMOS, PDIP48, PLASTIC, DIP-48 | SCSI Bus Controller, CMOS, PDIP48, PLASTIC, DIP-48 |
| Is it lead-free? | Lead free | Contains lead | Lead free |
| Is it Rohs certified? | conform to | incompatible | conform to |
| Maker | IXYS | IXYS | IXYS |
| Parts packaging code | LCC | DIP | DIP |
| package instruction | QCCJ, | PLASTIC, DIP-48 | PLASTIC, DIP-48 |
| Contacts | 44 | 48 | 48 |
| Reach Compliance Code | compliant | unknow | compli |
| Address bus width | 3 | 3 | 3 |
| Maximum data transfer rate | 3 MBps | 3 MBps | 3 MBps |
| Drive interface standards | X3.131 | X3.131 | X3.131 |
| External data bus width | 8 | 8 | 8 |
| JESD-30 code | S-PQCC-J44 | R-PDIP-T48 | R-PDIP-T48 |
| JESD-609 code | e3 | e0 | e3 |
| length | 16.5862 mm | 62.36 mm | 62.36 mm |
| Number of terminals | 44 | 48 | 48 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | DIP | DIP |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED | 225 |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.57 mm | 4.88 mm | 4.88 mm |
| Maximum slew rate | 15 mA | 15 mA | 15 mA |
| Maximum supply voltage | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | MATTE TIN | Tin/Lead (Sn/Pb) | TIN |
| Terminal form | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | NOT SPECIFIED | 30 |
| width | 16.5862 mm | 15.24 mm | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | BUS CONTROLLER, SCSI | BUS CONTROLLER, SCSI | BUS CONTROLLER, SCSI |
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