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HY57V643220DST-45

Description
Synchronous DRAM, 2MX32, 4.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86
Categorystorage    storage   
File Size109KB,13 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric Compare View All

HY57V643220DST-45 Overview

Synchronous DRAM, 2MX32, 4.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86

HY57V643220DST-45 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSK Hynix
Parts packaging codeTSOP2
package instructionTSOP2, TSSOP86,.46,20
Contacts86
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time4.5 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)222 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeR-PDSO-G86
JESD-609 codee0
length22.238 mm
memory density67108864 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width32
Number of functions1
Number of ports1
Number of terminals86
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSSOP86,.46,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height1.194 mm
self refreshYES
Continuous burst length1,2,4,8,FP
Maximum standby current0.002 A
Maximum slew rate0.29 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm
Base Number Matches1
HY57V643220D(L/S)T(P) Series
4Banks x 512K x 32bits Synchronous DRAM
Document Title
4Bank x 512K x 32bits Synchronous DRAM
Revision History
Revision
No.
0.1
0.2
0.3
0.4
Initial Draft
Removed Preliminary
1. Updated Output Load Capacitance for Access Time Measurement CL = 30pF
in AC OPERATING TEST CONDITION
2. Updated the tolerance zone of the leads and the description of the package
type in PACKAGE DIMENSION
1.Corrected : Lead range tolerance (Page : 13)
History
Draft Date
May. 2004
July 2004
Sep. 2004
Sep. 2005
Remark
Preliminary
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for
use of circuits described. No patent licenses are implied.
Rev. 0.4 / Sep. 2005
1

HY57V643220DST-45 Related Products

HY57V643220DST-45 HY57V643220DTP-45
Description Synchronous DRAM, 2MX32, 4.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 Synchronous DRAM, 2MX32, 4.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, LEAD FREE, TSOP2-86
Is it Rohs certified? incompatible conform to
Maker SK Hynix SK Hynix
Parts packaging code TSOP2 TSOP2
package instruction TSOP2, TSSOP86,.46,20 TSOP2, TSSOP86,.46,20
Contacts 86 86
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 4.5 ns 4.5 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 222 MHz 222 MHz
I/O type COMMON COMMON
interleaved burst length 1,2,4,8 1,2,4,8
JESD-30 code R-PDSO-G86 R-PDSO-G86
JESD-609 code e0 e6
length 22.238 mm 22.238 mm
memory density 67108864 bit 67108864 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 32 32
Number of functions 1 1
Number of ports 1 1
Number of terminals 86 86
word count 2097152 words 2097152 words
character code 2000000 2000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 2MX32 2MX32
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 TSOP2
Encapsulate equivalent code TSSOP86,.46,20 TSSOP86,.46,20
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius) NOT SPECIFIED 260
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
refresh cycle 4096 4096
Maximum seat height 1.194 mm 1.194 mm
self refresh YES YES
Continuous burst length 1,2,4,8,FP 1,2,4,8,FP
Maximum standby current 0.002 A 0.002 A
Maximum slew rate 0.29 mA 0.29 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Bismuth (Sn/Bi)
Terminal form GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED 20
width 10.16 mm 10.16 mm
Base Number Matches 1 1
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