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DS31612N

Description
Transceiver, 1-Func, PBGA676, 27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676
CategoryWireless rf/communication    Telecom circuit   
File Size3MB,384 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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DS31612N Overview

Transceiver, 1-Func, PBGA676, 27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676

DS31612N Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMaxim
Parts packaging codeBGA
package instruction27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676
Contacts676
Reach Compliance Codenot_compliant
appATM;SDH;SONET
JESD-30 codeS-PBGA-B676
JESD-609 codee0
length27 mm
Number of functions1
Number of terminals676
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height2.41 mm
Nominal supply voltage1.8 V
surface mountYES
Telecom integrated circuit typesATM/SONET/SDH TRANSCEIVER
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width27 mm
Base Number Matches1
DS3161/DS3162/DS3163/DS3164
Single/Dual/Triple/Quad
ATM/Packet PHYs for DS3/E3/STS-1
www.maxim-ic.com
GENERAL DESCRIPTION
The DS3161, DS3162, DS3163, and DS3164
(DS316x)
integrate ATM
cell/HDLC
packet
processor(s) with DS3/E3 framer(s) to map/demap
ATM cells or packets into as many as four DS3/E3
digital lines with DS3-framed, E3-framed, or clear-
channel data streams on per-port basis.
FUNCTIONAL DIAGRAM
APPLICATIONS
Access Concentrators
SONET/SDH ADM
SONET/SDH Muxes
PBXs
Digital Cross Connect
Test Equipment
Routers and Switches
Integrated Access
Device (IAD)
Multiservice Access
Platform (MSAP)
Multiservice Protocol
Platform (MSPP)
ATM and Frame Relay
Equipment
PDH Multiplexer/
Demultiplexer
DS3/E3 LINE
INTERFACE
DS3/E3
FRAMER/
FORMATTER
CELL/
PACKET
PROCESSOR
POS-PHY
or
UTOPIA
SYSTEM
INTERFACE
DS316x
FEATURES
Single (DS3161), Dual (DS3162), Triple
(DS3163), or Quad (DS3164) ATM/Packet PHYs
for DS3, E3, and Clear-Channel 52Mbps (CC52)
Pin Compatible for Ease of Port Density
Migration in the Same PC Board Platform
Each Port Independently Configurable
Universal PHYs Map ATM Cells and/or HDLC
Packets into DS3 or E3 Data Streams
UTOPIA L2/L3 or POS-PHY™ L2/L3 or SPI-3
Interface with 8-, 16-, or 32-Bit Bus Width
66MHz UTOPIA L3 and POS-PHY L3 Clock
52MHz UTOPIA L2 and POS-PHY L2 Clock
Ports Independently Configurable for Cell or
Packet Traffic in POS-PHY Bus Modes
Direct, PLCP, DSS, and Clear-Channel Cell
Mapping
Direct and Clear-Channel Packet Mapping
On-Chip DS3 (M23 or C-Bit) and E3 (G.751 or
G.832) Framer(s)
Ports Independently Configurable for DS3, E3
(Full or Subrate) or Arbitrary Framing Protocols
Up to 52Mbps
Programmable (Externally Controlled or
Internally Finite State Machine Controlled)
Subrate DS3/E3
ORDERING INFORMATION
PART
DS3161
DS3161N
DS3162
DS3162N
DS3163
DS3163N
DS3164
DS3164N
TEMP RANGE
0°C to +70°C
-40°C to +85°C
0°C to +70°C
-40°C to +85°C
0°C to +70°C
-40°C to +85°C
0°C to +70°C
-40°C to +85°C
PIN-PACKAGE
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
Note:
Add the “+” suffix for the lead-free package option.
POS-PHY and POS-PHY Level 3 are trademarks of PMC-Sierra, Inc.
Note:
Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, click here:
www.maxim-ic.com/errata.
1
REV: 113006

DS31612N Related Products

DS31612N DS31612
Description Transceiver, 1-Func, PBGA676, 27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676 Transceiver, 1-Func, PBGA676, 27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker Maxim Maxim
Parts packaging code BGA BGA
package instruction 27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676 27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676
Contacts 676 676
Reach Compliance Code not_compliant not_compliant
app ATM;SDH;SONET ATM;SDH;SONET
JESD-30 code S-PBGA-B676 S-PBGA-B676
JESD-609 code e0 e0
length 27 mm 27 mm
Number of functions 1 1
Number of terminals 676 676
Maximum operating temperature 85 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Package shape SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 225 225
Certification status Not Qualified Not Qualified
Maximum seat height 2.41 mm 2.41 mm
Nominal supply voltage 1.8 V 1.8 V
surface mount YES YES
Telecom integrated circuit types ATM/SONET/SDH TRANSCEIVER ATM/SONET/SDH TRANSCEIVER
Temperature level INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 27 mm 27 mm
Base Number Matches 1 1
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