3CN00410JJ datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > LED optoelectronic/LED> photoelectric> 3CN00410JJ

3CN00410JJ: DescriptionOptoelectronic Device; CategoryLED optoelectronic/LED photoelectric; File Size78KB，4 Pages; ManufacturerMietec Alcatel

Download Datasheet Parametric View All

3CN00410JJ Overview

Optoelectronic Device

3CN00410JJ Parametric

Parameter Name	Attribute value
Maker	Mietec Alcatel
Reach Compliance Code	unknown
Base Number Matches	1

Preview

Download Datasheet

View All

Alcatel 1905 LMI

Up to 20 mW WDM L-band version for external modulation

CW 1.55 µm Laser Module with optical Isolator

Description

This laser module contains an Alcatel

SLMQW DFB laser and is designed for use

with external modulation optimized for high

power Wavelength Division Multiplexed

(WDM) systems. The module incorporates a

polarization maintaining fiber pigtail,

thermoelectric cooler, precision thermistor,

and optical isolator for stable operation

under all conditions.

Features

•

Optimized for use with LiNbO3 external

modulator

Polarization maintaining fiber pigtail

InGaAsP Distributed FeedBack SLMQW (DFB)

laser

Integral optical isolator

Internal TEC and monitor photodiode

Industry-standard hermetic 14-pin butterfly

package

Ultra long haul DWDM synchronous digital

transmission systems

WDM submarine terminal digital transmission

systems

Instrumentation.

Applications

•

Up to 20 mW output power

Wavelength selection according to

ITU-T G.692 (L-band)

50 GHz spacing available

Optical characteristics

Parameter

Threshold current

Output power

Forward voltage

Laser forward current

Emission wavelength

∆(Emitted-Target)

Wavelength

Laser chip temperature range for tunability

Spectral width

Side mode suppression ratio

Relative Intensity Noise

Photodiode dark current

Wavelength drift vs Tcase

Thermistor resistance

Thermistor temperature coefficient

TEC current

TEC voltage

TE/TM fiber extinction ratio of pigtail

Note :

Symb.

λm

∆λe

Tλ

∆λ

SMSR

RIN

∆λ/∆Tc

Conditions

Twave = 15 to 30 °C

Twave = 15 to 25 °C

Pf, pin 3 & 11

10 mW, pin 3 & 11

20 mW, pin 3 & 11

@Tchip[2]

@10mW [2]

@20mW [2]

CW, Pf, FWHM

10MHz to 10 GHz @ Pf

V = -5 V

Min

Typical

Max

2.5

120

210

See table 1

- 0.1

-140

100

0.5

10.3

-5

1.3

2.5

+0.1

Units

°C

MHz

dB/Hz

pm/°C

k=Ω

%/K

9.7

-3

[1]

All limits start of life (except It, Vt), Tsubmount = 25 °C, Tcase = 25 °C, Pf = 20 mW, monitor bias – 5 V, unless otherwise stated

[1] Tcase = 70° C, Tsubmount = 20 °C, P = 20 mW

[2] Tchip = Tλ

.Tλ

is chip temperature required to meet target wavelength (see table 1)

Absolute maximum ratings

Parameters

Min

Max

Unit

Operating case temperature

-10

°C

Storage temperature

-40

°C

Laser forward current

350

Laser reverse voltage

Photodiode forward current

Photodiode reverse voltage

TEC Voltage

2.8

TEC Current

1.4

Lead soldering time (at 260°C)

Packing Mounting Screw Torque

0.2

[1] Human body model.

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only.

Recommended Resources

Working principle circuit diagram of password electronic switch

Crystal FM Oscillator Circuit

Natural wind timing generator circuit

IGBT drive circuit

Automatic charger circuit with manual trigger function

Telephone analog off-hook circuit

Try DE1-SoC—HPS--FPGA: Let’s take a look at the DE1-SoC—HPS--FPGA tutorial. [/font][/size][/align][align=left][size=5] [font=宋体]This post is not about technology, but just popular science, for entertainment only. I am not h...; 574433742 FPGA/CPLD

Can the pmic button on the MYD-AM335X_J development board be changed to a restart function?: [b]Can the pmic button on the MYD-AM335X_J development board be changed to a reboot function?[/b]...; susu DSP and ARM Processors

I used an SDK to create a dialog project in evc. After uninstalling this SDK and installing another SDK, can this program be compiled directly?: I created a dialog project with one SDK under evc. After uninstalling the SDK and installing another SDK, can the program be compiled directly? How should I deal with it? Should I create a new project...; johnners Embedded System

ESP32S3 ubuntu+vscode environment construction and use internal USB-JTAG (builtin) debugging program: 1. Environment Construction The difficulty of deploying the ESP32 series development environment has always been criticized. The first thing to be criticized is the various deceptive tutorials on the ...; tinnu DigiKey Technology Zone

TFT can be produced by liquid silicon spin coating process: Seiko Epson and JSR have jointly developed a silicon film using liquid coating and inkjet forming processes. The silicon film is a low-temperature polycrystalline silicon TFT (thin film transistor) wi...; leslie PCB Design

SD, TF, MS, M2 card reader chip GL823K-SOP16 datasheet: In many products, we can see products that support SD card, TF card, MS card, M2 card functions. To achieve this function, your main chip must have at least two sets of USB data to provide to the card...; 丘工 Download Centre

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components