High Performance BGA Cooling
Solutions w/ superGRIP™ Attachment
ATS PART # ATS-X50230B-C1-R0
Features & Benefits
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Designed for 23 x 23 mm BGA components
requires minimal space around the component’s
perimeter; ideal for densely populated PCBs
Allows the heat sink to be detached and reattached
without damaging the component or the PCB, an important
feature in the event a PCB may need to be reworked
Strong, uniform attachment force helps achieve maximum
performance from phase-changing TIMs
Eliminates the need to drill mounting holes in the PCB
Assembly comes standard with a high performance
maxiFLOW™ heat sink which maximizes convection (air)
cooling
Comes standard with clean break, reworkable, Chomerics
T-766 phase change material
FT
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W
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L
H
thermal Performance
AIR VELoCITy
*Image above is for illustration purposes only.
THERMAL RESISTANCE
FT/MIN
200
300
400
500
600
700
800
M/S
1.0
1.5
2.0
2.5
3.0
3.5
4.0
°C/W (UNDUCTED FLOW)
10.9
8.7
7.5
6.7
6.2
5.7
5.3
°C/W (DUCTED FLOW)
8.3
Product Details
LENGTH
23 mm
Notes:
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Length and width dimensions refer to the size of the component. Dimensions of the heat
sink are subject to tolerances of up to .99 mm in order to accommodate the clip assembly
Thermal performance data are provided for reference only. Actual performance may vary
by application
ATS reserves the right to update or change its products without notice to improve the
design or performance
Additional tooling fees may be required
Typical lead time is a minimum of 4-6 weeks
Contact ATS to learn about custom options available
WIDTH
23 mm
HEIGHT
7.5 mm
FIN TIP to FIN TIP
37.5 mm
INTERFACE MATERIAL
FINISH
BLUE-ANODIZED
ChOMErICS T766
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
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