FIFO, 512X8, 6.5ns, Synchronous, CMOS, DIE
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | DIE |
| package instruction | DIE, |
| Contacts | 28 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 6.5 ns |
| period time | 10 ns |
| JESD-30 code | X-XUUC-N28 |
| JESD-609 code | e0 |
| memory density | 4096 bit |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 512 words |
| character code | 512 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512X8 |
| Exportable | YES |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
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