B048F160T24
B048F160M24
V•I
BCM
TM
Bus Converter
• 48 V to 16 V V•I Chip
TM
Converter
• 240 Watt (360 Watt for 1 ms)
• High density – 813 W/in
3
• Small footprint – 210 W/in
2
• Low weight – 0.5 oz (15 g)
• ZVS / ZCS isolated Sine
Amplitude Converter
• Typical efficiency 95%
• 125°C operation (T
J
)
• <1 µs transient response
• 3.5 million hours MTBF
• No output filtering required
Vin = 38 - 55 V
Vout = 12.7 - 18.3 V
Iout = 15 A
K = 1/3
Rout = 40 mΩ max
©
Product Description
The V•I Chip Bus Converter Module is a high efficiency
(>95%), narrow input range Sine Amplitude Converter
(SAC) operating from a 38 to 55 Vdc primary bus to
deliver an isolated 12.7 V to 18.3 V secondary. The BCM
may be used to power non-isolated POL converters or as
an independent 12.7 – 18.3 V source. Due to the fast
response time and low noise of the BCM, the need for
limited life aluminum electrolytic or tantalum capacitors
at the load is reduced—or eliminated—resulting in
savings of board area, materials and total system cost.
The BCM achieves a power density of 813 W/in
3
in a
V•I Chip package compatible with standard pick-and-
place and surface mount assembly process. The V•I Chip
package provides flexible thermal management through
its low junction-to-board and junction-to-case thermal
resistance. Owing to its high conversion efficiency and
safe operating temperature range, the BCM does not
require a discrete heat sink in typical applications. Low
junction-to-case and junction-to-lead thermal
impedances assure low junction temperatures and long
life in the harshest environments.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Operating junction temperature
Storage temperature
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
(1)
Values
-1.0 to 60
100
-0.3 to 7.0
-0.5 to 25
2,250
20
22.5
240
360
225
-40 to 125
-55 to 125
-40 to 125
-65 to 125
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
A
A
W
W
°C
°C
°C
°C
°C
Notes
For 100 ms
Input to output
Continuous
For 1 ms
Continuous
For 1 ms
During reflow MSL 5
T-Grade
M-Grade
T-Grade
M-Grade
Part Numbering
B
Bus Converter
Module
048
Input Voltage
Designator
F
160
Output Voltage
Designator
(=V
OUT
x10)
T
24
Output Power
Designator
(=P
OUT
/10)
Configuration
F = J-lead
T = Through hole
Product Grade Temperatures (°C)
Grade
Storage
Operating (T
J
)
T
-40 to125
-40 to125
M
-65 to 125
-55 to 125
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048F160T24
Rev. 2.5
Page 1 of 12
Specifications
Input
(Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Input voltage range
Input dV/dt
Input undervoltage turn-on
Input undervoltage turn-off
Input overvoltage turn-on
Input overvoltage turn-off
Input quiescent current
Inrush current overshoot
Input current
Input reflected ripple current
No load power dissipation
Internal input capacitance
Internal input inductance
Recommended external input capacitance
V•I Chip Bus Converter Module
Min
38
Typ
48
Max
55
1
37.4
Unit
Vdc
V/µs
Vdc
Vdc
Vdc
Vdc
mA
A
Adc
mA p-p
W
µF
nH
µF
Note
32.0
55.0
59.5
2.6
2.9
5.4
138
4.9
4.0
5
47
6.5
PC low
Using test circuit in Figure 20; See Figure 1
Using test circuit in Figure 20; See Figure 4
200 nH maximum source inductance; See Figure 20
Input Waveforms
Figure 1
— Inrush transient current at full load and 48 Vin with PC enabled
Figure 2
— Output voltage turn-on waveform with PC enabled at full load
and 48 Vin
Figure 3
— Output voltage turn-on waveform with input turn-on at full
load and 48 Vin
Figure 4
— Input reflected ripple current at full load and 48 Vin
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048F160T24
Rev. 2.5
Page 2 of 12
Specifications
(continued)
V•I Chip Bus Converter Module
Output
(Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Output voltage
Output power
Rated DC current
Peak repetitive power
Current share accuracy
Efficiency
Half load
Full load
Internal output inductance
Internal output capacitance
Load capacitance
Output overvoltage setpoint
Output ripple voltage
No external bypass
10 µF bypass capacitor
Short circuit protection set point
Average short circuit current
Effective switching frequency
Line regulation
K
Load regulation
R
OUT
Transient response
Voltage overshoot
Response time
Recovery time
Output overshoot
Input turn-on
PC enable
Output turn-on delay
From application of power
From release of PC pin
5
94.3
94.7
94.9
95.5
1.6
25.4
600
18.3
153
13.4
20.0
3.3
0.3300
0.176
3.6
1/3
29.7
250
200
1
0
0
280
67
3.7
0.3367
40
mΩ
mV
ns
µs
mV
mV
ms
ms
100% load step; See Figures 10 and 11
See Figures 10 and 11
See Figures 10 and 11
No output filter; See Figure 3
No output filter; See Figure 2
No output filter; See Figure 3
No output filter
300
Min
12.7
12.1
0
0
Typ
Max
18.3
17.8
240
20
360
10
Unit
Vdc
Vdc
W
Adc
W
%
%
%
nH
µF
µF
Vdc
mVp-p
mVp-p
Adc
A
MHz
Note
No load
Full load
38 - 55 V
IN
P
OUT
≤
240 W
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
See Parallel Operation on Page 10
See Figure 5
See Figure 5
Effective value
Module will shut down
See Figures 7 and 9
See Figure 8
Module will shut down
Fixed, 1.8 MHz per phase
V
OUT
= K•V
IN
at no load
Output Waveforms
Efficiency vs. Output Power
98
96
12
Power Dissipation
Power Dissipation (W)
10
8
6
4
2
Efficiency (%)
94
92
90
88
86
0
24
48
72
96
120
144
168
192
216
240
0
24
48
72
96
120
144
168
192
216
240
Output Power (W)
Figure 5
— Efficiency vs. output power
Output Power (W)
Figure 6
— Power dissipation as a function of output power
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048F160T24
Rev. 2.5
Page 3 of 12
Specifications
(continued)
V•I Chip Bus Converter Module
Figure 7
— Output voltage ripple at full load and 48 Vin without any
external bypass capacitor.
Figure 8
— Output voltage ripple at full load and 48 Vin with 10 µF ceramic
external bypass capacitor and 20 nH of distribution inductance.
Ripple vs. Output Power
160
Output Ripple (mVpk-pk)
140
120
100
80
60
40
0
24
48
72
96
120
144
168
192
216
240
Output Power (W)
Figure 9
— Output voltage ripple vs. output power at 48 Vin without any
external bypass capacitor.
Figure 10
— 0 -15 A load step with 100 µF input capacitor and no
output capacitor.
Figure 11
— 15- 0 A load step with 100 µF input capacitor and no
output capacitor.
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048F160T24
Rev. 2.5
Page 4 of 12
Specifications
General
Parameter
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals
(continued)
V•I Chip Bus Converter Module
Min
Typ
3.5
Max
Unit
Mhrs
Vdc
pF
MΩ
Note
25°C, GB
Input to output
Input to output
Input to output
UL /CSA 60950-1, EN 60950-1
Low voltage directive
See Mechanical Drawings, Figures 15 – 18
2,250
3,000
10
cTÜVus
CE Mark
RoHS
0.53/15
1.28/ 32,5
0.87 / 22
0.265 / 6,73
125
130
9.3
1.1
2.1
135
Mechanical
Weight
Dimensions
Length
Width
Height
Thermal
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance (R
θJC
)
Junction-to-board thermal impedance (R
θJB
)
oz /g
in / mm
in / mm
in / mm
°C
Ws /°C
°C / W
°C / W
Junction temperature
Auxiliary Pins
(Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Primary control (PC)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Enable delay time
Disable delay time
2.4
4.8
2.4
5.0
2.5
2.5
2.5
67
30
2.6
2.9
5.2
Vdc
Vdc
Vdc
mA
ms
µs
See Figure 12, time from PC low to output low
Source only
Min
Typ
Max
Unit
Note
Figure 12
— V
OUT
at full load vs. PC disable
Figure 13
— PC signal during fault
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048F160T24
Rev. 2.5
Page 5 of 12
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