KM41C4000ALP-10 datasheet, PDF

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KM41C4000ALP-10: DescriptionFast Page DRAM, 4MX1, 100ns, CMOS, PDIP18, PLASTIC, DIP-18; Categorystorage storage; File Size520KB，17 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KM41C4000ALP-10 Overview

Fast Page DRAM, 4MX1, 100ns, CMOS, PDIP18, PLASTIC, DIP-18

KM41C4000ALP-10 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	DIP
package instruction	DIP, DIP18,.3
Contacts	18
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	100 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	SEPARATE
JESD-30 code	R-PDIP-T18
JESD-609 code	e0
length	22.02 mm
memory density	4194304 bit
Memory IC Type	FAST PAGE DRAM
memory width	1
Number of functions	1
Number of ports	1
Number of terminals	18
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX1
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
refresh cycle	1024
Maximum seat height	4.65 mm
self refresh	NO
Maximum standby current	0.0002 A
Maximum slew rate	0.085 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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KM41C4000ALP-10 Related Products

	KM41C4000ALP-10	KM41C4000ALJ-8	KM41C4000ALZ-7	KM41C4000ALJ-7	KM41C4000ALP-8	KM41C4000ALP-7	KM41C4000ALZ-10	KM41C4000ALZ-8	KM41C4000ALJ-10
Description	Fast Page DRAM, 4MX1, 100ns, CMOS, PDIP18, PLASTIC, DIP-18	Fast Page DRAM, 4MX1, 80ns, CMOS, PDSO20, PLASTIC, SOJ-26/20	Fast Page DRAM, 4MX1, 70ns, CMOS, PZIP20, PLASTIC, ZIP-20	Fast Page DRAM, 4MX1, 70ns, CMOS, PDSO20, PLASTIC, SOJ-26/20	Fast Page DRAM, 4MX1, 80ns, CMOS, PDIP18, PLASTIC, DIP-18	Fast Page DRAM, 4MX1, 70ns, CMOS, PDIP18, PLASTIC, DIP-18	Fast Page DRAM, 4MX1, 100ns, CMOS, PZIP20, PLASTIC, ZIP-20	Fast Page DRAM, 4MX1, 80ns, CMOS, PZIP20, PLASTIC, ZIP-20	Fast Page DRAM, 4MX1, 100ns, CMOS, PDSO20, PLASTIC, SOJ-26/20
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	DIP	SOJ	ZIP	SOJ	DIP	DIP	ZIP	ZIP	SOJ
package instruction	DIP, DIP18,.3	SOJ, SOJ20/26,.34	ZIP, ZIP20,.1	SOJ, SOJ20/26,.34	DIP, DIP18,.3	DIP, DIP18,.3	ZIP, ZIP20,.1	ZIP, ZIP20,.1	SOJ, SOJ20/26,.34
Contacts	18	20	20	20	18	18	20	20	20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE
Maximum access time	100 ns	80 ns	70 ns	70 ns	80 ns	70 ns	100 ns	80 ns	100 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-PDIP-T18	R-PDSO-J20	R-PZIP-T20	R-PDSO-J20	R-PDIP-T18	R-PDIP-T18	R-PZIP-T20	R-PZIP-T20	R-PDSO-J20
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	22.02 mm	17.145 mm	26.165 mm	17.145 mm	22.02 mm	22.02 mm	26.165 mm	26.165 mm	17.145 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM
memory width	1	1	1	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	18	20	20	20	18	18	20	20	20
word count	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words
character code	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	4MX1	4MX1	4MX1	4MX1	4MX1	4MX1	4MX1	4MX1	4MX1
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOJ	ZIP	SOJ	DIP	DIP	ZIP	ZIP	SOJ
Encapsulate equivalent code	DIP18,.3	SOJ20/26,.34	ZIP20,.1	SOJ20/26,.34	DIP18,.3	DIP18,.3	ZIP20,.1	ZIP20,.1	SOJ20/26,.34
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	1024	1024	1024	1024	1024	1024	1024	1024	1024
Maximum seat height	4.65 mm	3.68 mm	10.16 mm	3.68 mm	4.65 mm	4.65 mm	10.16 mm	10.16 mm	3.68 mm
self refresh	NO	NO	NO	NO	NO	NO	NO	NO	NO
Maximum standby current	0.0002 A	0.0002 A	0.0002 A	0.0002 A	0.0002 A	0.0002 A	0.0002 A	0.0002 A	0.0002 A
Maximum slew rate	0.085 mA	0.095 mA	0.105 mA	0.105 mA	0.095 mA	0.105 mA	0.085 mA	0.095 mA	0.085 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	YES	NO	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	ZIG-ZAG	DUAL	DUAL	DUAL	ZIG-ZAG	ZIG-ZAG	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	2.96 mm	7.62 mm	7.62 mm	7.62 mm	2.96 mm	2.96 mm	7.62 mm

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