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APT36GA60SD15

Description
High Speed PT IGBT
CategoryDiscrete semiconductor    The transistor   
File Size239KB,9 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
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APT36GA60SD15 Overview

High Speed PT IGBT

APT36GA60SD15 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
Parts packaging codeD2PAK
package instructionSMALL OUTLINE, R-PSSO-G2
Contacts3
Reach Compliance Codecompli
Other featuresLOW CONDUCTION LOSS
Shell connectionCOLLECTOR
Maximum collector current (IC)65 A
Collector-emitter maximum voltage600 V
ConfigurationSINGLE WITH BUILT-IN DIODE
Gate emitter threshold voltage maximum6 V
Gate-emitter maximum voltage30 V
JESD-30 codeR-PSSO-G2
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)290 W
Certification statusNot Qualified
surface mountYES
Terminal formGULL WING
Terminal locationSINGLE
transistor applicationsPOWER CONTROL
Transistor component materialsSILICON
Nominal off time (toff)262 ns
Nominal on time (ton)29 ns
APT36GA60BD15
APT36GA60SD15
600V
High Speed PT IGBT
TO
APT36GA60SD15
POWER MOS 8
®
is a high speed Punch-Through switch-mode IGBT. Low E
off
is
-2
47
achieved through leading technology silicon design and lifetime control processes. A
D
3
PAK
reduced E
off
- V
CE(ON)
tradeoff results in superior efficiency compared to other IGBT
technologies. Low gate charge and a greatly reduced ratio of C
res
/C
ies
provide excel-
lent noise immunity, short delay times and simple gate drive. The intrinsic chip gate
resistance and capacitance of the poly-silicone gate structure help control di/dt during
APT36GA60BD15
switching, resulting in low EMI, even when switching at high frequency.
Combi (IGBT and Diode)
FEATURES
• Fast switching with low EMI
• Very Low E
off
for maximum efficiency
• Ultra low C
res
for improved noise immunity
• Low conduction loss
• Low gate charge
• Increased intrinsic gate resistance for low EMI
• RoHS compliant
TYPICAL APPLICATIONS
• ZVS phase shifted and other full bridge
• Half bridge
• High power PFC boost
• Welding
• UPS, solar, and other inverters
• High frequency, high efficiency industrial
Absolute Maximum Ratings
Symbol
V
ces
I
C1
I
C2
I
CM
V
GE
P
D
SSOA
T
J
, T
STG
T
L
Parameter
Collector Emitter Voltage
Continuous Collector Current @ T
C
= 25°C
Continuous Collector Current @ T
C
= 100°C
Pulsed Collector Current
1
Gate-Emitter Voltage
2
Total Power Dissipation @ T
C
= 25°C
Switching Safe Operating Area @ T
J
= 150°C
Operating and Storage Junction Temperature Range
Lead Temperature for Soldering: 0.063" from Case for 10 Seconds
Ratings
600
65
36
109
±30
290
109A @ 600V
-55 to 150
300
Unit
V
A
V
W
°C
Static Characteristics
Symbol
V
BR(CES)
V
CE(on)
V
GE(th)
I
CES
I
GES
T
J
= 25°C unless otherwise specified
Test Conditions
V
GE
= 0V, I
C
= 1.0mA
V
GE
= 15V,
I
C
= 20A
V
CE
= 600V,
V
GE
= 0V
T
J
= 25°C
T
J
= 125°C
3
T
J
= 25°C
T
J
= 125°C
Parameter
Collector-Emitter Breakdown Voltage
Collector-Emitter On Voltage
Gate Emitter Threshold Voltage
Zero Gate Voltage Collector Current
Gate-Emitter Leakage Current
Min
600
Typ
2.0
1.9
4.5
Max
2.5
6
275
3000
±100
Unit
V
V
GE
=V
CE
, I
C
= 1mA
μA
nA
052-6336 Rev C 6- 2009
V
GS
= ±30V
Microsemi Website - http://www.microsemi.com

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