OTP ROM, 256KX8, 85ns, CMOS, PDSO32, PLASTIC, TSOP-32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Atmel (Microchip) |
| Parts packaging code | TSOP |
| package instruction | TSOP1, TSSOP32,.8,20 |
| Contacts | 32 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 85 ns |
| Other features | UNREGULATED BATTERY POWER SUPPLY RANGE |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G32 |
| JESD-609 code | e0 |
| length | 18.4 mm |
| memory density | 2097152 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP1 |
| Encapsulate equivalent code | TSSOP32,.8,20 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 3/3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum standby current | 0.00002 A |
| Maximum slew rate | 0.008 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 8 mm |
| Base Number Matches | 1 |
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