512X8 OTPROM, PQCC28, PLASTIC, LCC-28
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Parts packaging code | QLCC |
| package instruction | QCCJ, LDCC28,.5SQ |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 50 ns |
| JESD-30 code | S-PQCC-J28 |
| JESD-609 code | e0 |
| length | 11.43 mm |
| memory density | 4096 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 512 words |
| character code | 512 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512X8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC28,.5SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Maximum slew rate | 0.185 mA |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 11.43 mm |
| Base Number Matches | 1 |
| DM87SR474V | PTN1010H2341BSTS | DM87SR474N | DM77SR474J | DM77SR474BJ | DM87SR474BVX | DM87SR474VX | DM87SR474BJ | DM87SR474BV | DM87SR474J | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | 512X8 OTPROM, PQCC28, PLASTIC, LCC-28 | Fixed Resistor, Thin Film, 0.5W, 2340ohm, 150V, 0.1% +/-Tol, 50ppm/Cel, Surface Mount, 1010, CHIP | 512X8 OTPROM, PDIP24, PLASTIC, DIP-24 | 512X8 OTPROM, CDIP24, CERAMIC, DIP-24 | IC 512 X 8 OTPROM, CDIP24, CERAMIC, DIP-24, Programmable ROM | 512X8 OTPROM, PQCC28, PLASTIC, LCC-28 | 512X8 OTPROM, PQCC28, PLASTIC, LCC-28 | IC 512 X 8 OTPROM, CDIP24, CERAMIC, DIP-24, Programmable ROM | IC 512 X 8 OTPROM, PQCC28, PLASTIC, LCC-28, Programmable ROM | 512X8 OTPROM, CDIP24, CERAMIC, DIP-24 |
| package instruction | QCCJ, LDCC28,.5SQ | CHIP | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCJ, | QCCJ, | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | compliant | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Number of terminals | 28 | 2 | 24 | 24 | 24 | 28 | 28 | 24 | 28 | 24 |
| Maximum operating temperature | 70 °C | 155 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package form | CHIP CARRIER | SMT | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
| surface mount | YES | YES | NO | NO | NO | YES | YES | NO | YES | NO |
| technology | BIPOLAR | THIN FILM | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Is it lead-free? | Contains lead | - | Contains lead | Contains lead | Contains lead | - | - | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | conform to | incompatible | incompatible | incompatible | - | - | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Parts packaging code | QLCC | - | DIP | DIP | DIP | QLCC | QLCC | DIP | QLCC | DIP |
| Contacts | 28 | - | 24 | 24 | 24 | 28 | 28 | 24 | 28 | 24 |
| Maximum access time | 50 ns | - | 50 ns | 55 ns | 40 ns | - | - | 35 ns | 35 ns | 50 ns |
| JESD-30 code | S-PQCC-J28 | - | R-PDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | S-PQCC-J28 | S-PQCC-J28 | R-GDIP-T24 | S-PQCC-J28 | R-GDIP-T24 |
| JESD-609 code | e0 | - | e0 | e0 | e0 | - | - | e0 | e0 | e0 |
| memory density | 4096 bit | - | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bi |
| Memory IC Type | OTP ROM | - | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| word count | 512 words | - | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| character code | 512 | - | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| Operating mode | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| organize | 512X8 | - | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
| Output characteristics | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCJ | - | DIP | DIP | DIP | QCCJ | QCCJ | DIP | QCCJ | DIP |
| Encapsulate equivalent code | LDCC28,.5SQ | - | DIP24,.3 | DIP24,.3 | DIP24,.3 | - | - | DIP24,.3 | LDCC28,.5SQ | DIP24,.3 |
| Package shape | SQUARE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Parallel/Serial | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.57 mm | - | 5.334 mm | 4.572 mm | 4.572 mm | 4.57 mm | 4.57 mm | 4.572 mm | 4.57 mm | 4.572 mm |
| Maximum slew rate | 0.185 mA | - | 0.185 mA | 0.185 mA | 0.185 mA | - | - | 0.185 mA | 0.185 mA | 0.185 mA |
| Maximum supply voltage (Vsup) | 5.25 V | - | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V | - | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Temperature level | COMMERCIAL | - | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Matte Tin (Sn) - with Nickel (Ni) barrier | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | - | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL | QUAD | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 11.43 mm | - | 15.24 mm | 15.24 mm | 15.24 mm | 11.43 mm | 11.43 mm | 15.24 mm | 11.43 mm | 15.24 mm |
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