M5M27C202P-C12 datasheet, PDF - EEWORLD Datasheet

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M5M27C202P-C12: DescriptionOTP ROM, 128KX16, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40; Categorystorage storage; File Size289KB，10 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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M5M27C202P-C12 Overview

OTP ROM, 128KX16, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40

M5M27C202P-C12 Parametric

Parameter Name	Attribute value
Maker	Mitsubishi
Parts packaging code	DIP
package instruction	DIP,
Contacts	40
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	120 ns
Other features	PAGE WRITE
JESD-30 code	R-PDIP-T40
length	52 mm
memory density	2097152 bit
Memory IC Type	OTP ROM
memory width	16
Number of functions	1
Number of terminals	40
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX16
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.5 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

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M5M27C202P-C12 Related Products

	M5M27C202P-C12	M5M27C202P-C15	M5M27C202FP-C15	M5M27C202RV-C12	M5M27C202RV-C15	M5M27C202FP-C12	M5M27C202VP-C12	M5M27C202J-C12	M5M27C202VP-C15	M5M27C202J-C15
Description	OTP ROM, 128KX16, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40	OTP ROM, 128KX16, 150ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40	OTP ROM, 128KX16, 150ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40	OTP ROM, 128KX16, 120ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, REVERSE, TSOP-40	OTP ROM, 128KX16, 150ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, REVERSE, TSOP-40	OTP ROM, 128KX16, 120ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40	OTP ROM, 128KX16, 120ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, TSOP-40	OTP ROM, 128KX16, 120ns, CMOS, PQCC44, PLASTIC, LCC-44	OTP ROM, 128KX16, 150ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, TSOP-40	OTP ROM, 128KX16, 150ns, CMOS, PQCC44, PLASTIC, LCC-44
Maker	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi
Parts packaging code	DIP	DIP	SOIC	TSOP	TSOP	SOIC	TSOP	LCC	TSOP	LCC
package instruction	DIP,	DIP,	SOP,	TSOP1-R,	TSOP1-R,	SOP,	TSOP1,	QCCJ,	TSOP1,	QCCJ,
Contacts	40	40	40	40	40	40	40	44	40	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	120 ns	150 ns	150 ns	120 ns	150 ns	120 ns	120 ns	120 ns	150 ns	150 ns
Other features	PAGE WRITE	PAGE WRITE	PAGE WRITE	PAGE WRITE	PAGE WRITE	PAGE WRITE	PAGE WRITE	PAGE WRITE	PAGE WRITE	PAGE WRITE
JESD-30 code	R-PDIP-T40	R-PDIP-T40	R-PDSO-G40	R-PDSO-G40	R-PDSO-G40	R-PDSO-G40	R-PDSO-G40	S-PQCC-J44	R-PDSO-G40	S-PQCC-J44
length	52 mm	52 mm	26.67 mm	12.4 mm	12.4 mm	26.67 mm	12.4 mm	16.585 mm	12.4 mm	16.585 mm
memory density	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	16	16	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	40	40	40	40	40	40	40	44	40	44
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	TSOP1-R	TSOP1-R	SOP	TSOP1	QCCJ	TSOP1	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.5 mm	5.5 mm	3.05 mm	1.2 mm	1.2 mm	3.05 mm	1.2 mm	4.57 mm	1.2 mm	4.57 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	J BEND	GULL WING	J BEND
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	0.5 mm	0.5 mm	1.27 mm	0.5 mm	1.27 mm	0.5 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL	QUAD
width	15.24 mm	15.24 mm	11.4 mm	10 mm	10 mm	11.4 mm	10 mm	16.585 mm	10 mm	16.585 mm

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