Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
DD
= 2.7V to 3.6V (MAX11613/MAX11615/MAX11617), V
DD
= 4.5V to 5.5V (MAX11612/MAX11614/MAX11616), V
REF
= 2.048V
(MAX11613/MAX11615/MAX11617), V
REF
= 4.096V (MAX11612/MAX11614/MAX11616), f
SCL
= 1.7MHz, T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at T
A
= +25°C, see Tables 1–5 for programming notation.) (Note 1)
PARAMETER
DC ACCURACY (Note 2)
Resolution
Relative Accuracy
Differential Nonlinearity
Offset Error
Offset-Error Temperature
Coefficient
Gain Error
Gain-Temperature Coefficient
Channel-to-Channel Offset
Matching
Channel-to-Channel Gain
Matching
DYNAMIC PERFORMANCE (f
IN(SINE-WAVE)
= 10kHz, V
IN(P-P)
= V
REF
, f
SAMPLE
= 94.4ksps)
Signal-to-Noise Plus Distortion
Total Harmonic Distortion
Spurious-Free Dynamic Range
Full-Power Bandwidth
Full-Linear Bandwidth
CONVERSION RATE
Conversion Time (Note 5)
t
CONV
Internal clock
External clock
10.6
7.5
µs
SINAD
THD
SFDR
SINAD > 68dB
-3dB point
Up to the 5th harmonic
70
-78
78
3
5
dB
dB
dB
MHz
MHz
Relative to FSR
(Note 4)
Relative to FSR
0.3
±0.1
±0.1
0.3
±4
INL
DNL
(Note 3)
No missing codes over temperature
12
±1
±1
±4
Bits
LSB
LSB
LSB
ppm/°C
LSB
ppm/°C
LSB
LSB
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
2
Maxim Integrated
MAX11612–MAX11617
Low-Power, 4-/8-/12-Channel, I
2
C,
12-Bit ADCs in Ultra-Small Packages
ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= 2.7V to 3.6V (MAX11613/MAX11615/MAX11617), V
DD
= 4.5V to 5.5V (MAX11612/MAX11614/MAX11616), V
REF
= 2.048V
(MAX11613/MAX11615/MAX11617), V
REF
= 4.096V (MAX11612/MAX11614/MAX11616), f
SCL
= 1.7MHz, T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at T
A
= +25°C, see Tables 1–5 for programming notation.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
Internal clock, SCAN[1:0] = 01
Throughput Rate
f
SAMPLE
Internal clock, SCAN[1:0] = 00
CS[3:0] = 1011 (MAX11616/MAX11617)
External clock
Track/Hold Acquisition Time
Internal Clock Frequency
Aperture Delay (Note 6)
ANALOG INPUT (AIN0–AIN11)
Input-Voltage Range, Single-
Ended and Differential (Note 7)
Input Multiplexer Leakage Current
Input Capacitance
INTERNAL REFERENCE (Note 8)
Reference Voltage
Reference-Voltage Temperature
Coefficient
REF Short-Circuit Current
REF Source Impedance
EXTERNAL REFERENCE
REF Input-Voltage Range
REF Input Current
Input-High Voltage
Input-Low Voltage
Input Hysteresis
Input Current
Input Capacitance
Output Low Voltage
V
REF
I
REF
V
IH
V
IL
V
HYST
I
IN
C
IN
V
OL
I
SINK
= 3mA
V
IN
= 0 to V
DD
15
0.4
0.1 x V
DD
±10
(Note 9)
f
SAMPLE
= 94.4ksps
0.7 x V
DD
0.3 x V
DD
1
V
DD
40
V
µA
V
V
V
µA
pF
V
1.5
V
REF
TCV
REF
T
A
= +25°C
MAX11613/MAX11615/MAX11617
MAX11612/MAX11614/MAX11616
1.968
3.936
2.048
4.096
25
2
2.128
4.256
V
ppm/°C
mA
kΩ
C
IN
Unipolar
Bipolar
ON/OFF leakage current, V
AIN
_ = 0 or V
DD
0
0
±0.01
22
V
REF
±V
REF
/2
±1
V
µA
pF
t
AD
External clock, fast mode
External clock, high-speed mode
800
2.8
60
30
MIN
TYP
51
51
94.4
ns
MHz
ns
ksps
MAX
UNITS
DIGITAL INPUTS/OUTPUTS (SCL, SDA)
Maxim Integrated
3
MAX11612–MAX11617
Low-Power, 4-/8-/12-Channel, I
2
C,
12-Bit ADCs in Ultra-Small Packages
ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= 2.7V to 3.6V (MAX11613/MAX11615/MAX11617), V
DD
= 4.5V to 5.5V (MAX11612/MAX11614/MAX11616), V
REF
= 2.048V
(MAX11613/MAX11615/MAX11617), V
REF
= 4.096V (MAX11612/MAX11614/MAX11616), f
SCL
= 1.7MHz, T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at T
A
= +25°C, see Tables 1–5 for programming notation.) (Note 1)
PARAMETER
POWER REQUIREMENTS
Supply Voltage
V
DD
MAX11613/MAX11615/MAX11617
MAX11612/MAX11614/MAX11616
f
SAMPLE
= 94.4ksps
external clock
f
SAMPLE
= 40ksps
internal clock
Supply Current
I
DD
f
SAMPLE
= 10ksps
internal clock
f
SAMPLE
=1ksps
internal clock
Power-Supply Rejection Ratio
PSRR
Full-scale input (Note 10)
Internal reference
External reference
Internal reference
External reference
Internal reference
External reference
Internal reference
External reference
2.7
4.5
900
670
530
230
380
60
330
6
0.5
±0.5
10
±2.0
LSB/V
µA
3.6
5.5
1150
900
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Shutdown (internal REF off)
TIMING CHARACTERISTICS (Figure 1)
(V
DD
= 2.7V to 3.6V (MAX11613/MAX11615/MAX11617), V
DD
= 4.5V to 5.5V (MAX11612/MAX11614/MAX11616), V
REF
= 2.048V
(MAX11613/MAX11615/MAX11617), V
REF
= 4.096V (MAX11612/MAX11614/MAX11616), f
SCL
= 1.7MHz, T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at T
A
= +25°C, see Tables 1–5 for programming notation.) (Note 1)
PARAMETER
Serial-Clock Frequency
Bus Free Time Between a STOP (P)
and a START (S) Condition
Hold Time for START (S) Condition
Low Period of the SCL Clock
High Period of the SCL Clock
Setup Time for a Repeated START
Condition (Sr)
Data Hold Time (Note 11)
Data Setup Time
Rise Time of Both SDA and SCL
Signals, Receiving
Fall Time of SDA Transmitting
Setup Time for STOP (P) Condition
Capacitive Load for Each Bus Line
Pulse Width of Spike Suppressed
SYMBOL
f
SCL
t
BUF
t
HD, STA
t
LOW
t
HIGH
t
SU, STA
t
HD, DAT
t
SU, DAT
t
R
t
F
t
SU, STO
C
B
t
SP
Measured from 0.3V
DD
- 0.7V
DD
Measured from 0.3V
DD
- 0.7V
DD
(Note 12)
1.3
0.6
1.3
0.6
0.6
0
100
20 + 0.1C
B
20 + 0.1C
B
0.6
400
50
300
300
900
CONDITIONS
MIN
TYP
MAX
400
UNITS
kHz
µs
µs
µs
µs
µs
ns
ns
ns
ns
µs
pF
ns
TIMING CHARACTERISTICS FOR FAST MODE
4
Maxim Integrated
MAX11612–MAX11617
Low-Power, 4-/8-/12-Channel, I
2
C,
12-Bit ADCs in Ultra-Small Packages
TIMING CHARACTERISTICS (Figure 1) (continued)
(V
DD
= 2.7V to 3.6V (MAX11613/MAX11615/MAX11617), V
DD
= 4.5V to 5.5V (MAX11612/MAX11614/MAX11616), V
REF
= 2.048V
(MAX11613/MAX11615/MAX11617), V
REF
= 4.096V (MAX11612/MAX11614/MAX11616), f
SCL
= 1.7MHz, T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at T
A
= +25°C, see Tables 1–5 for programming notation.) (Note 1)
PARAMETER
Serial-Clock Frequency
Hold Time, Repeated START
Condition (Sr)
Low Period of the SCL Clock
High Period of the SCL Clock
Setup Time for a Repeated START
Condition (Sr)
Data Hold Time
Data Setup Time
Rise Time of SCL Signal
(Current Source Enabled)
Rise Time of SCL Signal After
Acknowledge Bit
Fall Time of SCL Signal
Rise Time of SDA Signal
Fall Time of SDA Signal
Setup Time for STOP (P) Condition
Capacitive Load for Each Bus Line
Pulse Width of Spike Suppressed
SYMBOL
f
SCLH
t
HD, STA
t
LOW
t
HIGH
t
SU
,
STA
t
HD
,
DAT
t
SU
,
DAT
t
RCL
t
RCL1
t
FCL
t
RDA
t
FDA
t
SU
,
STO
C
B
t
SP
(Notes 11 and 14)
0
Measured from 0.3V
DD
- 0.7V
DD
Measured from 0.3V
DD
- 0.7V
DD
Measured from 0.3V
DD
- 0.7V
DD
Measured from 0.3V
DD
- 0.7V
DD
(Note 12)
(Note 11)
(Note 14)
160
320
120
160
0
10
20
20
20
20
20
160
400
10
80
160
80
160
160
150
CONDITIONS
MIN
TYP
MAX
1.7
UNITS
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
pF
ns
TIMING CHARACTERISTICS FOR HIGH-SPEED MODE (C
B
= 400pF, Note 13)
Note 1:
All WLP devices are 100% production tested at T
A
= +25°C. Specifications over temperature limits are guaranteed by
design and characterization.
Note 2:
For DC accuracy, the MAX11612/MAX11614/MAX11616 are tested at V
DD
= 5V and the
MAX11613/MAX11615/MAX11617are tested at V
DD
= 3V. All devices are configured for unipolar, single-ended inputs.
Note 3:
Relative accuracy is the deviation of the analog value at any code from its theoretical value after the full-scale range and
offsets have been calibrated.
Note 4:
Offset nulled.
Note 5:
Conversion time is defined as the number of clock cycles needed for conversion multiplied by the clock period. Conversion
time does not include acquisition time. SCL is the conversion clock in the external clock mode.
Note 6:
A filter on the SDA and SCL inputs suppresses noise spikes and delays the sampling instant.
Note 7:
The absolute input-voltage range for the analog inputs (AIN0–AIN11) is from GND to V
DD
.
Note 8:
When the internal reference is configured to be available at AIN_/REF (SEL[2:1] = 11), decouple AIN_/REF to GND with a
0.1µF capacitor and a 2kΩ series resistor (see the
Typical Operating Circuit).
Note 9:
ADC performance is limited by the converter’s noise floor, typically 300µV
[i=s]This post was last edited by Adventure Warrior on 2022-8-1 00:17[/i]Using my free time on weekends, I can say that the basic functions of the simple board camera have been achieved. The main func...
[i=s]This post was last edited by qwqwqw2088 on 2020-1-17 08:34[/i]Working with electronics inevitably involves contact with transformers, and detecting and judging their quality is one of the necessa...
I have created a blog on NetEase Blog, mainly about microcontrollers and other electronic knowledge. I hope you will visit it and find something useful to you! [url=http://blog.163.com/guojinlong928@1...
I am a beginner in microcontrollers and want to make an electronic clock by myself. I bought two MAX7219s. I can drive one MAX7219, but after cascading the two MAX7219s, I cannot drive the second chip...
Find a post and share it with other technology enthusiasts. Electronic Project Expo Network:http://www.51project.com.cn/Microcontroller Kingdom: http://www.21mcu.com/ Practical Electronic Technology N...
I saw a book that said that when the Avalon bus is performing burst transmission, the master port must set all byteenable signal lines valid during the entire burst transmission period. For the slave ...
The TIA Portal software's shift instructions shift the contents of an accumulator bit by bit to the left or right. The number of bits shifted is determined by N. A left shift of N bits multiplies t...[Details]
There are many different ways of human-computer interaction. The more common ones are listed below:
Mouse interaction: Using a mouse to operate a computer and interact was the most common human...[Details]
On August 24th, Jin Yuzhi, CEO of Huawei's Intelligent Automotive Solutions BU, announced the first automotive application of Huawei Qiankun's unique Limera technology. This technology eliminates t...[Details]
Long ago, the lifespan of cars in my country was 15 years. Once a car reached 15 years old, it was forced to be scrapped. However, the policy was later changed. As long as the car does not exceed 6...[Details]
On August 25th, Apple's expansion in India encountered new troubles. According to Bloomberg, Foxconn Technology Group has recalled approximately 300 Chinese engineers from India, further hindering ...[Details]
On August 21, WeRide officially launched WePilot AiDrive, a one-stage end-to-end assisted driving solution developed in cooperation with Bosch. This comes only half a year after the two parties' "t...[Details]
As the scale and business applications of national e-government networks continue to expand, the data and services transmitted over them are becoming increasingly sensitive and critical. To protect...[Details]
Normally, we determine our location and where we want to go by comparing our surroundings with observation and simple GPS tools. However, this kind of reasoning is very difficult for self-driving c...[Details]
1. Fault phenomenon and cause analysis
1. During the operation of the equipment, the expansion sleeve is subjected to a large torque, and the mating surfaces of the shaft and the sleeve move...[Details]
In the field of communications power supplies, AC/DC rectifier power supplies are called primary power supplies or basic power supplies, while DC/DC converters are called secondary power supplies. ...[Details]
With the increasing popularity of automated equipment, linear modules, a common auxiliary device for automated equipment, have also seen a bright future. In particular, in recent years, many small ...[Details]
Common methods for troubleshooting roller press bearing wear include repair welding, thermal spraying, brush plating, and scrapping and replacement. However, these methods are often subject to asse...[Details]
Batteries, at the core of new energy vehicles, are crucial to vehicle performance and range. Existing automotive batteries are categorized into lead-acid and lithium batteries. Currently, new energ...[Details]
01. Introduction
As in-vehicle networks migrate from the CAN
bus
to
Ethernet
, traditional millisecond-level synchronization accuracy can no longer meet the requirements of mul...[Details]
introduction
The rapid development of science and technology has enabled mankind to quickly move from the Internet era to the big data era. As a result, the amount of data generated by people ...[Details]
Domestic Chip Exchange
京公网安备 11010802033920号
EEWORLD
