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AWB7225P8

Description
RF Front End Circuit, ROHS COMPLIANT, PACKAGE-14
CategoryWireless rf/communication    Telecom circuit   
File Size671KB,9 Pages
ManufacturerANADIGICS
Websitehttp://www.anadigics.com
Environmental Compliance
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AWB7225P8 Overview

RF Front End Circuit, ROHS COMPLIANT, PACKAGE-14

AWB7225P8 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerANADIGICS
package instruction,
Reach Compliance Codeunknown
JESD-30 codeS-XDMA-N14
length7 mm
Number of functions1
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
Package shapeSQUARE
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)260
Maximum seat height1.41 mm
Nominal supply voltage4.5 V
surface mountNO
Telecom integrated circuit typesRF FRONT END CIRCUIT
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal pitch1.07 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7 mm
Base Number Matches1
860 - 894 MHz
Small-Cell Power Amplifier Module
FEATURES
InGaP HBT Technology
-47 dBc ACPR @
610
MHz, +27 dBm
29.5 dB Gain
High Efficiency
Low Transistor Junction Temperature
Matched for a 50
System
Low Profile Miniature Surface Mount Package;
RoHS Compliant
Multi-Carrier Capability
AWB7225
PRELIMINARY DATA SHEET - Rev 1.0
APPLICATIONS
LTE, WCDMA, and HSDPA Air Interfaces
Picocell, Femtocell, Home Nodes
Customer Premises Equipment (CPE)
14 Pin 7 mm x 7 mm x 1.3 mm
Surface Mount Module
PRODUCT DESCRIPTION
The AWB7225 is a fully matched, Multi-Chip-Module
(MCM) designed for picocell, femtocell, and customer
premises equipment (CPE) applications. Consisting of
two parallel path high linearity, high efficiency power
amplifiers, the device meets the extremely demanding
needs of small cell infrastructure architectures.
Designed for LTE, WCDMA and HSDPA air interfaces
operating in the 860 MHz to 894 MHz bands, the
AWB7225 delivers up to +27 dBm of LTE (E-TM1.1)
Vcc1
power through an external 90-degree hybrid coupler,
with an ACPR of -47 dBc. The device operates from
a convenient +4.5 V supply and provides 29.5 dB
of RF gain. The AWB7225 is manufactured using
an advanced InGaP HBT MMIC technology offering
state-of-the-art reliability, temperature stability, and
ruggedness. Its 7 mm x 7 mm x 1.3 mm surface
mount package incorporates RF matching networks
optimized for output power, efficiency, and linearity in
a 50
V
system.
Vcc2
RF1 Input
RF Input
Source
90
o
Hybrid
Coupler
(external )
Matching
Network
Matching
Network
RF1 Output
Combined
RF Output
90
o
Hybrid
Coupler
(external )
Bias
Network
Power
Detector
RF2 Input
Matching
Network
Matching
Network
RF2 Output
Bias
Network
Power
Detector
Vref
Detector
Output
Figure 1: Block Diagram
06/2013

AWB7225P8 Related Products

AWB7225P8
Description RF Front End Circuit, ROHS COMPLIANT, PACKAGE-14
Is it Rohs certified? conform to
Maker ANADIGICS
Reach Compliance Code unknown
JESD-30 code S-XDMA-N14
length 7 mm
Number of functions 1
Number of terminals 14
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Package body material UNSPECIFIED
Package shape SQUARE
Package form MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) 260
Maximum seat height 1.41 mm
Nominal supply voltage 4.5 V
surface mount NO
Telecom integrated circuit types RF FRONT END CIRCUIT
Temperature level INDUSTRIAL
Terminal form NO LEAD
Terminal pitch 1.07 mm
Terminal location DUAL
Maximum time at peak reflow temperature NOT SPECIFIED
width 7 mm
Base Number Matches 1
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