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APT54GA60SD30

Description
High Speed PT IGBT
CategoryDiscrete semiconductor    The transistor   
File Size225KB,6 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
Download Datasheet Parametric View All

APT54GA60SD30 Overview

High Speed PT IGBT

APT54GA60SD30 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeD2PAK
package instructionROHS COMPLIANT, D3PAK-3
Contacts3
Reach Compliance Codecompli
Other featuresLOW CONDUCTION LOSS
Shell connectionCOLLECTOR
Maximum collector current (IC)96 A
Collector-emitter maximum voltage600 V
ConfigurationSINGLE WITH BUILT-IN DIODE
Gate emitter threshold voltage maximum6 V
Gate-emitter maximum voltage30 V
JESD-30 codeR-PSSO-G2
JESD-609 codee3
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)245
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)416 W
Certification statusNot Qualified
surface mountYES
Terminal surfacePURE MATTE TIN
Terminal formGULL WING
Terminal locationSINGLE
Maximum time at peak reflow temperature30
transistor applicationsPOWER CONTROL
Transistor component materialsSILICON
Nominal off time (toff)291 ns
Nominal on time (ton)37 ns
Base Number Matches1
APT54GA60B
APT54GA60S
600V
High Speed PT IGBT
POWER MOS 8
®
is a high speed Punch-Through switch-mode IGBT. Low E
off
is achieved
TO
APT54GA60S
-24
7
through leading technology silicon design and lifetime control processes. A reduced E
off
-
D
3
PAK
V
CE(ON)
tradeoff results in superior efficiency compared to other IGBT technologies. Low
gate charge and a greatly reduced ratio of C
res
/C
ies
provide excellent noise immunity, short
delay times and simple gate drive. The intrinsic chip gate resistance and capacitance of the
poly-silicone gate structure help control di/dt during switching, resulting in low EMI, even
APT54GA60B
when switching at high frequency.
Single die IGBT
FEATURES
• Fast switching with low EMI
• Very Low E
off
for maximum efficiency
• Ultra low C
res
for improved noise immunity
• Low conduction loss
• Low gate charge
• Increased intrinsic gate resistance for low EMI
• RoHS compliant
TYPICAL APPLICATIONS
• ZVS phase shifted and other full bridge
• Half bridge
• High power PFC boost
• Welding
• UPS, solar, and other inverters
• High frequency, high efficiency industrial
Absolute Maximum Ratings
Symbol
V
ces
I
C1
I
C2
I
CM
V
GE
P
D
SSOA
T
J
, T
STG
T
L
Parameter
Collector Emitter Voltage
Continuous Collector Current @ T
C
= 25°C
Continuous Collector Current @ T
C
= 100°C
Pulsed Collector Current
1
Gate-Emitter Voltage
2
Total Power Dissipation @ T
C
= 25°C
Switching Safe Operating Area @ T
J
= 150°C
Operating and Storage Junction Temperature Range
Lead Temperature for Soldering: 0.063" from Case for 10 Seconds
Ratings
600
96
54
161
±30
416
161A @ 600V
-55 to 150
300
Unit
V
A
V
W
°C
Static Characteristics
Symbol
V
BR(CES)
V
CE(on)
V
GE(th)
I
CES
I
GES
T
J
= 25°C unless otherwise specified
Test Conditions
V
GE
= 0V, I
C
= 1.0mA
V
GE
= 15V,
I
C
= 32A
V
CE
= 600V,
V
GE
= 0V
T
J
= 25°C
T
J
= 125°C
3
T
J
= 25°C
T
J
= 125°C
Parameter
Collector-Emitter Breakdown Voltage
Collector-Emitter On Voltage
Gate Emitter Threshold Voltage
Zero Gate Voltage Collector Current
Gate-Emitter Leakage Current
Min
600
Typ
2.0
1.9
4.5
Max
2.5
6
250
2500
±100
Unit
V
V
GE
=V
CE
, I
C
= 1mA
μA
nA
052-6328 Rev E 6 - 2011
V
GS
= ±30V
Thermal and Mechanical Characteristics
Symbol
R
θJC
W
T
Torque
Characteristic
Junction to Case Thermal Resistance
Package Weight
Mounting Torque (TO-247 Package), 4-40 or M3 screw
Min
-
-
Typ
-
5.9
Max
.3
-
Unit
°C/W
g
in·lbf
10
Microsemi Website - http://www.microsemi.com
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