CEMENT THERMAL FUSIBLE RESISTORS
Dimension:
Derating Curve:
H
1
Min.
Type
Power
Rating at
70°C
2W
Resistance
Range
0.5Ω ~ 470Ω
W±1
D±1
L±1
H±5
+0.02
d1
d2 ± 0.05
-0.05
0.6
0.75
FWI
FWI
9
10
25
36
* More details, please see pages 77-78.
Temperature coefficient
Short-time overload
Terminal strength
Resistance to soldering heat
Solderability
Load life in humidity
Load life
≥20Ω
± 350PPM/°C; <20Ω ± 400PPM/°C Max.
∆R/R ≤
±(5.0% + 0.05Ω) Max., with no evidence of mechanical damage.
No evidence of mechanical damage.
∆R/R ≤
±(1.0% + 0.05Ω) Max., with no evidence of mechanical damage.
Min. 95% coverage
∆R/R ≤
±(5.0% + 0.05Ω) Max., with no evidence of mechanical damage.
∆R/R ≤
±(5.0% + 0.05Ω) Max., with no evidence of mechanical damage.
THERMAL FUSING POWER FILM FIXED RESISTORS
Dimension (mm):
Derating Curve:
Type
TFRC 2W
Type
TFRC 2W
Power Rating
at 70°C
2W
Ur (V)
250
L (Max.)
17
Resistance
Range
360+360Ω
Ød
1
±0.02
0.7
Resistance
Tolerance
±5%
Ød
2
±0.02
1.0
T.C.R.
(PPM/°C)
T
F
(°C)
91
Ir (A)
10
H (Min.)
7.5
±350
W (Min.)
17
W
1
(Min.)
5
Remark :
T
F
(°C) = Rated Functioning Temperature
Ir (A) = Rated Current
Ur (V) = Rated Voltage
*** other value can be supplied on a case to case basis.
Page 44
2006 - 2007
THERMAL FUSING WIRE-WOUND FIXED RESISTORS
Dimension (mm):
Type
TFR
Power Rating
at 70°C
1W
Resistance
Tolerance
±5%
Resistance
Value
4Ω7
D ± 0.5
5.5
L±1
14
H Min.
12
H
1
Min.
3.5
d ± 0.02
0.53
T
F
(°C)
130
T
H
/ T
C
(°C)
102
T
M
(°C)
180
I
r
(A)
2
U
r
(V)
250
Remark:
T
H
/
T
C
(°C) = Holding Temperature
T
M
(°C) = Max. Temperature Limit
Ordering Procedure: (Ex.: FWI 2W, 5%, 33Ω, B/B)
F
W
FWI0 = FWI
TFR0 =TFR
TFRC = TFRC
I
0
2
W
J
W
3
3
0
B
0
0
Product Type:
Resistance Value:
Wattage:
1W = 1W
2W = 2W
E-24 series: the 1
st
digit to denote
product type:
W
= Wire wound type
P
= Power film type
The 2
nd
and 3
rd
digits are for the
significant figures of the resistance
and the 4
th
digit denotes number of
zeros:
“J” ~ 0.1, “K” ~ 0.01
Ex.
4.7Ω ~
47J, 4.7KΩ
~
472
Tolerance:
J = ±5%
K = ±10%
* More explanation on part no, please see details on pages 79-80.
Packing Type:
B = Bulk in poly - bag
Temperature coefficient
Short time overload
Insulation Resistance
Dielectric withstanding voltage
Terminal strength
Humidity (steady state)
Load life in humidity
Load life
± 400 PPM/°C
Resistance change rate is ± (2% + 0.05Ω) Max. with no evidence of
mechanical damage.
Packing Quantity:
0 = for Bulk/Box packing
Insulation resistance is 20MΩ max. upper with no evidence of mechanical
damage.
No evidence of flashover, mechanical dange, arcing or insulation break down.
with no evidence of mechanical damage.
Special Feature:
0 = Standard product
1 = Non-Inductive
Resistance change rate is ± (3% + 0.05Ω) Max. with no evidence of mechanical damage.
Resistance change rate is ± (5% + 0.05Ω) Max. with no evidence of mechanical damage.
Resistance change rate is ± (5% + 0.05Ω) Max. with no evidence of mechanical damage.
* More details, please see pages 77-78.
2006 - 2007
Page 45
Microcontroller MCU
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