IM6653-1IJG/BI datasheet, PDF - EEWORLD Datasheet

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IM6653-1IJG/BI: DescriptionOTP ROM, 1KX4, CMOS, CDIP24; Categorystorage storage; File Size449KB，8 Pages; ManufacturerGeneral Electric Solid State

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IM6653-1IJG/BI Overview

OTP ROM, 1KX4, CMOS, CDIP24

IM6653-1IJG/BI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	General Electric Solid State
package instruction	DIP, DIP24,.6
Reach Compliance Code	unknown
Maximum access time	450 ns
I/O type	COMMON
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
memory density	4096 bit
Memory IC Type	OTP ROM
memory width	4
Number of terminals	24
word count	1024 words
character code	1000
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1KX4
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Maximum standby current	0.00004 A
Maximum slew rate	0.006 mA
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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	IM6653-1IJG/BI	IM6654MJG/B	IM6654AMJG/HR	IM6654-1IJG/BI	IM6653AMJG/HR	IM6653MJG	IM6654AMJG	IM6654AMJG/883C	IM6654AMJG/B	IM6654MJG/883B
Description	OTP ROM, 1KX4, CMOS, CDIP24	OTP ROM, 512X8, CMOS, CDIP24	OTP ROM, 512X8, CMOS, CDIP24	OTP ROM, 512X8, CMOS, CDIP24	OTP ROM, 1KX4, CMOS, CDIP24,	OTP ROM, 1KX4, CMOS, CDIP24,	OTP ROM, 512X8, CMOS, CDIP24,	OTP ROM, 512X8, CMOS, CDIP24	OTP ROM, 512X8, CMOS, CDIP24	OTP ROM, 512X8, CMOS, CDIP24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	General Electric Solid State	General Electric Solid State	General Electric Solid State	General Electric Solid State	General Electric Solid State	General Electric Solid State	General Electric Solid State	General Electric Solid State	General Electric Solid State	General Electric Solid State
package instruction	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow	unknow	unknow	unknow	unknow	unknow
Maximum access time	450 ns	600 ns	350 ns	450 ns	350 ns	600 ns	350 ns	350 ns	350 ns	600 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
memory density	4096 bit	4096 bit	4096 bit	4096 bit	4096 bi	4096 bi	4096 bi	4096 bi	4096 bi	4096 bi
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	8	8	8	4	4	8	8	8	8
Number of terminals	24	24	24	24	24	24	24	24	24	24
word count	1024 words	512 words	512 words	512 words	1024 words	1024 words	512 words	512 words	512 words	512 words
character code	1000	512	512	512	1000	1000	512	512	512	512
Maximum operating temperature	85 °C	125 °C	125 °C	85 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-55 °C	-55 °C	-40 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	1KX4	512X8	512X8	512X8	1KX4	1KX4	512X8	512X8	512X8	512X8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Maximum standby current	0.00004 A	0.00004 A	0.00004 A	0.00004 A	0.00004 A	0.00004 A	0.00004 A	0.00004 A	0.00004 A	0.00004 A
Maximum slew rate	0.006 mA	0.006 mA	0.012 mA	0.006 mA	0.012 mA	0.006 mA	0.012 mA	0.012 mA	0.012 mA	0.006 mA
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
power supply	-	5 V	5/10 V	5 V	-	-	5/10 V	5/10 V	5/10 V	5 V
Certification status	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	-	38535Q/M;38534H;883B	MIL-STD-883 Class B (Modified)	-	MIL-STD-883 Class B (Modified)	-	-	MIL-STD-883 Class C	38535Q/M;38534H;883B	38535Q/M;38534H;883B

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Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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