CDR32BP8R2BDYS datasheet, PDF - EEWORLD Datasheet

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CDR32BP8R2BDYS: DescriptionCeramic Capacitor, Multilayer, Ceramic, 100V, 6.1% +Tol, 6.1% -Tol, BP, 30ppm/Cel TC, 0.0000082uF, Surface Mount, 1206, CHIP; CategoryPassive components capacitor; File Size970KB，10 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

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CDR32BP8R2BDYS Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 6.1% +Tol, 6.1% -Tol, BP, 30ppm/Cel TC, 0.0000082uF, Surface Mount, 1206, CHIP

CDR32BP8R2BDYS Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	KEMET
package instruction	, 1206
Reach Compliance Code	not_compliant
ECCN code	EAR99
capacitance	0.0000082 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	1.3 mm
JESD-609 code	e3
length	3.2 mm
Manufacturer's serial number	CDR32
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	6.0976%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	TR, 7 INCH
positive tolerance	6.0976%
Rated (DC) voltage (URdc)	100 V
Guideline	MIL-PRF-55681
series	C(SIZE)N
size code	1206
surface mount	YES
Temperature characteristic code	BP
Temperature Coefficient	30ppm/Cel ppm/°C
Terminal surface	Tin (Sn) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
width	1.6 mm
Base Number Matches	1

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CERAMIC CHIP/MIL-PRF-55681

CAPACITOR OUTLINE DRAWINGS

CHIP DIMENSIONS

“SOLDERGUARD I” *

SOLDER

“SOLDERGUARD II”

TINNED

NICKEL

ELECTRODES

SILVER

METALLIZATION

ELECTRODES

NICKEL

SILVER

METALLIZATION

Military Designation - “S” or “U”

KEMET Designation - “H”

Military Designation - “W” or “Y”

KEMET Designation - “C”

DIMENSIONS—MILLIMETERS AND (INCHES)

STYLE

KEMET

SIZE

CODE

MIN.

MAX.

CDR01

CDR02

CDR03

CDR04

CDR05

CDR06

CDR31

CDR32

CDR33

CDR34

CDR35

C0805

C1805

C1808

C1812

C1825

C2225

C0805

C1206

C1210

C1812

C1825

2.03 ±.38 (.080 ±.015)

4.57 ±.38 (.180 ±.015)

+.51

+.020

4.57

.180

–.38

–.015

5.72 ±.51 (.225 ±.020)

2.00 ±.20 (.078 ±.008)

3.20 ±.20 (.125 ±.008)

3.20 ±.25 (.125 ±.010)

4.50 ±.25 (.176 ±.010)

4.50 ±.30 (.176 ±.012)

(

)

1.27 ±.38 (.050 ±.015)

2.03 ±.38 (.080 ±.015)

3.18 ±.38 (.125 ±.015)

+.51

+.020

6.35

.250

–.38

–.015

6.35 ±.51 (.250 ±.020)

1.25 ±.20 (.049 ±.008)

1.60 ±.20 (.062 ±.008)

2.50 ±.25 (.098 ±.010)

3.20 ±.25 (.125 ±.010)

6.40 ±.30 (.250 ±.012)

.56 (.022)

.51 (.020)

1.40 (.055)

2.03 (.080)

1.30 (.051)

1.50 (.059)

.51 ± 0.25 (.020 ±.010)

.50 ± 0.20 (.020 ±.008)

.50 ± 0.25 (.020 ±.010)

.50 ± 0.30 (.020 ±.012)

(

)

Note: For Solderguard I (MIL-C55681 “S” or “U” Endmets), the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following

amounts:

Width/Thickness

Length

CDR01

0.51MM (.020)

0.38MM (.015)

CDR02-06

0.64MM (.025)

0.38MM (.015)

CDR31-35

0.60MM (.023)

0.30MM (.012)

MIL-PRF-55681 PART NUMBER ORDERING INFORMATION

CDR01

B P

101 B K

S M

STYLE & SIZE CODE

STYLE

C — Ceramic

D — Dielectric, Fixed Chip

R — Established Reliability

FAILURE RATE LEVEL

(%/1000 hrs.)

TERMINATION FINISH

S — Solder Coated, Final

(SolderGuard I)

U — Base Metalization—

Barrier Metal—Solder

Coated (SolderGuard I)

W — Base Metalization—

Barrier Metal—Tinned

Tin or (Tin/Lead Alloy)

SolderGuard II

Y — Base Metalization

Barrier Metal—Tinned

(100% Tin) Solderguard II

RATED TEMPERATURE

–55°C to +125°C

DIELECTRICS

P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE

X —± 15%—without voltage

+ 15%, –25%—with voltage

CAPACITANCE

Expressed in picofarads (pF).

First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.

(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)

CAPACITANCE TOLERANCE

±.1 pF ±.25 pF ±.5 pF ±1%

±5%

±10% ±20%

RATED VOLTAGE

A — 50; B — 100

KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS

C 0805

P 101 K

1 G M C*

CERAMIC

SIZE CODE

See Table Above

END METALIZATION

C — SolderGuard II

(100% Sn)

(Military equiv: Y, W)

H — SolderGuard I

(Sn60)

(Military equiv: S, U)

SPECIFICATION

P -MIL-PRF-55681 = CDR01-CDR06

N-MIL-PRF-55681 = CDR31-CDR35

FAILURE RATE

(%/1,000 hrs.)

M — 1.0

P — 0.1

R — 0.01

S — 0.001

CAPACITANCE CODE

Expressed in picofarads (pF).

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 thru 9.9 pF. Example: 2.2 pF –229)

VOLTAGE TEMPERATURE CHARACTERISTIC

Designated by Capacitance

Change Over Temperature Range

G — BP (C0G/NP0) (±30 PPM/°C)

X — BX (±15% Without Voltage

+15% -25% With Voltage)

CAPACITANCE TOLERANCE

.1 pF

.25 pF

.5 pF

10%

20%

VOLTAGE

1 — 100V, 5 — 50V

* Part Number Example: C0805P101K1GMC

(14 digits - no spaces)

Ceramic Surface Mount

M — 1.0

P — 0.1

R — 0.01

S — 0.001

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