IC,TIMER,BIPOLAR,DIP,8PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | DIP, DIP8,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MC1455P1 | MC1455D | |
|---|---|---|
| Description | IC,TIMER,BIPOLAR,DIP,8PIN,PLASTIC | IC,TIMER,BIPOLAR,SOP,8PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible |
| package instruction | DIP, DIP8,.3 | SOP, SOP8,.25 |
| Reach Compliance Code | unknown | unknown |
| JESD-30 code | R-PDIP-T8 | R-PDSO-G8 |
| JESD-609 code | e0 | e0 |
| Number of terminals | 8 | 8 |
| Maximum operating temperature | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP |
| Encapsulate equivalent code | DIP8,.3 | SOP8,.25 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE |
| power supply | 5/15 V | 5/15 V |
| Certification status | Not Qualified | Not Qualified |
| surface mount | NO | YES |
| technology | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL |
| Base Number Matches | 1 | 1 |
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