WS1M32-17H2MA datasheet, PDF - EEWORLD Datasheet

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WS1M32-17H2MA: DescriptionSRAM Module, 1MX32, 17ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66; Categorystorage storage; File Size329KB，8 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WS1M32-17H2MA Overview

SRAM Module, 1MX32, 17ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

WS1M32-17H2MA Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Microsemi
Parts packaging code	PGA
package instruction	1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Contacts	66
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	17 ns
Other features	USER CONFIGURABLE AS 2M X 16 OR 4M X 8
JESD-30 code	S-CPGA-P66
JESD-609 code	e0
length	35.2 mm
memory density	33554432 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	66
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1MX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.7 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	35.2 mm
Base Number Matches	1

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White Electronic Designs

1Mx32 SRAM MODULE

FEATURES

Access Times of 17, 20, 25ns

Packaging

• 84 lead, 28mm CQFP, (Package 511)

• 66 pin PGA Type, 1.385" sq., Hermetic Ceramic

HIP (Package 402)*

Organized as two banks of 512Kx32, User

Conﬁgurable as 2Mx16 or 4Mx8

Commercial, Industrial and Military Temperature

Ranges

WS1M32-XXX

TTL Compatible Inputs and Outputs

5V Power Supply

Low Power CMOS

Built-in Decoupling Caps and Multiple Ground Pins

for Low Noise Operation

Weight

• WS1M32-XH2X* - 13 grams (typical)

• WS1M32-XG3X - 20 grams (typical)

* Package to be developed.

This product is subject to change without notice.

PIN CONFIGURATION FOR WS1M32-XH2X*

TOP VIEW

I/O8

I/O9

I/O10

A13

A14

A15

A16

A17

I/O0

I/O1

I/O2

WE#2

OE#2

GND

I/O11

A10

A11

A12

VCC

CS#1

I/O3

I/O15

I/O14

I/O13

I/O12

OE#1

A18

WE#1

I/O7

I/O6

I/O5

I/O4

I/O24

I/O25

I/O26

CS#2

I/O16

I/O17

I/O18

VCC

OE#4

WE#4

I/O27

WE#3

OE#3

GND

I/O19

I/O31

I/O30

I/O29

I/O28

I/O23

I/O22

I/O21

I/O20

CS#2

I/O0-7

I/O8-15

I/O16-23

I/O24-31

OE#

CS#1

A0-18

PIN DESCRIPTION

I/O

0-31

0-18

WE#

1-4

CS#

1-2

OE#

1-4

GND

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

Output Enable

Power Supply

Ground

Not Connected

BLOCK DIAGRAM

WE#1

WE#2

WE#3

WE#4

512K x

x 8

512K x 8

512K x

x 8

512K x 8

512K x

x 8

512K

512K x 8

Note: CS#

& CS#

are used as bank select

White Electronic Designs Corp. reserves the right to change products or speciﬁcations without notice.

July, 2002

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

Rev. 4

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