EEWORLDEEWORLDEEWORLD

Part Number

Search

SZ-MMBZ5227BLT1G

Description
Zener Diode, 3.6V V(Z), 5%, 0.225W, Silicon, Unidirectional, TO-236AB
CategoryDiscrete semiconductor    diode   
File Size131KB,6 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance
Download Datasheet Parametric View All

SZ-MMBZ5227BLT1G Overview

Zener Diode, 3.6V V(Z), 5%, 0.225W, Silicon, Unidirectional, TO-236AB

SZ-MMBZ5227BLT1G Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerON Semiconductor
package instructionTO-236, 3 PIN
Reach Compliance Codecompliant
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance24 Ω
JEDEC-95 codeTO-236AB
JESD-30 codeR-PDSO-G3
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation0.225 W
GuidelineAEC-Q101
Nominal reference voltage3.6 V
surface mountYES
technologyZENER
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance5%
Working test current20 mA
Base Number Matches1
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
MMBZ52xxBLT1G Series,
SZMMBZ52xxBLT1G Series
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Features
www.onsemi.com
225 mW Rating on FR−4 or FR−5 Board
Zener Voltage Range
2.4 V to 91 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (> 16 KV) per Human Body Model
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
SOT−23
CASE 318
STYLE 8
3
Cathode
1
Anode
MARKING DIAGRAM
xxx
G
G
M
260°C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Total Power Dissipation on FR−5 Board,
(Note 1) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance,
Junction−to−Ambient (Note 1)
Total Power Dissipation on Alumina
Substrate, (Note 2) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance,
Junction−to−Ambient (Note 2)
Junction and Storage
Temperature Range
Symbol
P
D
Max
225
1.8
556
Units
mW
mW/°C
°C/W
xxx
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MMBZ52xxBLT1G
Package
SOT−23
(Pb−Free)
Shipping
3,000 /
Tape & Reel
3,000 /
Tape & Reel
10,000 /
Tape & Reel
10,000 /
Tape & Reel
R
qJA
P
D
SZMMBZ52xxBLT1G SOT−23
(Pb−Free)
MMBZ52xxBLT3G
SOT−23
(Pb−Free)
300
2.4
417
−65
to +150
mW
mW/°C
°C/W
°C
R
qJA
T
J
, T
stg
SZMMBZ52xxBLT3G SOT−23
(Pb−Free)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 X 0.75 X 0.62 in.
2. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
©
Semiconductor Components Industries, LLC, 2001
May, 2020
Rev. 14
1
Publication Order Number:
MMBZ5221BLT1/D
Hiring embedded software engineer
Headhunting position [Hangzhou] Job responsibilities: 1. Software function requirement analysis, design software system solutions according to product requirements and implement them by coding; 2. Col...
ff318421749 Recruitment
The RTC time displayed by uc/gui overlaps, and the next display result of ARM will overwrite the last display result.
Everything else is normal. ADS compilation can pass, AXD can also simulate. The program is cut according to a tested normal program. The problem is: for example, second=20 is displayed at point (x,y)....
audio11 ARM Technology
Looking for stm32 wireless NRF with dual channel ADC program
I'm in urgent need of the source code for wireless transmission with dual-channel ADC based on STM32F103C8BT. I have the program for wireless NRF to USB communication and the program for ADC, but I la...
mahe6562 stm32/stm8
How to make the electric cross slide move?
I would like to ask you: How can the computer output signal (deviation) drive the electric cross slide to move? I don't understand what specific principle is needed. What equipment and devices are nee...
fuhognquan Embedded System
Problems with installing ccs3.3
I downloaded 3.3, but it doesn't work. When I save and launch it, I get this error: Error automatically generating board date file.:The board config file 'extra' has errors in its syntax. Thank you....
zhaohongpeng DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1661  2077  771  1142  2588  34  42  16  23  53 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号